Patents by Inventor Yong Ho

Yong Ho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200254108
    Abstract: The present invention relates to a long-acting single-chain insulin analog, a conjugate thereof, and uses of the same. In addition, the present invention relates to a method for preparing a long-acting single-chain insulin analog and a conjugate thereof.
    Type: Application
    Filed: September 28, 2018
    Publication date: August 13, 2020
    Applicant: HANMI PHARM. CO., LTD.
    Inventors: Yong Ho HEO, Euh Lim OH
  • Publication number: 20200260323
    Abstract: A method and a device for receiving transmitting data in in a wireless local area network are provided. The device supports a multiple basic service set and receives and sends physical protocol data units (PPDU's). The PPDU's includes an identifier used to assist the device in identifying a basic service set.
    Type: Application
    Filed: April 30, 2020
    Publication date: August 13, 2020
    Inventor: YONG HO SEOK
  • Patent number: 10741509
    Abstract: An antenna module includes a connection member including at least one wiring layer and at least one insulating layer, an antenna package including a plurality of antenna members transmitting or receiving a radio frequency (RF) signal and a plurality of feed vias respectively electrically connected to the plurality of antenna members at one end and respectively electrically connected to a wiring corresponding to the at least one wiring layer at the other end, and positioned on a first surface of the connection member, an integrated circuit (IC) disposed on a second surface of the connection member and electrically connected to the wiring corresponding to the at least one wiring layer to receive an intermediate frequency (IF) signal or baseband signal and transfer an RF signal or receive an RF signal and transfer an IF signal or baseband signal, and a filter filtering an IF signal or a baseband signal.
    Type: Grant
    Filed: June 15, 2018
    Date of Patent: August 11, 2020
    Assignee: SAMSUNG ELECTRONICS, LTD.
    Inventors: Doo Il Kim, Dae Kwon Jung, Young Sik Hur, Yong Ho Baek
  • Patent number: 10734545
    Abstract: InGaN/GaN quantum layer nanowire light emitting diodes are fabricated into a single cluster capable of exhibiting a wide spectral output range. The nanowires having InGaN/GaN quantum layers formed of quantum dots are tuned to different output wavelengths using different nanowire diameters, for example, to achieve a full spectral output range covering the entire visible spectrum for display applications. The entire cluster is formed using a monolithically integrated fabrication technique that employs a single-step selective area epitaxy growth.
    Type: Grant
    Filed: June 21, 2017
    Date of Patent: August 4, 2020
    Assignee: The Regents of the University of Michigan
    Inventors: Zetian Mi, Yong-Ho Ra, Renjie Wang
  • Publication number: 20200238789
    Abstract: The present invention relates to an air conditioner for a vehicle having a rear seat outlet, which can relieve temperature inversion that discharge temperature of the console vent becomes higher than discharge temperature of a rear seat floor vent in a bi-level mode, and prevent reduction of air volume of the console vent in the cooling mode. The air conditioner for a vehicle, which has a rear seat outlet, includes an air-conditioning case having an air passageway formed therein and a plurality of air outlets, and a cooling heat exchanger and a heating heat exchanger disposed in the air passageway of the air-conditioning case to exchange heat with air passing through the air passageway, wherein the air outlets include a console vent and a rear seat floor vent, and an entrance of the rear seat floor vent is formed above an entrance of the console vent.
    Type: Application
    Filed: January 28, 2020
    Publication date: July 30, 2020
    Inventors: Yong Ho KIM, Chul Hee Kim, Hak Kyu Kim, Byeong Ha Lee, Yong Seon Lee, Jun Min Lee, Jae O Jung, Jae Won Jeong
  • Publication number: 20200245132
    Abstract: A method for sending and receiving multi-carrier information in a communication system supporting a multi-carrier includes sending by a base station system information to the terminal via a broadcast message, the system information regarding multi-carriers that the base station is able to support; receiving a unicast message from the terminal, the unicast message including information related to carriers that the terminal is able to support or prefers in the multi-carrier list included in the system information; and sending multi-carrier allocation information including a primary carrier and a second carrier that the terminal will use, to the terminal via a unicast message.
    Type: Application
    Filed: April 10, 2020
    Publication date: July 30, 2020
    Applicant: LG ELECTRONICS INC.
    Inventors: Yong Ho KIM, Ki Seon RYU, Young Soo YUK, Jeong Ki KIM
  • Publication number: 20200235154
    Abstract: There are provided a fan-out sensor package and an optical fingerprint sensor module including the same. The fan-out sensor package includes: a connection member having a 5 through-hole; an image sensor disposed in the through-hole of the connection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the connection member, the image sensor, and 10 an optical lens; and a redistribution layer disposed on the connection member, the image sensor, and the optical lens. The connection member includes a wiring layer, and the redistribution layer electrically connects the wiring layer and the connection pads to each other.
