Patents by Inventor Yong Ho

Yong Ho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11276799
    Abstract: InGaN/GaN quantum layer nanowire light emitting diodes are fabricated into a single cluster capable of exhibiting a wide spectral output range. The nanowires having InGaN/GaN quantum layers formed of quantum dots are tuned to different output wavelengths using different nanowire diameters, for example, to achieve a full spectral output range covering the entire visible spectrum for display applications. The entire cluster is formed using a monolithically integrated fabrication technique that employs a single-step selective area epitaxy growth.
    Type: Grant
    Filed: June 25, 2020
    Date of Patent: March 15, 2022
    Assignee: THE REGENTS OF THE UNIVERSITY OF MICHIGAN
    Inventors: Zetian Mi, Yong-Ho Ra, Renjie Wang
  • Publication number: 20220077285
    Abstract: An integrated circuit (IC) device includes a first region and a second region adjacent to each other along a first direction on a substrate, fin patterns in each of the first and second regions extending along a second direction perpendicular to the first direction; gate electrodes extending along the first direction and intersecting the fin patterns; and an isolation region between the first and second regions, a bottom of the isolation region having a non-uniform height relative to a bottom of the substrate.
    Type: Application
    Filed: November 17, 2021
    Publication date: March 10, 2022
    Inventors: Jae-hyun PARK, Kye-hyun BAEK, Yong-ho JEON, Cheol KIM, Sung-il PARK, Yun-il LEE, Hyung-suk LEE
  • Publication number: 20220077031
    Abstract: In one example, an electronic device includes a substrate with a conductive structure and a substrate encapsulant. The conductive structure has a lead with a lead via and a lead protrusion. The lead via can include via lateral sides defined by first concave portions and the lead protrusion can include protrusion lateral sides defined by second concave portions. The substrate encapsulant covers the first concave portions at a first side of the substrate but not the second concave portions so that the lead protrusion protrudes from the substrate encapsulant at a second side of the substrate. An electronic component can be adjacent to the first side of the substrate and electrically coupled to the conductive structure. A body encapsulant encapsulates portions of the electronic component and the substrate. In some examples, the lead can further include a lead trace at the second side of the substrate. In some examples, the substrate can include a redistribution structure at the first side of the substrate.
    Type: Application
    Filed: September 9, 2020
    Publication date: March 10, 2022
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Hyeong Il JEON, Gi Jeong KIM, Yong Ho SON, Byong Jin KIM, Jae Min BAE, Seung Woo LEE
  • Publication number: 20220069658
    Abstract: The present disclosure relates to a coil assembly including: a plurality of unit flat coils disposed and spaced apart from one another in a circumferential direction; and a molding body made by dual injection molding and configured to partially surround the unit flat coils, thereby simplifying a structure of the coil assembly and a process of manufacturing the coil assembly.
    Type: Application
    Filed: August 27, 2021
    Publication date: March 3, 2022
    Inventors: Min Mo KOO, Yong Ho KIM
  • Publication number: 20220056373
    Abstract: The present disclosure relates to a cleaning liquid composition and a cleaning method using the same. A polishing slurry composition according to an embodiment of the present disclosure includes: a chelating agent containing an organic salt; and an anionic surfactant.
    Type: Application
    Filed: August 7, 2019
    Publication date: February 24, 2022
    Applicant: KCTECH CO., LTD.
    Inventors: Ga Young JUNG, Yong Ho JEONG, Kun Hee PARK, Young Gon KIM, Young Ho YOON, Young Lok YOON
  • Publication number: 20220059926
    Abstract: An antenna module includes an antenna substrate including an antenna pattern; a semiconductor package disposed on a lower surface of the antenna substrate, electrically connected to the antenna substrate, and having a semiconductor chip embedded therein; and an electronic component disposed at a side of the antenna substrate, electrically connected to the antenna substrate, and spaced apart from the semiconductor package by a predetermined distance. The antenna module includes a connection substrate connected to a portion of the antenna substrate, the connection substrate having an extension portion extending outward from the side of the antenna substrate, and the electronic component is disposed on the extension portion of the connection substrate to electrically connect to an inner wiring layer of the antenna substrate.
    Type: Application
    Filed: November 3, 2021
    Publication date: February 24, 2022
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Won Wook SO, Jin Seon PARK, Young Sik HUR, Jung Chul GONG, Yong Ho BAEK
  • Patent number: 11257008
    Abstract: An artificial intelligence execution acceleration system and a method of setting an artificial intelligence execution model are provided.
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: February 22, 2022
    Assignee: Soynet Co., Ltd.
