Patents by Inventor Yoko Miyazaki

Yoko Miyazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7330265
    Abstract: An object of the present invention is to provide an appearance inspection apparatus that can change the method of illumination, the shape of illumination light, and a spatial filter for the projection of an image of a sample dynamically during inspection, and also to provide a projection method for projecting the image of the sample. Illumination optics 12 and 13 and imaging optics 21 and 22 in the appearance inspection apparatus are respectively configured to form reflecting optical systems with mirror array devices 16 and 26 disposed at points conjugate to the pupil position 8 of an objective lens 3. The mirror array devices 16 and 26 are controlled in accordance with the field-of-view position of the objective lens 3 on the sample.
    Type: Grant
    Filed: July 8, 2005
    Date of Patent: February 12, 2008
    Assignee: Tokyo Seimitsu Co., Ltd.
    Inventors: Toshiro Kurosawa, Shohei Yamazaki, Yoko Miyazaki
  • Publication number: 20080024794
    Abstract: In a semiconductor surface inspection apparatus for inspecting the surface of a semiconductor device as a test object based on an optical image thereof, the present invention achieves illumination that enables diffracted light from the test object under dark-field illumination to be obtained efficiently from the entire area of the test object and thereby alleviates degradation of the defect detection sensitivity of the inspection apparatus over the entire area of the test object.
    Type: Application
    Filed: June 3, 2005
    Publication date: January 31, 2008
    Inventors: Yoko Miyazaki, Toshiro Kurosawa, Muneaki Tamura
  • Publication number: 20060007436
    Abstract: An object of the present invention is to provide an appearance inspection apparatus that can change the method of illumination, the shape of illumination light, and a spatial filter for the projection of an image of a sample dynamically during inspection, and also to provide a projection method for projecting the image of the sample. Illumination optics 12 and 13 and imaging optics 21 and 22 in the appearance inspection apparatus are respectively configured to form reflecting optical systems with mirror array devices 16 and 26 disposed at points conjugate to the pupil position 8 of an objective lens 3. The mirror array devices 16 and 26 are controlled in accordance with the field-of-view position of the objective lens 3 on the sample.
    Type: Application
    Filed: July 8, 2005
    Publication date: January 12, 2006
    Inventors: Toshiro Kurosawa, Shohei Yamazaki, Yoko Miyazaki
  • Patent number: 6551847
    Abstract: A monitor wafer is processed by a processing apparatus, and thereafter, it is subjected to an inspection in a foreign object inspection apparatus in accordance with an inspection recipe. A measured result obtained by the inspection is compiled and analyzed in a data management system. Generally, a monitor wafer is not assigned a rot name or a wafer name, however, the measured result is assigned an identification name for identifying plural processing apparatuses from one another, and is stored in a database as storage data.
    Type: Grant
    Filed: September 19, 2001
    Date of Patent: April 22, 2003
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Kyoko Asahina, Yoko Miyazaki, Kaoru Yamana
  • Patent number: 6528334
    Abstract: There are described a semiconductor inspection system for inspecting recessed defects formed in a semiconductor wafer and a semiconductor device manufacturing method including an inspection step of inspecting recessed defects formed in a semiconductor wafer. The semiconductor inspection system and the semiconductor device manufacturing method enable the following operations: an operation of radiating a laser beam onto a semiconductor wafer; an operation of detecting light scattered from foreign particles, as a result of a laser beam being radiated onto the semiconductor wafer; an operation of converting the detected scattered light into an electric signal; and an operation of outputting information about the recessed defects formed in the semiconductor wafer by means of subtracting the data pertaining to only the foreign particles located on the semiconductor wafer from the data pertaining to both the foreign particles and recessed defects formed in the semiconductor wafer.
    Type: Grant
    Filed: October 3, 2000
    Date of Patent: March 4, 2003
    Assignees: Mitsubishi Denki Kabushiki Kaisha, Ryoden Semiconductor System Engineering Corporation
    Inventors: Mariko Mizuo, Yoko Miyazaki
  • Patent number: 6437862
    Abstract: A defect inspection apparatus includes a first main controller for producing a reflectance distribution in a wafer surface to generate illumination light control data, based on the reflectance distribution, the illumination light control data being control data for adjusting the intensity of illumination light so that the intensity of reflected light from all locations in the wafer surface reaches an average intensity value, and a filter controller for inputting a filter control signal to a filter, based on the illumination light control data. The transmittance or reflectance of the filter for illumination light is controlled by the filter control signal. Consequently, the intensity of light reflected from a wafer to be inspected is controlled to provide uniformity in the wafer surface. Therefore, the defect inspection apparatus detects a defect occurring in the object to be inspected with high accuracy.
