Abstract: A thermal head of the present disclosure includes a substrate 7, a heat generating unit 9, an electrode, a covering layer 27, and a covering member 29. The heat generating unit 9 is positioned above the substrate 7. The electrode is positioned above the substrate and connected to the heat generating unit 9. The covering layer 27 covers at least a part of the electrode when viewed in plan. The covering member 29 is positioned on the covering layer 27. The covering layer 27 has an upper surface 27a and a lateral surface 27b that is positioned on a side of the heat generating unit 9. An arithmetic-average surface roughness Ra of the lateral surface 27b is higher than an arithmetic-average surface roughness Ra of the upper surface 27a.

Abstract: A thermal head of the present disclosure includes a substrate 7, a heat generating unit 9, an electrode, a covering layer 27, and a covering member 29. The heat generating unit 9 is positioned above the substrate 7. The electrode is positioned above the substrate and connected to the heat generating unit 9. The covering layer 27 covers at least a part of the electrode when viewed in plan. The covering member 29 is positioned on the covering layer 27. The covering layer 27 has an upper surface 27a and a lateral surface 27b that is positioned on a side of the heat generating unit 9. An arithmetic-average surface roughness Ra of the lateral surface 27b is higher than an arithmetic-average surface roughness Ra of the upper surface 27a.

Abstract: A thermal head includes a substrate, a heat-generating portion disposed on the substrate, electrodes disposed on the substrate and electrically connected to the heat-generating portion, a driver IC disposed on the substrate and electrically connected to the electrodes, and a covering member covering the driver IC. In plan view, a center line of the driver IC extending in a main scanning direction and a highest position of the covering member are located farther form the heat-generating portion than a center line of the covering member extending in the main scanning direction.

Abstract: A thermal head includes a substrate; a plurality of heating elements; a plurality of electrodes; a first covering layer; and a covering member. The thermal head further includes a second covering layer extending from the first covering layer onto the end surface. The housing is in contact with the second covering layer.

Abstract: [Object] To provide a thermal head with which a substrate is not likely to become broken. [Solution] A thermal head X1 includes a substrate 7 having a first main surface 7f and an end surface 7e adjacent to the first main surface 7f; a plurality of heating elements 9 disposed on the first main surface 7f or on the end surface 7e; a plurality of electrodes disposed on the first main surface 7f and electrically connected to the plurality of heating elements 9; a first covering layer 27a disposed on parts of the plurality of electrodes; a connector 31 disposed adjacent to the end surface 7e and including a plurality of connector pins 8 disposed on the plurality of electrodes and a housing 10 containing the plurality of connector pins 8; and a covering member 12 covering the plurality of connector pins 8 on the plurality of electrodes together with the plurality of electrodes. The thermal head further includes a second covering layer 27b extending from the first covering layer 27a onto the end surface 7e.

Abstract: A thermal head includes a substrate, a heat-generating portion disposed on the substrate, electrodes disposed on the substrate and electrically connected to the heat-generating portion, a driver IC disposed on the substrate and electrically connected to the electrodes, and a covering member covering the driver IC. In plan view, a center line of the driver IC extending in a main scanning direction and a highest position of the covering member are located farther form the heat-generating portion than a center line of the covering member extending in the main scanning direction.

Abstract: A thermal head capable of reducing abrasion of the conductive layer and reducing damage of heat-generating portions is provided. A thermal head includes a substrate, a plurality of heat-generating portions disposed on or above the substrate, electrodes provided on or above the substrate and electrically connected to the plurality of heat-generating portions, and a protective layer provided along an arrangement direction of the plurality of heat-generating portions, the protective layer covering the plurality of heat-generating portions and the electrodes. The protective layer has an electrical insulating layer covering the plurality of heat-generating portions and the electrodes, a conductive layer provided on the electrical insulating layer, and an abrasion resistance layer provided on the conductive layer. Part of the conductive layer is an exposed portion exposed from the abrasion resistance layer.