    Inventors: Jung Woo Park, Dong Won Eom, Yong Ho Kim
  • Publication number: 20220053096
    Abstract: An image forming apparatus includes a printer engine, a sensor and a processor. The printer engine forms an image. The sensor outputs vibration information associated with a vibration of the printer engine. The processor determines whether at least one component of the printer engine has an abnormality based on the output vibration information.
    Type: Application
    Filed: March 11, 2020
    Publication date: February 17, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Kiho Park, Minkeun Song, SaeJin Park, Yong-Ho You, Sungdae Kim
  • Publication number: 20220046140
    Abstract: An image forming apparatus includes a print engine, a DC motor, a driving circuit, and a processor. The print engine forms an image. The DC motor drives the print engine. The driving circuit provides a current to the DC motor, and senses a variation of the current provided to the DC motor. The processor calculates a temperature of the DC motor based on the variation of the current flowing through the DC motor, and controls an operation of the image forming apparatus based on the calculated temperature.
    Type: Application
    Filed: March 13, 2020
    Publication date: February 10, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Ji-Young Ji-Young, Hyoungil Kim, Yong-Ho You
  • Patent number: 11243266
    Abstract: A transformer hydrogen gas monitoring system according to an embodiment of the present invention may comprise: a sensor module, which is disposed to allow at least a part thereof to meet hydrogen gas in a transformer and measures a resistance value of a member having a variable resistance value according to a hydrogen concentration in the transformer; and a multi-task module for receiving a sensing result of the sensor module, generating hydrogen concentration information corresponding to resistance value information included in the sensing result, and remotely transmitting information corresponding to the generated hydrogen concentration information.
    Type: Grant
    Filed: August 18, 2017
    Date of Patent: February 8, 2022
    Assignee: KOREA ELECTRIC POWER CORPORATION
    Inventors: Seok-Kon Kim, Jeong-Yeol Han, You-Jin Lee, Tea-Kyun Kim, Yong-Ho An, Byung-Tae Jang, Jong-Kee Choi, Nam-Ho Lee, Nam-Dae Kim
  • Publication number: 20220032808
    Abstract: A vehicle diagnosis system, an apparatus therefor, and a method therefore are provided. The vehicle diagnosis system includes a wireless charging station that transmits a message including information related to a supportable service type and information related to a vendor of a supportable vehicle and a vehicle that identifies the message and connect a diagnosis session for diagnosing and reprogramming the vehicle. The diagnosis session is performed when a connection for a wireless charging session of the vehicle is established.
    Type: Application
    Filed: July 26, 2021
    Publication date: February 3, 2022
    Inventors: In Sun OH, Kwang Hae YE, Ji Heon KWON, Joon Hyuk EOM, Jae Hwan NA, Yong Ho KIM
  • Publication number: 20220033359
    Abstract: The present invention provides a novel prodrug of an edaravone compound or a pharmaceutically acceptable salt thereof, a pharmaceutical composition comprising same as an active ingredient, and a use thereof in treatment or alleviation of neurodegenerative and/or motor neuron disease.
    Type: Application
    Filed: September 9, 2019
    Publication date: February 3, 2022
    Inventors: Jae-Sun KIM, Hyung-Chul RYU, Jee-Woong LIM, Eun-Bi KANG, Hyuk-Min KIM, Hyunjun YANG, Dukho CHANG, Dong-Gyu KIM, Byung Hwan RYOO, Yong-Ho OH
  • Patent number: 11237442
    Abstract: A liquid crystal display according to an exemplary embodiment of the present invention includes a substrate, a plurality of pixels arranged in a matrix on the substrate where each pixel includes a switching element, a plurality of gate lines that are connected to the switching elements and extend in a row direction, and a gate driver that is connected to the gate lines and is formed on the substrate as an integrated circuit. In the liquid crystal display, the gate driver includes a first region and a second region that is not aligned with the first region.
    Type: Grant
    Filed: June 22, 2020
    Date of Patent: February 1, 2022
    Inventors: Yong-Ho Yang, Joo-Sun Yoon, Ki-Hun Jeong
  • Publication number: 20220025299
    Abstract: A cleaning solution composition and a cleaning method using the cleaning solution composition are provided. The cleaning solution composition includes a chelating agent including a first organic acid and a second organic acid, and an etching agent including a fluoride compound.
    Type: Application
    Filed: July 21, 2021
    Publication date: January 27, 2022
    Applicant: KCTECH CO., LTD.