    Type: Grant
    Filed: December 9, 1999
    Date of Patent: August 20, 2002
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Yoko Miyazaki, Masahiko Ikeno
  • Publication number: 20020081756
    Abstract: A monitor wafer is processed by a processing apparatus, and thereafter, it is subjected to an inspection in a foreign object inspection apparatus in accordance with an inspection recipe. A measured result obtained by the inspection is compiled and analyzed in a data management system. Generally, a monitor wafer is not assigned a rot name or a wafer name, however, the measured result is assigned an identification name for identifying plural processing apparatuses from one another, and is stored in a database as storage data.
    Type: Application
    Filed: September 19, 2001
    Publication date: June 27, 2002
    Applicant: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Kyoko Asahina, Yoko Miyazaki, Kaoru Yamana
  • Patent number: 6400038
    Abstract: The alignment method allows a constant decision of an alignment point even with an indistinct outline of an alignment mark. An operator moves a chip (2) so that the whole or parts of an alignment mark (1) (including at least angles D0A0B0 and A0B0C0) is included within a lens view field (4), and then decides an alignment point (AP0). More specifically, the operator reads angles which are specified to obtain bisectors, from a defect inspection apparatus; obtains respective bisectors of the angles; and decides the intersection thereof to be the alignment point (AP0). Then, a stage drive required to superimpose the alignment point (AP0) on the center (O) is calculated on the basis of the shift amount between the position of the alignment point (AP0) and the center (O) of a target scope (5) displayed at the lens view field (4). The chip (2) is then moved by the stage drive.
    Type: Grant
    Filed: April 2, 2001
    Date of Patent: June 4, 2002
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Toshiaki Mugibayashi, Yoko Miyazaki
  • Patent number: 6344897
    Abstract: An inspection apparatus for foreign matter and pattern defects includes an optical portion (D) and an analyzer (AN). The optical portion (D) includes a microscope illumination optical system (D1) for detecting the surface of a semiconductor wafer (2) in the form of a piece of first surface information by using microscope illumination, and a laser scattering type optical system (D2) for detecting scattered laser light from the semiconductor wafer by using laser light to detect the surface of the semiconductor wafer (2) in the form of a piece of second surface information.
    Type: Grant
    Filed: July 25, 2001
    Date of Patent: February 5, 2002
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Yoko Miyazaki, Toshiaki Mugibayashi
  • Publication number: 20010046044
    Abstract: An inspection apparatus for foreign matter and pattern defects includes an optical portion (D) and an analyzer (AN). The optical portion (D) includes a microscope illumination optical system (D1) for detecting the surface of a semiconductor wafer (2) in the form of a piece of first surface information by using microscope illumination, and a laser scattering type optical system (D2) for detecting scattered laser light from the semiconductor wafer by using laser light to detect the surface of the semiconductor wafer (2) in the form of a piece of second surface information.
    Type: Application
    Filed: July 25, 2001
    Publication date: November 29, 2001
    Applicant: Mitsubishi Denki Kabushki Kaisha
    Inventors: Yoko Miyazaki, Toshiaki Mugibayashi
  • Patent number: 6295126
    Abstract: An inspection apparatus for foreign matter and pattern defects includes an optical portion (D) and an analyzer (AN). The optical portion (D) includes a microscope illumination optical system (D1) for detecting the surface of a semiconductor wafer (2) in the form of a piece of first surface information by using microscope illumination, and a laser scattering type optical system (D2) for detecting scattered laser light from the semiconductor wafer by using laser light to detect the surface of the semiconductor wafer (2) in the form of a piece of second surface information.
    Type: Grant
    Filed: March 21, 2000
    Date of Patent: September 25, 2001
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Yoko Miyazaki, Toshiaki Mugibayashi
  • Publication number: 20010010940
    Abstract: The alignment method allows a constant decision of an alignment point even with an indistinct outline of an alignment mark. An operator moves a chip (2) so that the whole or parts of an alignment mark (1) (including at least angles D0A0B0 and A0B0C0) is included within a lens view field (4), and then decides an alignment point (AP0). More specifically, the operator reads angles which are specified to obtain bisectors, from a defect inspection apparatus; obtains respective bisectors of the angles; and decides the intersection thereof to be the alignment point (AP0). Then, a stage drive required to superimpose the alignment point (AP0) on the center (O) is calculated on the basis of the shift amount between the position of the alignment point (AP0) and the center (O) of a target scope (5) displayed at the lens view field (4). The chip (2) is then moved by the stage drive.
