Abstract: A method of making a wiring board includes forming a first capacitor carrier layer with a first embedded chip capacitor, a first insulation layer disposed on an upper surface, a second insulation layer disposed on a lower surface, first upper and lower conductive vias in conductive contact with a first electrode, and second upper and lower conductive vias in conductive contact with a second electrode. The method also includes forming a second capacitor carrier layer similar to the first. The method further includes forming a bonded laminate comprising in sequence an upper insulation layer, the first capacitor carrier layer, a center insulation layer, the second capacitor carrier layer, and a lower insulation layer. The method also includes forming a through-hole through the laminate and forming a conductive coating within the through-hole to provide a conductive through-hole. A wiring board also includes the bonded laminate and the embedded capacitors.

Abstract: A method of making a wiring board includes forming a first capacitor carrier layer with a first embedded chip capacitor, a first insulation layer disposed on an upper surface, a second insulation layer disposed on a lower surface, first upper and lower conductive vias in conductive contact with a first electrode, and second upper and lower conductive vias in conductive contact with a second electrode. The method also includes forming a second capacitor carrier layer similar to the first. The method further includes forming a bonded laminate comprising in sequence an upper insulation layer, the first capacitor carrier layer, a center insulation layer, the second capacitor carrier layer, and a lower insulation layer. The method also includes forming a through-hole through the laminate and forming a conductive coating within the through-hole to provide a conductive through-hole. A wiring board also includes the bonded laminate and the embedded capacitors.

Abstract: A semiconductor element for solid state image sensing device includes a semiconductor element body (semiconductor chip) in which an image sensing area having an image sensor portion and a connection area having an electrode are provided. A transparent resin layer is joined to the image sensing area of the semiconductor element to cover the image sensing area. An optical sealing plate is joined onto the transparent resin layer. According to the semiconductor element for solid state image sensing device as structured above, downsizing, thickness reduction, and cost reduction of a solid state image sensing device are realized. The solid state image sensing device includes a mounting board to which the semiconductor element for solid state image sensing device is joined.

Abstract: The present invention provides an electronic bulletin board. Communication between people having an appointment to meet (i.e., message sender and receiver) is possible by using a common electronic bulletin board placed at the meeting place, requiring no knowledge of the e-mail address of the other party. The present invention has a plurality of electronic bulletin boards and a central server which, upon receiving a request from a mobile information terminal to access any one of the plurality of electronic bulletin boards, sends access information to said mobile information terminal. The electronic bulletin board receives a message, converts it to an icon message, and displays the icon on a display portion.