Patents by Inventor Yokichi KONAMI

Yokichi KONAMI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160016382
    Abstract: Provided are a layered substrate that has excellent mechanical properties such as a flexural strength or a flexural modulus applicable to a structural material, the variations in those mechanical properties are small, exhibits excellent formability into a complicated shape, and is able to be molded in a short time, and a method for manufacturing the same. A layered substrate fabricated by layering plural sheets of sheet-shaped prepregs containing a reinforcing fiber oriented in one direction and a thermoplastic matrix resin, wherein the prepreg has a slit penetrating from the front surface to the back surface, each slit is provided so as to intersect with each reinforcing fiber only one time.
    Type: Application
    Filed: March 10, 2014
    Publication date: January 21, 2016
    Applicant: MITSUBISHI RAYON CO., LTD.
    Inventors: Takeshi ISHIKAWA, Masao TOMIOKA, Masahiro OSUKA, Yuuji FUJITA, Yokichi KONAMI, Takahiro HAYASHI