Patents by Inventor Yojiro SHIINA

Yojiro SHIINA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10707156
    Abstract: An electronic device comprises a semiconductor chip, an accommodating part that accommodates the semiconductor chip, a plurality of terminals that are provided along a first side of a first surface and along a second side opposite to the first side with respect to the semiconductor chip, the plurality of terminals being electrically connected to the semiconductor chip and being exposed on the rectangular first surface of the accommodating part, and a plurality of conductive members that penetrate from the first surface of the accommodating part to the second surface opposite to the first surface.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: July 7, 2020
    Assignees: KATOH ELECTRIC CO., LTD., TOREX SEMICONDUCTOR LTD.
    Inventors: Shinya Sato, Yuki Yasuda, Yojiro Shiina
  • Publication number: 20190164872
    Abstract: An electronic device comprises a semiconductor chip, an accommodating part that accommodates the semiconductor chip, a plurality of terminals that are provided along a first side of a first surface and along a second side opposite to the first side with respect to the semiconductor chip, the plurality of terminals being electrically connected to the semiconductor chip and being exposed on the rectangular first surface of the accommodating part, and a plurality of conductive members that penetrate from the first surface of the accommodating part to the second surface opposite to the first surface.
    Type: Application
    Filed: January 31, 2019
    Publication date: May 30, 2019
    Inventors: Shinya SATO, Yuki YASUDA, Yojiro SHIINA
  • Patent number: 10242937
    Abstract: To increase a current that can be supplied to an electronic element mounted on an upper surface of a semiconductor package. An electronic device includes a semiconductor chip, a package that accommodates the semiconductor chip, a plurality of terminals that is electrically bonded with the semiconductor chip and is exposed on a first surface of the package, and at least one copper post that penetrates from the first surface of the package to a second surface opposite to the first surface, and that has a cross sectional area in the direction of the first surface, which is larger than the area of the plurality of terminals on the first surface.
    Type: Grant
    Filed: October 25, 2017
    Date of Patent: March 26, 2019
    Assignees: KATOH ELECTRIC CO, LTD., TOREX SEMICONDUCTOR LTD.
    Inventors: Shinya Sato, Yuki Yasuda, Yojiro Shiina
  • Publication number: 20180218968
    Abstract: To increase a current that can be supplied to an electronic element mounted on an upper surface of a semiconductor package. An electronic device includes a semiconductor chip, a package that accommodates the semiconductor chip, a plurality of terminals that is electrically bonded with the semiconductor chip and is exposed on a first surface of the package, and at least one copper post that penetrates from the first surface of the package to a second surface opposite to the first surface, and that has a cross sectional area in the direction of the first surface, which is larger than the area of the plurality of terminals on the first surface.
    Type: Application
    Filed: October 25, 2017
    Publication date: August 2, 2018
    Inventors: Shinya SATO, Yuki YASUDA, Yojiro SHIINA