    Type: Application
    Filed: April 9, 2020
    Publication date: July 23, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yong Ho BAEK, Jung Hyun CHO, Min Keun KIM, Young Sik HUR, Tae Hee HAN
  • Publication number: 20200232658
    Abstract: The present invention relates to a control box and to an outdoor unit of an air conditioner comprising the same; the control box using a refrigerant cooling device and an air cooling device so as to radiate heat efficiently. The control box comprises: a case; a heat-radiating electronic component located inside the case; a refrigerant cooling device which is attached to one side of the case and makes contact with the electronic component so as to radiate heat to the outside; and an air cooling device which is attached to one side of the case and has a circulation fan for forcible circulating the air inside the case. Because the present invention is provided both with the refrigerant cooling device and the air cooling device, the electronic component inside the control box can radiate heat efficiently.
    Type: Application
    Filed: April 2, 2020
    Publication date: July 23, 2020
    Inventors: Jong Tae KIM, Min Wook PARK, Yong Ho LEE, Seong Hwan JANG, Il Kwon JUNG
  • Publication number: 20200228938
    Abstract: A method of transmitting a spatial stream for multi user (MU)-multiple input multiple output (MIMO) in a wireless local area network system and a transmitter for performing the method are provided. The method includes transmitting, to a receiver, a management frame including group information to assign or change a position of a plurality of spatial streams corresponding to each of a plurality of groups, and transmitting, to the receiver, a frame including at least one spatial stream, wherein the group information includes a plurality of group indicators and a plurality of spatial stream (SS) indicators, each of the plurality of group indicators indicating whether the receiver is a member of each of the plurality of groups, each of the plurality of SS indicators indicating a position of the plurality of spatial streams corresponding to each of the plurality of groups.
    Type: Application
    Filed: April 1, 2020
    Publication date: July 16, 2020
    Applicant: LG ELECTRONICS INC.
    Inventors: Dae Won LEE, Yong Ho SEOK
  • Publication number: 20200218313
    Abstract: A foldable device and a method of controlling the same are provided. The foldable device includes: a flexible display which includes a main display area and an edge display area; and a controller which is configured to determine, based on an angle at which the foldable device is unfolded, a range of a partial activation area of the main display area, wherein the range of the partial activation area is partially bounded by a boundary between the edge display area and the main display area.
    Type: Application
    Filed: March 20, 2020
    Publication date: July 9, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jin LA, Yu-dong BAE, Yong-ho KIM, Jong-hyun RYU, Yong-gook PARK, Ae-young LIM, Kyung-ho JEONG, Youn-ho CHOI
  • Publication number: 20200220411
    Abstract: A stator assembly of a hairpin winding motor capable of improving the performance of the winding motor and the insulation performance of a hairpin coil, and includes a stator core through which a plurality of slots pass in a circumferential direction; and a plurality of hairpin coils respectively fastened to and interconnected with the slots to form a coil winding. The hairpin coil includes a head portion bent in a U shape and exposed to the outside of the stator core, and a pair of leg portions configured to extend in parallel from both ends of the head portion to be inserted into a specific slot and the slot spaced apart from the specific slot by one pole pitch and of which end portions are exposed to the outside of the stator core.
    Type: Application
    Filed: December 25, 2019
    Publication date: July 9, 2020
    Inventor: Yong Ho KIM
  • Publication number: 20200214135
    Abstract: There is provided a printed circuit board including: a first insulating layer; a first circuit pattern formed on a first surface of the first insulating layer; an adhesive layer provided on a second surface of the first insulating layer; and an electronic component disposed on the adhesive layer and enclosed by the first insulating layer and a second insulating layer formed on the first insulating layer.
    Type: Application
    Filed: March 9, 2020
    Publication date: July 2, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jung Hyun PARK, Yong Ho BAEK, Jae Hoon CHOI
  • Patent number: 10701806
    Abstract: A printed circuit board includes: a core member including a through-hole; a sub-circuit board disposed in the through-hole; a first insulating layer disposed on opposing surfaces of the core member and opposing surfaces of the sub-circuit board; and an insulating material disposed between an inner wall of the through-hole and the sub-circuit board.