Abstract: A thermal head capable of reducing abrasion of the conductive layer and reducing damage of heat-generating portions is provided. A thermal head includes a substrate, a plurality of heat-generating portions disposed on or above the substrate, electrodes provided on or above the substrate and electrically connected to the plurality of heat-generating portions, and a protective layer provided along an arrangement direction of the plurality of heat-generating portions, the protective layer covering the plurality of heat-generating portions and the electrodes. The protective layer has an electrical insulating layer covering the plurality of heat-generating portions and the electrodes, a conductive layer provided on the electrical insulating layer, and an abrasion resistance layer provided on the conductive layer. Part of the conductive layer is an exposed portion exposed from the abrasion resistance layer.

Abstract: There are provided a recording head capable of reduction of variations in heat-generating temperature among heat-generating elements constituting a heat-generating-element array, and a recording device including the recording head. A recording head includes a heat radiator; a head base body having a substrate placed on or above the heat radiator and a heat-generating-element array composed of a plurality of heat-generating elements arranged on or above the substrate; a bonding layer that is interposed between the heat radiator and the substrate and bonds the heat radiator with the substrate; and a plurality of spacer particles arranged within the bonding layer so as to abut on both of the heat radiator and the substrate. The bonding layer includes a first region situated immediately below the heat-generating-element array and a second region extending in parallel with the first region. The spacer particles are arranged in the second region.

Abstract: A recording head applicable to a recording device is disclosed. The recording head comprises a substrate, a conductive pattern layer, and an electric resistor layer. The conductive pattern layer is formed on the substrate and comprises a first conductive portion, a second conductive portion, and an insulating portion. The second conductive portion is paired with the first conductive portion. The insulating portion insulates the first conductive portion and the second conductive portion. The electrical resistance layer: is formed on the conductive pattern layer; is connected to the first conductive portion and the second conductive portion; and comprises a heat-generating region between the first conductive portion and the second conductive portion.

Abstract: A thermal head includes heat generating parts and a conductive layer having connecting parts electrically connected to ends of the heat generating parts. The conductive layer has wiring parts whose cross-sectional areas are smaller than cross-sectional areas of the respective connecting parts in directions. The wiring parts has a first upper layer and a second upper layer which have smaller widths in arrow directions than widths of the respective connecting parts as well as a first lower layer and a second lower layer which have lengths not shorter than the widths of the respective connecting parts and greater than the widths of the respective upper layers. The respective upper layers and the respective lower layers are arranged to overlap each other.

Abstract: There are provided a recording head capable of reduction of variations in heat-generating temperature among heat-generating elements constituting a heat-generating-element array, and a recording device including the recording head. A recording head includes a heat radiator; a head base body having a substrate placed on or above the heat radiator and a heat-generating-element array composed of a plurality of heat-generating elements arranged on or above the substrate; a bonding layer that is interposed between the heat radiator and the substrate and bonds the heat radiator with the substrate; and a plurality of spacer particles arranged within the bonding layer so as to abut on both of the heat radiator and the substrate. The bonding layer includes a first region situated immediately below the heat-generating-element array and a second region extending in parallel with the first region. The spacer particles are arranged in the second region.

Abstract: A recording head applicable to a recording device is disclosed. The recording head comprises a substrate, a conductive pattern layer, and an electric resistor layer. The conductive pattern layer is formed on the substrate and comprises a first conductive portion, a second conductive portion, and an insulating portion. The second conductive portion is paired with the first conductive portion. The insulating portion insulates the first conductive portion and the second conductive portion. The electrical resistance layer: is formed on the conductive pattern layer; is connected to the first conductive portion and the second conductive portion; and comprises a heat-generating region between the first conductive portion and the second conductive portion.

Abstract: A thermal head includes heat generating parts and a conductive layer having connecting parts electrically connected to ends of the heat generating parts. The conductive layer has wiring parts whose cross-sectional areas are smaller than cross-sectional areas of the respective connecting parts in directions. The wiring parts has a first upper layer and a second upper layer which have smaller widths in arrow directions than widths of the respective connecting parts, as well as a first lower layer and a second lower layer which have lengths not shorter than the widths of the respective connecting parts and greater than the widths of the respective upper layers. The respective upper layers and the respective lower layers are arranged to overlap each other.