Abstract: A suspension substrate according to the present invention includes: an insulating layer; a spring material layer provided on one face of the insulating layer and having conductivity; and a plurality of wirings provided on the other face of the insulating layer. One wiring includes a head-side wiring part extending from the head portion, and a plurality of division wiring parts respectively bifurcated from the head-side wiring part. The spring material layer includes a spring material main body, and a wiring spring material part separated from the spring material main body, via a groove. A conductive connecting part extending through the insulating layer is provided in the insulating layer. Each of the division wiring parts of the one wiring is connected with the wiring spring material part, via the conductive connecting part.

Abstract: A suspension substrate of the present invention includes an insulating layer, a spring material layer, and a plurality of wirings, wherein one wiring of the plurality of wirings includes a head-side wiring part and a plurality of division wiring parts, respectively bifurcated from the head-side wiring part. The spring material layer includes a spring-material-layer main body, a first spring-material-layer separated body and a second spring-material-layer separated body. The division wiring parts of the one wiring are respectively connected with the first spring-material-layer separated body, via a pair of conductive connection parts, respectively extending through the insulating layer. The first spring-material-layer separated body is located on one side relative to the longitudinal axis, while the second spring-material-layer separated body is located on the other side relative to the longitudinal axis.

Abstract: The present invention provides a substrate for suspension that includes a first structural part including a metal supporting substrate, an insulating layer, a wiring layer, and a cover layer, and a second structural part formed so as to extend continuously from the first structural part and has no metal supporting substrate. A position of an edge of an upper surface of the insulating layer coincides with a position of an edge of the lower surface of the cover layer or the position of the edge of the upper surface of the insulating layer is positioned on a side closer to the wiring layer than to the position of the edge of the lower surface of the cover layer at a boundary region between the first structural part and the second structural part.

Abstract: The present invention provides a substrate for suspension that includes a first structural part including a metal supporting substrate, an insulating layer, a wiring layer, and a cover layer, and a second structural part formed so as to extend continuously from the first structural part and has no metal supporting substrate. A position of an edge of an upper surface of the insulating layer coincides with a position of an edge of the lower surface of the cover layer or the position of the edge of the upper surface of the insulating layer is positioned on a side closer to the wiring layer than to the position of the edge of the lower surface of the cover layer at a boundary region between the first structural part and the second structural part.

Abstract: A suspension circuit board comprises a metal support board, a first insulation layer disposed on the metal support board a conductive layer disposed on the first insulation layer, the conductive layer forming a wire; and a second insulation layer disposed on the first insulation layer and the conductive layer. The suspension circuit board is configured that, upon applying a load in a thickness direction to the conductive layer at a position corresponding to the first insulation opening, F1<F2, when a stress generated in the conductive layer at a position corresponding to a periphery of the first insulation opening is represented as a first stress F1 and a stress generated in the conductive layer at a position corresponding to a periphery of the metal support board opening is represented as a second stress F2.

Abstract: A suspension substrate according to the present invention includes: an insulating layer; a spring material layer provided on one face of the insulating layer and having conductivity; and a plurality of wirings provided on the other face of the insulating layer. One wiring includes a head-side wiring part extending from the head portion, and a plurality of division wiring parts respectively bifurcated from the head-side wiring part. The spring material layer includes a spring material main body, and a wiring spring material part separated from the spring material main body, via a groove. A conductive connecting part extending through the insulating layer is provided in the insulating layer. Each of the division wiring parts of the one wiring is connected with the wiring spring material part, via the conductive connecting part.

Abstract: A suspension substrate according the present invention includes: an insulating layer; a metallic support layer provided on the actuator element's side of the insulating layer. A wiring layer is provided on the other side of the insulating layer. This wiring layer includes a plurality of wirings and a wiring connection section that can be electrically connected with the actuator element via a conductive adhesive. A conductive connection section extending through the insulating layer and configured to connecting the metallic support layer with the wiring connection section of the wiring layer is provided in the connection structure region.

Abstract: The problem of the present invention is to provide a circuit board comprising a shape retention unit capable of thinning while maintaining mechanical strength. The present invention solves the above-mentioned problem by providing a circuit board comprising a metal supporting substrate, a first insulating layer formed on the above-mentioned metal supporting substrate, and a wiring layer formed on the above-mentioned first insulating layer, wherein an open area is formed in the above-mentioned metal supporting substrate, and the circuit board comprises a shape retention unit having a second insulating layer contacting with the above-mentioned metal supporting substrate and a reinforcing layer formed on the above-mentioned second insulating layer, and bridging the above-mentioned metal supporting substrate divided by the above-mentioned open area.

Abstract: A suspension substrate according to the present invention includes: an insulating layer; a spring material layer provided on one face of the insulating layer and having conductivity; and a plurality of wirings provided on the other face of the insulating layer. One wiring includes a head-side wiring part extending from the head portion, and a plurality of division wiring parts respectively bifurcated from the head-side wiring part. The spring material layer includes a spring material main body, and a wiring spring material part separated from the spring material main body, via a groove. A conductive connecting part extending through the insulating layer is provided in the insulating layer. Each of the division wiring parts of the one wiring is connected with the wiring spring material part, via the conductive connecting part.

Abstract: A main object of the present invention is to provide a substrate for suspension which is produced at low costs and can sufficiently attain the prevention of damage by electrostatic discharge and restraint of noises. To attain the object, the present invention provides a substrate for suspension, comprising: a metallic substrate, an insulating layer formed on the metallic formed in substrate and having an opening from which the metallic substrate is exposed, a grounding-wiring layer formed on the insulating layer and arranged near the opening, and a ground terminal formed in the opening and contacting the metallic substrate and the grounding-wiring layer, characterized in that the ground terminal is made of a metal having a melting point of 450° C. or lower.