    Inventors: Kun Hee PARK, Yong Ho JEONG, Kyong Jin JUNG, Young Ho YUN
  • Publication number: 20220029497
    Abstract: A motor includes: a stator including assemblies; and a rotor disposed on one side of the stator. Each of the assemblies includes: a bobbin; a core inserted into the bobbin; and a coil surrounding an outside of the bobbin. The bobbin includes: a main through hole into which the core is inserted; and a sub-through hole disposed in either one of a top surface and a bottom surface on one side of the main through hole. An inner space of the bobbin is communication with the outside of the bobbin through the sub-through hole.
    Type: Application
    Filed: July 21, 2021
    Publication date: January 27, 2022
    Applicant: HYUNDAI MOBIS CO., LTD.
    Inventors: Yeong Woo SEO, Hye Seong YANG, Yong Ho KIM, Ui Il JEONG
  • Publication number: 20220025007
    Abstract: The present invention relates to an interleukin-2 analogue, which has altered binding affinity for interleukin-2 alpha receptor and interleukin-2 beta receptor, compared to the wild type.
    Type: Application
    Filed: September 30, 2019
    Publication date: January 27, 2022
    Applicant: HANMI PHARM. CO., LTD.
    Inventors: Euh Lim OH, Hyo Ran LEE, Jin Young KIM, Yong Ho HEO
  • Patent number: 11231443
    Abstract: An embodiment of the present invention provides a test socket for a semiconductor device, comprising: a base layer having a first surface and a second surface opposite to the first surface, and having, on the second surface, an external connection pad formed at a pitch corresponding to an electrode terminal of a test board; a plurality of circuit patterns formed to be partially exposed on the surface of the base layer and rearranged at a pitch corresponding to the external connection pad; a plurality of electrode patterns formed on the first surface to be electrically connected to the circuit patterns and an external connection terminal of a semiconductor device, and arranged at a pitch corresponding to the external connection terminal; and an elastic layer covering the electrode patterns such that the electrode patterns are partially exposed.
    Type: Grant
    Filed: November 30, 2016
    Date of Patent: January 25, 2022
    Assignee: MICRO FRIEND CO., LTD
    Inventors: Yong Ho Cho, Sang Hee Park
  • Publication number: 20220021265
    Abstract: Disclosed are a motor accommodation structural body, an automobile including the motor accommodation structural body, and a method for manufacturing the motor accommodation structural body. According to one aspect of the present disclosure, disclosed is a motor accommodation structural body for accommodating a motor for an automobile, the motor accommodation structural body including: a housing having an empty space formed therein; a guide unit which is provided on an outer surface of the housing, has a shape protruding outward, and extends along a longitudinal direction L of the housing; and a fixing bracket unit having a coupling portion which has one side coupled to the guide unit and the other side coupled to the automobile.
    Type: Application
    Filed: July 13, 2021
    Publication date: January 20, 2022
    Inventors: Yong Ho KIM, Seung Hun KIM, Yeong Woo SEO
  • Publication number: 20220013498
    Abstract: A semiconductor package includes a redistribution layer including, a first insulating layer including a first trench, a first conductive layer including a first conductive region extending along a top surface of the first insulating layer and a second conductive region disposed inside the first trench, a second insulating layer on the first conductive layer and the first insulating layer, the second insulating layer including a second trench at least partially overlapping the first trench, the second trench exposing a part of the first conductive region and a second conductive layer including a third conductive region extending along a top surface of the second insulating layer and a fourth conductive region disposed on the second conductive region inside a via trench including sidewalls of the first trench and the second trench, and wherein the second and fourth conductive regions have a width in a range of 20 ?m to 600 ?m.
    Type: Application
    Filed: March 9, 2021
    Publication date: January 13, 2022
    Applicant: Samsung Electronics Co., Ltd.
    Inventor: Yong Ho KIM
  • Patent number: 11217877
    Abstract: In aspects of managing antenna module heat and RF emissions, an antenna module includes antenna elements that emit radio frequency (RF) signals for wireless data communication. The antenna module also includes an integrated heat sink to dissipate heat generated by an amplifier on the antenna module, where the heat sink is formed as a metallic component having a surface approximately coplanar with the antenna elements. The antenna module also includes one or more grooves that are formed into the surface of the heat sink, where the one or more grooves are effective to allow the RF signals being emitted from the antenna elements without deformation of a radiation pattern of the RF signals.
    Type: Grant
    Filed: January 24, 2020
    Date of Patent: January 4, 2022
    Assignee: Motorola Mobility LLC
    Inventors: Md Rashidul Islam, Chiya Saeidi, Yong-Ho Lim, Hugh K. Smith, Martin Rabindra Pais