Patents by Inventor Yoichi Ootsuka

Yoichi Ootsuka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180019270
    Abstract: A solid-state imaging device includes pixels each having a photoelectric conversion element for converting incident light to an electric signal, color filters associated with the pixels and having a plurality of color filter components, microlenses converging the incident light through the color filters to the photoelectric conversion elements, a light shielding film disposed between the color filter components of the color filters, and a nonplanarized adhesive film provided between the color filters and the light shielding film.
    Type: Application
    Filed: September 28, 2017
    Publication date: January 18, 2018
    Inventors: Tomoharu Ogita, Atsushi Yamamoto, Keiji Tatani, Yoichi Ootsuka, Kiyotaka Tabuchi
  • Publication number: 20170338265
    Abstract: The present disclosure relates to a solid-state imaging device, a manufacturing method thereof, and an electronic apparatus, in which both oblique light characteristics and sensitivity can be improved.—The solid-state imaging device includes pixel array unit in which a plurality of pixels is two-dimensionally arranged in a matrix and multi-stage light shielding walls are provided between the pixels. The present disclosure is applicable to, for example, a back-illuminated type solid-state imaging device and the like.
    Type: Application
    Filed: January 4, 2016
    Publication date: November 23, 2017
    Inventors: Ippei YOSHIBA, Yoichi OOTSUKA
  • Patent number: 9812480
    Abstract: A solid-state imaging device includes pixels each having a photoelectric conversion element for converting incident light to an electric signal, color filters associated with the pixels and having a plurality of color filter components, microlenses converging the incident light through the color filters to the photoelectric conversion elements, a light shielding film disposed between the color filter components of the color filters, and a nonplanarized adhesive film provided between the color filters and the light shielding film.
    Type: Grant
    Filed: February 14, 2017
    Date of Patent: November 7, 2017
    Assignee: Sony Corporation
    Inventors: Tomoharu Ogita, Atsushi Yamamoto, Keiji Tatani, Yoichi Ootsuka, Kiyotaka Tabuchi
  • Publication number: 20170317128
    Abstract: A solid-state imaging device includes: a first lens layer; and a second lens layer, wherein the second lens layer is formed at least at a periphery of each first microlens formed based on the first lens layer, and the second lens layer present at a central portion of each of the first microlenses is thinner than the second lens layer present at the periphery of the first microlens or no second lens layer is present at the central portion of each of the first microlenses.
    Type: Application
    Filed: July 19, 2017
    Publication date: November 2, 2017
    Applicant: Sony Corporation
    Inventors: Yoichi Ootsuka, Tomoyuki Yamashita, Kiyotaka Tabuchi, Yoshinori Toumiya, Akiko Ogino
  • Patent number: 9806114
    Abstract: A solid-state imaging device includes pixels each having a photoelectric conversion element for converting incident light to an electric signal, color filters associated with the pixels and having a plurality of color filter components, microlenses converging the incident light through the color filters to the photoelectric conversion elements, a light shielding film disposed between the color filter components of the color filters, and a nonplanarized adhesive film provided between the color filters and the light shielding film.
    Type: Grant
    Filed: October 14, 2016
    Date of Patent: October 31, 2017
    Assignee: Sony Corporation
    Inventors: Tomoharu Ogita, Atsushi Yamamoto, Keiji Tatani, Yoichi Ootsuka, Kiyotaka Tabuchi
  • Publication number: 20170287962
    Abstract: The present disclosure relates to a solid-state imaging device that can achieve a higher image quality by reducing image quality degradation, a method of manufacturing the solid-state imaging device, and an electronic apparatus. The solid-state imaging device includes: a semiconductor substrate having photodiodes formed for respective pixels, the photodiodes performing photoelectric conversion; color filters that pass light in the colors corresponding to the respective pixels, the color filters being stacked on the light incident surface side of the semiconductor substrate; and a light shielding film provided between the color filters of the respective pixels, the light shielding film being formed by stacking a first light shielding film and a second light shielding film, the first light shielding film and the second light shielding film being formed with two different materials from each other.
    Type: Application
    Filed: September 18, 2015
    Publication date: October 5, 2017
    Inventor: YOICHI OOTSUKA
  • Publication number: 20170278889
    Abstract: The present disclosure relates to a solid-state imaging device that enables diffusion of components in the interfaces between microlenses and an antireflection film, a method of manufacturing the solid-state imaging device, and an electronic apparatus. Moisture permeation holes are formed between the microlenses of adjacent pixels. The moisture permeation holes are covered with an antireflection film. The antireflection film is formed on the surfaces of the microlenses excluding the diffusion holes. The refractive index of the antireflection film is higher than the refractive index of the microlenses. The present disclosure can be applied to complementary metal oxide semiconductor (CMOS) image sensors that are back-illuminated solid-state imaging devices, for example.