Abstract: The problem of the present invention is to provide a circuit board comprising a shape retention unit capable of thinning while maintaining mechanical strength. The present invention solves the above-mentioned problem by providing a circuit board comprising a metal supporting substrate, a first insulating layer formed on the above-mentioned metal supporting substrate, and a wiring layer formed on the above-mentioned first insulating layer, wherein an open area is formed in the above-mentioned metal supporting substrate, and the circuit board comprises a shape retention unit having a second insulating layer contacting with the above-mentioned metal supporting substrate and a reinforcing layer formed on the above-mentioned second insulating layer, and bridging the above-mentioned metal supporting substrate divided by the above-mentioned open area.

Abstract: A suspension circuit board 1 comprises a metal support board 12, a first insulation layer 11 disposed on the metal support board 12, a conductive layer 10 disposed on the first insulation layer 11, the conductive layer 11 forming a wire; and a second insulation layer 13 disposed on the first insulation layer 11 and the conductive layer 10. The suspension circuit board 1 is configured that, upon applying a load in a thickness direction to the conductive layer at a position corresponding to the first insulation opening, F1<F2, when a stress generated in the conductive layer at a position corresponding to a periphery of the first insulation opening is represented as a first stress F1 and a stress generated in the conductive layer at a position corresponding to a periphery of a metal support board opening is represented as a second stress F2.

Abstract: A suspension substrate of the present invention includes an insulating layer, a spring material layer, and a plurality of wirings, wherein one wiring of the plurality of wirings includes a head-side wiring part and a plurality of division wiring parts, respectively bifurcated from the head-side wiring part. The spring material layer includes a spring-material-layer main body, a first spring-material-layer separated body and a second spring-material-layer separated body. The division wiring parts of the one wiring are respectively connected with the first spring-material-layer separated body, via a pair of conductive connection parts, respectively extending through the insulating layer. The first spring-material-layer separated body is located on one side relative to the longitudinal axis, while the second spring-material-layer separated body is located on the other side relative to the longitudinal axis.

Abstract: A suspension substrate according the present invention includes: an insulating layer; a metallic support layer provided on the actuator element's side of the insulating layer. A wiring layer is provided on the other side of the insulating layer. This wiring layer includes a plurality of wirings and a wiring connection section that can be electrically connected with the actuator element via a conductive adhesive. A conductive connection section extending through the insulating layer and configured to connecting the metallic support layer with the wiring connection section of the wiring layer is provided in the connection structure region.

Abstract: A main object of the present invention is to provide a substrate for suspension which is produced at low costs and can sufficiently attain the prevention of damage by electrostatic discharge and restraint of noises. To attain the object, the present invention provides a substrate for suspension, comprising: a metallic substrate, an insulating layer formed on the metallic formed in substrate and having an opening from which the metallic substrate is exposed, a grounding-wiring layer formed on the insulating layer and arranged near the opening, and a ground terminal formed in the opening and contacting the metallic substrate and the grounding-wiring layer, characterized in that the ground terminal is made of a metal having a melting point of 450° C. or lower.

Abstract: It is an object of the present invention to provide a substrate for suspension reduced in the generation of cracks in an insulating layer at the boundary region between a region where a metal supporting substrate exists and a region where no metal supporting substrate exist.

Abstract: A suspension substrate according to the present invention includes: an insulating layer; a spring material layer provided on one face of the insulating layer and having conductivity; and a plurality of wirings provided on the other face of the insulating layer. One wiring includes a head-side wiring part extending from the head portion, and a plurality of division wiring parts respectively bifurcated from the head-side wiring part. The spring material layer includes a spring material main body, and a wiring spring material part separated from the spring material main body, via a groove. A conductive connecting part extending through the insulating layer is provided in the insulating layer. Each of the division wiring parts of the one wiring is connected with the wiring spring material part, via the conductive connecting part.

Abstract: A substrate for suspension which is produced at low costs and can sufficiently attain the prevention of damage by electrostatic discharge and restraint of noises. The substrate for suspension includes: a metallic substrate, an insulating layer formed on the metallic substrate and having an opening from which the metallic substrate is exposed, a grounding-wiring layer formed on the insulating layer and arranged near the opening, and a ground terminal formed in the opening and contacting the metallic substrate and the grounding-wiring layer. The ground terminal is made of a metal having a melting point of 450° C. or lower.

Abstract: A substrate for suspension 10 comprises a metallic substrate 1, an insulating layer 2 formed on the metallic substrate 1, a conductor layer 3 formed on the insulating layer 2, and a cover layer 4 covering the conductor layer 3. The insulating layer 2 and the cover layer 4 are formed from different materials, whose coefficients of hygroscopic expansion are in the range between 3×10?6/% RH and 30×10?6/% RH. The difference between the coefficients of hygroscopic expansion of the two materials is 5×10?6/% RH or less.

Abstract: An alpha-turn coil includes: a plurality of coil main bodies made by winding a wire rod having a desired diameter; and lead wire having a start part and a stop part formed integrally with outer peripheries of the coil main bodies, and connecting the coil main bodies to each other. The stop part of the lead wire of a forward coil main body is extended to the start part of the lead wire of a backward coil main body, and the lead wire is extended to compose the coil main body.