Abstract: An electrostatic chuck includes a heating part, a substrate on the heating part, a temperature sensor, and an embedment part. The substrate includes a first surface onto which an object is to be attracted and held, a second surface opposite from the first surface and contacting the heating part, and a hole open at the second surface of the substrate. The hole includes a threaded inner wall surface. The temperature sensor is at the bottom of the hole. The embedment part includes a threaded side surface, and is embedded in the hole with the threaded side surface mating with the threaded inner wall surface. The substrate and the embedment part are formed of the same material.

Abstract: An electrostatic chuck includes a heating part, a substrate on the heating part, a temperature sensor, and a metal material. The substrate includes a first surface onto which an object is to be attracted and held, a second surface opposite from the first surface and contacting the heating part, and a first hole and a second hole aligned in a thickness direction of the substrate in communication with each other. The second hole is closer to the heating part than is the first hole, and open at the second surface of the substrate. The second hole is larger than the first hole when viewed in the thickness direction of the substrate. The temperature sensor is at the bottom of the first hole. The metal material is in the second hole with a space between the temperature sensor and the metal material.

Abstract: A substrate fixing device includes a baseplate, an electrostatic chuck, and an insulating layer interposed between the baseplate and the electrostatic chuck. The insulating layer includes a heating element formed of a first material and a wiring line connected in series to the heating element. The wiring line includes a first conductive layer formed of the first material and a second conductive layer joined onto the first conductive layer. The second conductive layer is formed of a second material having a resistivity lower than the resistivity of the first material.

Abstract: A substrate holding apparatus includes a baseplate, a heating unit disposed over the baseplate, and an electrostatic chuck disposed on the heating unit, wherein the heating unit includes a heating element having at least one roughened surface and an insulating layer enclosing the heating element, and the insulating layer and the electrostatic chuck are directly bonded to each other.

Abstract: An electrostatic chuck includes a heating part, a substrate on the heating part, a temperature sensor, and an embedment part. The substrate includes a first surface onto which an object is to be attracted and held, a second surface opposite from the first surface and contacting the heating part, and a hole open at the second surface of the substrate. The hole includes a threaded inner wall surface. The temperature sensor is at the bottom of the hole. The embedment part includes a threaded side surface, and is embedded in the hole with the threaded side surface mating with the threaded inner wall surface. The substrate and the embedment part are formed of the same material.

Abstract: An electrostatic chuck includes a heating part, a substrate on the heating part, a temperature sensor, and a metal material. The substrate includes a first surface onto which an object is to be attracted and held, a second surface opposite from the first surface and contacting the heating part, and a first hole and a second hole aligned in a thickness direction of the substrate in communication with each other. The second hole is closer to the heating part than is the first hole, and open at the second surface of the substrate. The second hole is larger than the first hole when viewed in the thickness direction of the substrate. The temperature sensor is at the bottom of the first hole. The metal material is in the second hole with a space between the temperature sensor and the metal material.

Abstract: A substrate holding apparatus includes a baseplate, a heating unit disposed over the baseplate, and an electrostatic chuck disposed on the heating unit, wherein the heating unit includes a heating element having at least one roughened surface and an insulating layer enclosing the heating element, and the insulating layer and the electrostatic chuck are directly bonded to each other.

Abstract: A substrate fixing device includes a baseplate, an electrostatic chuck, and an insulating layer interposed between the baseplate and the electrostatic chuck. The insulating layer includes a heating element formed of a first material and a wiring line connected in series to the heating element. The wiring line includes a first conductive layer formed of the first material and a second conductive layer joined onto the first conductive layer. The second conductive layer is formed of a second material having a resistivity lower than the resistivity of the first material.

Abstract: A lead frame includes a terminal part having a first side surface formed in a concave curve shape on a lower side from an upper end of the terminal part, and a second side surface formed in a concave curve shape on a lower side from a lower end of the first side surface. The concave curve shape of each of the first and second side surfaces has a depth in a surface direction of the terminal part. A boundary part of the first side surface and the second side surface becomes a protrusion protruding outward. The depth of the concave curve shape of the second side surface is larger than that of the first side surface. A distance between an upper end and a lower end of the second side surface is longer than a distance between an upper end and the lower end of the first side surface.

Abstract: A method for cleaning a surface of a resin layer capable of sufficiently improving peel strength of a metal film formed by plating on a surface which is roughened by performing a desmear treatment on a resin layer containing a resin added with a large amount of filler is provided.

Abstract: When a counterboring method where a laser beam of a carbon dioxide gas laser is irradiated on a resin layer 34 that covers a pad formed on a surface of a first resin layer 30 and electrically connected to a conductor pattern 32 to partially remove the resin layer 34 to expose a pad surface is applied, in order to heighten the durability to the laser beam of the carbon dioxide gas laser of the resin layer 30 more than that of the resin layer 34, a compounding ratio of the filler in the resin layer 30 is increased more than that in the resin layer 34 and energy of the laser beam of the carbon dioxide gas laser irradiated on the resin layer 34 is controlled so as not to apply the laser processing to the resin layer 30.

Abstract: A method for cleaning a surface of a resin layer capable of sufficiently improving peel strength of a metal film formed by plating on a surface which is roughened by performing a desmear treatment on a resin layer containing a resin added with a large amount of filler is provided. The method is characterized in that, when a surface of a resin layer on which a metal film is formed by plating is roughened by a desmear treatment and, then, the thus-roughened surface of the resin layer is cleaned, the surface of the resin layer formed with a resin compounded with a filler in an amount of 20 wt % or more such that a difference of a coefficient of thermal expansion between the resin layer and the metal film is allowed to be reduced is roughened by subjecting it to the desmear treatment and, secondly, the filler which is deposited on the thus-roughened surface of the resin layer is removed by ultrasonic cleaning in which ultrasonic vibration of a frequency of from 35 to 50 kHz is applied.

Abstract: The position data column to move the laser beam is formed by assigning each position coordinate to the holes H11 and H12 in a T1 code one by one, assigning each position coordinate the holes H21 and H22 in a T2 code two by two, and assigning the position coordinate to the hole H31 in a T3 code three by three. The laser beam is moved on the substrate sequentially from the end as indicated by arrows of movement 1 to movement 5. Then, H11 is irradiated with 1 shot of the laser beam that is converged into a minimum diameter among plural types of hole diameters, H21 is irradiated with 2 shots, H31 is irradiated with 3 shots, H12 is irradiated with 1 shot of the laser beam, and H22 is irradiated with 2 shots. When the laser beam is irradiated one shot by one shot by the number of position data in response to a size of the hole diameter, the holes having different hole diameters can be formed.

Abstract: A semiconductor device substrate comprised of a core substrate on both surfaces or on one surface of which interconnect patterns are formed via resin layers, wherein the core substrate is formed by a material having a heat expansion coefficient close to a semiconductor chip, that is, a heat expansion coefficient closer to a semiconductor chip than the resin layers and the interconnect patterns inside the substrate, a resin layer forming an outermost layer of the substrate is formed using a material having a higher strength and/or a higher elongation than the resin material used for the inner resin layers in the substrate, and thereby cracking, deformation, and other problems arising in the substrate due to the thermal stress occurring between the core substrate and the resin layers in the substrate and interconnect patterns being prevented.