    Type: Application
    Filed: September 17, 2015
    Publication date: September 28, 2017
    Inventors: TAKASHI NAKASHIKIRYO, YOSHIAKI KITANO, YUUJI NISHIMURA, KOUICHI ITABASI, RYOU CHIBA, YOSUKE TAKITA, MITSURU ISHIKAWA, TOYOMI JINWAKI, YUICHI SEKI, MASAYA SHIMOJI, YOICHI OOTSUKA, TAKAFUMI NISHI
  • Patent number: 9741757
    Abstract: A solid-state imaging device includes: a first lens layer; and a second lens layer, wherein the second lens layer is formed at least at a periphery of each first microlens formed based on the first lens layer, and the second lens layer present at a central portion of each of the first microlenses is thinner than the second lens layer present at the periphery of the first microlens or no second lens layer is present at the central portion of each of the first microlenses.
    Type: Grant
    Filed: September 22, 2015
    Date of Patent: August 22, 2017
    Assignee: Sony Corporation
    Inventors: Yoichi Ootsuka, Tomoyuki Yamashita, Kiyotaka Tabuchi, Yoshinori Toumiya, Akiko Ogino
  • Publication number: 20170154907
    Abstract: A solid-state imaging device includes pixels each having a photoelectric conversion element for converting incident light to an electric signal, color filters associated with the pixels and having a plurality of color filter components, microlenses converging the incident light through the color filters to the photoelectric conversion elements, a light shielding film disposed between the color filter components of the color filters, and a nonplanarized adhesive film provided between the color filters and the light shielding film.
    Type: Application
    Filed: February 14, 2017
    Publication date: June 1, 2017
    Inventors: Tomoharu Ogita, Atsushi Yamamoto, Keiji Tatani, Yoichi Ootsuka, Kiyotaka Tabuchi
  • Publication number: 20170033140
    Abstract: A solid-state imaging device includes pixels each having a photoelectric conversion element for converting incident light to an electric signal, color filters associated with the pixels and having a plurality of color filter components, microlenses converging the incident light through the color filters to the photoelectric conversion elements, a light shielding film disposed between the color filter components of the color filters, and a nonplanarized adhesive film provided between the color filters and the light shielding film.
    Type: Application
    Filed: October 14, 2016
    Publication date: February 2, 2017
    Inventors: Tomoharu Ogita, Atsushi Yamamoto, Keiji Tatani, Yoichi Ootsuka, Kiyotaka Tabuchi
  • Patent number: 9515114
    Abstract: A solid-state imaging device comprises an imaging pixel located in a light receiving region, the imaging pixel being a component of a unit pixel that is one of a plurality of unit pixels arranged in an array direction. A phase difference detection pixel is located in the light receiving region and is a component of the unit pixel, and has a corresponding photodiode with an upper surface. A first microlens corresponds to the imaging pixel, and a second microlens corresponding to the phase difference detection pixel. The second microlens has a first bottom surface in the array direction and a second bottom surface in a direction diagonal to the array direction, the second bottom surface being closer to the upper surface of the photodiode than the first bottom surface.
    Type: Grant
    Filed: February 27, 2013
    Date of Patent: December 6, 2016
    Assignee: SONY CORPORATION
    Inventor: Yoichi Ootsuka
  • Patent number: 9508767
    Abstract: A solid-state imaging device includes pixels each having a photoelectric conversion element for converting incident light to an electric signal, color filters associated with the pixels and having a plurality of color filter components, microlenses converging the incident light through the color filters to the photoelectric conversion elements, a light shielding film disposed between the color filter components of the color filters, and a nonplanarized adhesive film provided between the color filters and the light shielding film.
    Type: Grant
    Filed: March 23, 2016
    Date of Patent: November 29, 2016
    Assignee: Sony Corporation
    Inventors: Tomoharu Ogita, Atsushi Yamamoto, Keiji Tatani, Yoichi Ootsuka, Kiyotaka Tabuchi
  • Patent number: 9461081
    Abstract: An imaging device includes a plurality of photoelectric conversion elements, a plurality of color filter components having a first color filter component and a second color filter component; a light shielding portion, at least a part of which is disposed between the first and second color filter components in a cross-section view; and a transparent film, at least a first part of which is disposed between the first color filter component and the light shielding portion in the cross-section view. A surface of the transparent film facing to the first and second color filter components is nonplanar, and a thickness of the transparent film is less than a thickness of the light shielding portion.
    Type: Grant
    Filed: December 21, 2015
    Date of Patent: October 4, 2016
    Assignee: Sony Corporation
    Inventors: Tomoharu Ogita, Atsushi Yamamoto, Keiji Tatani, Yoichi Ootsuka, Kiyotaka Tabuchi
  • Publication number: 20160231468
    Abstract: The present technology relates to a lens array and a manufacturing method therefor, a solid-state imaging apparatus, and an electronic apparatus that can improve the AF performance while suppressing the deterioration of image quality. A lens array includes microlenses that are formed corresponding to phase difference detection pixels that are provided to be mixed in imaging pixels. Each of the microlenses is formed such that a lens surface thereof is a substantially spherical surface, the microlens has a rectangular shape in a planar view and four corners are not substantially rounded, and a bottom surface in vicinity of an opposite-side boundary portion that includes an opposite-side center portion of a pixel boundary portion in a cross-sectional view is higher than a bottom surface in vicinity of a diagonal boundary portion that includes a diagonal boundary portion. The present technology is applicable to a lens array of a CMOS image sensor, for example.