    Type: Application
    Filed: April 2, 2001
    Publication date: August 2, 2001
    Applicant: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Toshiaki Mugibayashi, Yoko Miyazaki
  • Patent number: 6242318
    Abstract: The alignment method allows a constant decision of an alignment point even with an indistinct outline of an alignment mark. An operator moves a chip (2) so that the whole or parts of an alignment mark (1) (including at least angles D0A0B0 and A0B0C0) is included within a lens view field (4), and then decides an alignment point (AP0). More specifically, the operator reads angles which are specified to obtain bisectors, from a defect inspection apparatus; obtains respective bisectors of the angles; and decides the intersection thereof to be the alignment point (AP0). Then, a stage drive required to superimpose the alignment point (AP0) on the center (O) is calculated on the basis of the shift amount between the position of the alignment point (AP0) and the center (O) of a target scope (5) displayed at the lens view field (4). The chip (2) is then moved by the stage drive.
    Type: Grant
    Filed: July 27, 1998
    Date of Patent: June 5, 2001
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Toshiaki Mugibayashi, Yoko Miyazaki
  • Patent number: 6031607
    Abstract: The invention is a pattern defect inspection system and method for improving the inspection speed, simplifying the system, and enlarging the inspection object, in which a correlation circuit (24) selects from a plurality of reference images in reference image storing means (22) one having the highest correlation with a detection image in detection image storing means (23) and inputs it to a difference circuit (25); the difference circuit (25) forms a difference image based on a reference image from the correlation circuit (24) and a detection image from the detection image storing means (23); a defect decision circuit (26) decides the position and size of a defect in a wafer under test 41, based on the difference image from the difference circuit (25); and the result is inputted to defect information processing means (27) to output as a defect information.
    Type: Grant
    Filed: April 22, 1998
    Date of Patent: February 29, 2000
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Yoko Miyazaki
  • Patent number: 6016562
    Abstract: An ordinary user can easily learn a step at which a problem occurs during semiconductor manufacturing processes and improve the yield of manufacturing products and the quality of the products. At a certain in-line inspection step, a CPU (3) stores data signals (V1) taken by an inspection apparatus (1) into a memory (2), and reads a result (V6) obtained at a precedent step and stores the same in the memory (2). The CPU (3) reads stored data signals (V2) from the memory (2), performs comparison or referral on data about defects which are detected at a current step and the result (V6) regarding the precedent step, and generates a defect data analysis processing result signal (V5) regarding the current step. The result (V5) consists of disappeared defect data, common defect data, new defect data to which a label of a current step number is assigned, and reappeared defect data.
    Type: Grant
    Filed: August 28, 1997
    Date of Patent: January 18, 2000
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Yoko Miyazaki, Nobuyoshi Hattori, Junko Izumitani, Masahiko Ikeno
  • Patent number: 5379150
    Abstract: A spatial frequency filter used in a pattern defect detection device, including a pattern which includes a black spot having a diameter expanded by a controlled amount in comparison with the diameter of a black spot on a photosensitive plate obtained by exposure by diffracted light from a pattern on a model specimen.
    Type: Grant
    Filed: December 30, 1993
    Date of Patent: January 3, 1995
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Yoko Miyazaki, Toshimasa Tomoda, Hitoshi Tanaka, Nobuyuki Kosaka, Toyomi Ohshige
  • Patent number: 5289260
    Abstract: A spatial frequency filter used in a pattern defect detection device, including a pattern which includes a black spot having a diameter expanded by a controlled amount in comparison with the diameter of a black spot on a photosensitive plate obtained by exposure by diffracted light from a pattern on a model specimen
    Type: Grant
    Filed: November 6, 1991
    Date of Patent: February 22, 1994
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Yoko Miyazaki, Toshimasa Tomoda, Hitoshi Tanaka, Nobuyuki Kosaka, Toyomi Ohshige
  • Patent number: 5170063
    Abstract: An inspection device for detecting defects in a periodic pattern on a semiconductor wafer includes a laser oscillator. In the exposure process, light emitted from the laser oscillator is divided into a subject beam and a reference beam. The subject beam is guided to a semiconductor wafer having a periodic pattern thereon by mirrors and a beam expander. The light scattered from the specimen is collected by a lens on a photographic plate. The reference beam is guided to the photographic plate via a second beam expander and another mirror. The intensity of the reference beam is adjusted to a level at which the reference beams interferes on the photographic plate with the light scattered from defects in the periodic pattern and collected by the lens. Thus, a hologram of the defects in the pattern is recorded on the photographic plate. After development, the photographic plate is returned to its original position and used to form a holographic image of the defects with a transmitted regeneration light beam.
    Type: Grant
    Filed: February 27, 1991
    Date of Patent: December 8, 1992
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Yoko Miyazaki, Hitoshi Tanaka, Nobuyuki Kosaka, Toshimasa Tomoda