    Type: Application
    Filed: September 12, 2014
    Publication date: August 11, 2016
    Inventors: Yoichi OOTSUKA, Kenju NISHIKIDO, Ippei YOSHIBA
  • Publication number: 20160204141
    Abstract: A solid-state imaging device includes pixels each having a photoelectric conversion element for converting incident light to an electric signal, color filters associated with the pixels and having a plurality of color filter components, microlenses converging the incident light through the color filters to the photoelectric conversion elements, a light shielding film disposed between the color filter components of the color filters, and a nonplanarized adhesive film provided between the color filters and the light shielding film.
    Type: Application
    Filed: March 23, 2016
    Publication date: July 14, 2016
    Inventors: Tomoharu Ogita, Atsushi Yamamoto, Keiji Tatani, Yoichi Ootsuka, Kiyotaka Tabuchi
  • Publication number: 20160111462
    Abstract: An imaging device includes a plurality of photoelectric conversion elements, a plurality of color filter components having a first color filter component and a second color filter component; a light shielding portion, at least a part of which is disposed between the first and second color filter components in a cross-section view; and a transparent film, at least a first part of which is disposed between the first color filter component and the light shielding portion in the cross-section view. A surface of the transparent film facing to the first and second color filter components is nonplanar, and a thickness of the transparent film is less than a thickness of the light shielding portion.
    Type: Application
    Filed: December 21, 2015
    Publication date: April 21, 2016
    Inventors: Tomoharu Ogita, Atsushi Yamamoto, Keiji Tatani, Yoichi Ootsuka, Kiyotaka Tabuchi
  • Publication number: 20160086995
    Abstract: A solid-state image pickup device includes: a filter section including filters that are disposed corresponding to respective pixels, and each allowing light of a color that corresponds to corresponding one of the pixels to transmit therethrough, in which the pixels are each configured to receive the light of the predetermined color; and a microlens array section including a plurality of microlenses each configured to collect the light for corresponding one of the pixels, in which the microlenses are stacked with respect to the filter section, and are arranged in an array pattern corresponding to the respective pixels. The microlenses have two or more shapes that are different from one another corresponding to the respective colors of the light to be received by the pixels, and each having an end that is in contact with the end of adjacent one of the microlenses.
    Type: Application
    Filed: November 30, 2015
    Publication date: March 24, 2016
    Inventor: Yoichi Ootsuka
  • Patent number: 9293504
    Abstract: A solid-state image pickup device includes: a filter section including filters that are disposed corresponding to respective pixels, and each allowing light of a color that corresponds to corresponding one of the pixels to transmit therethrough, in which the pixels are each configured to receive the light of the predetermined color; and a microlens array section including a plurality of microlenses each configured to collect the light for corresponding one of the pixels, in which the microlenses are stacked with respect to the filter section, and are arranged in an array pattern corresponding to the respective pixels. The microlenses have two or more shapes that are different from one another corresponding to the respective colors of the light to be received by the pixels, and each having an end that is in contact with the end of adjacent one of the microlenses.
    Type: Grant
    Filed: January 30, 2014
    Date of Patent: March 22, 2016
    Assignee: Sony Corporation
    Inventor: Yoichi Ootsuka
  • Patent number: 9253456
    Abstract: A solid-state imaging device includes pixels each having a photoelectric conversion element for converting incident light to an electric signal, color filters associated with the pixels and having a plurality of color filter components, microlenses converging the incident light through the color filters to the photoelectric conversion elements, a light shielding film disposed between the color filter components of the color filters, and a nonplanarized adhesive film provided between the color filters and the light shielding film.
    Type: Grant
    Filed: May 14, 2014
    Date of Patent: February 2, 2016
    Assignee: Sony Corporation
    Inventors: Tomoharu Ogita, Atsushi Yamamoto, Keiji Tatani, Yoichi Ootsuka, Kiyotaka Tabuchi
  • Publication number: 20160013234
    Abstract: A solid-state imaging device includes: a first lens layer; and a second lens layer, wherein the second lens layer is formed at least at a periphery of each first microlens formed based on the first lens layer, and the second lens layer present at a central portion of each of the first microlenses is thinner than the second lens layer present at the periphery of the first microlens or no second lens layer is present at the central portion of each of the first microlenses.
    Type: Application
    Filed: September 22, 2015
    Publication date: January 14, 2016
    Inventors: Yoichi Ootsuka, Tomoyuki Yamashita, Kiyotaka Tabuchi, Yoshinori Toumiya, Akiko Ogino