    Type: Grant
    Filed: September 30, 2019
    Date of Patent: June 30, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Yong-Ho Baek, Jung-Hyun Cho, Seung-Yeop Kook
  • Patent number: 10700024
    Abstract: A fan-out semiconductor package includes: a core member having a through-hole; a semiconductor chip disposed in the through-hole; an encapsulant encapsulating at least portions of the core member and the semiconductor chip; and a connection member disposed on the core member and an active surface of the semiconductor chip and including a redistribution layer connected to the connection pads. The core member includes a plurality of wiring layers disposed on different levels, a dielectric is disposed between the plurality of wiring layers of the core member, one of the plurality of wiring layers includes an antenna pattern, the other of the plurality of wiring layers includes a ground pattern, and the antenna pattern is connected to the connection pads through the redistribution layer in a signal manner.
    Type: Grant
    Filed: April 20, 2018
    Date of Patent: June 30, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Won Wook So, Yong Ho Baek, Doo Il Kim, Young Sik Hur
  • Patent number: 10699982
    Abstract: A semiconductor package and a method of manufacturing a semiconductor package are disclosed. The semiconductor package including a first substrate including a first cavity, a cavity mold configured to be inserted into the first cavity and including a second cavity, an electronic component inserted in the second cavity, and a second substrate formed on a surface of the first substrate, a surface of the cavity mold and a surface of the electronic component.
    Type: Grant
    Filed: February 11, 2019
    Date of Patent: June 30, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventor: Yong-Ho Baek
  • Publication number: 20200204413
    Abstract: A method of transmitting a Physical Layer Convergence Procedure (PLCP) frame in a Very High Throughput (VHT) Wireless Local Area Network (WLAN) system includes generating a MAC Protocol Data Unit (MPDU) to be transmitted to a destination station (STA), generating a PLCP Protocol Data Unit (PPDU) by adding a PLCP header, including an L-SIG field containing control information for a legacy STA and a VHT-SIG field containing control information for a VHT STA, to the MPDU, and transmitting the PPDU to the destination STA. A constellation applied to some of Orthogonal Frequency Division Multiplex (OFDM) symbols of the VHT-SIG field is obtained by rotating a constellation applied to an OFDM symbol of the L-SIG field.
    Type: Application
    Filed: February 28, 2020
    Publication date: June 25, 2020
    Inventors: Dae Won LEE, Dong Wook ROH, Byeong Woo KANG, Yong Ho SEOK, Yu Jin NOH, Bong Hoe KIM
  • Patent number: 10692748
    Abstract: The present invention relates to a high-tech temperature control device for a semiconductor manufacturing facility and, more specifically, to a high-tech temperature control device for an electrostatic chuck, which supports a wafer and maintains the temperature in a semiconductor wafer processing process. It is possible to very precisely control a temperature of an electrostatic chuck by maintaining temperatures and a mixing flow rate of a heating heat medium and a cooling heat medium constant and adjusting a mixing ratio. Meanwhile, the heat medium after heating and cooling is collected and reused, thereby efficiently using energy.
    Type: Grant
    Filed: December 1, 2017
    Date of Patent: June 23, 2020
    Assignee: GLOBAL STANDARD TECHNOLOGY CO., LTD.
    Inventors: Jong Bae Kim, Seung Jin Yang, Jae Suk Heo, Chi Won Choi, Je Min Kim, Hyeung Kwan Kim, Yong Ho Choi
  • Patent number: 10688482
    Abstract: A method for olefin oligomerization comprising i) injecting an olefin monomer and a solvent into a continuous stirred tank reactor; ii) injecting an oligomerization catalyst system comprising a ligand compound, a transition metal compound, and a co-catalyst into the continuous stirred tank reactor; and iii) performing a multimerization reaction of the olefin monomer, wherein a ratio of the flowing rates of the olefin monomer and the solvent is from 1:1 to 2:1.
    Type: Grant
    Filed: February 5, 2016
    Date of Patent: June 23, 2020
    Assignee: LG CHEM, LTD.
    Inventors: Yoon Ki Hong, Yong Ho Lee, Eun Ji Shin, Ki Soo Lee, Jin Young Park, Seok Pil Sa, Seul Ki Im
  • Patent number: 10690982
    Abstract: A liquid crystal display according to an exemplary embodiment of the present invention includes a substrate, a plurality of pixels arranged in a matrix on the substrate where each pixel includes a switching element, a plurality of gate lines that are connected to the switching elements and extend in a row direction, and a gate driver that is connected to the gate lines and is formed on the substrate as an integrated circuit. In the liquid crystal display, the gate driver includes a first region and a second region that is not aligned with the first region.
    Type: Grant
    Filed: April 15, 2019
    Date of Patent: June 23, 2020
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Yong-Ho Yang, Joo-Sun Yoon, Ki-Hun Jeong
  • Patent number: 10688473
    Abstract: The present invention relates to a ligand compound, a catalyst system for oligomerization of olefins including the ligand compound and the organic chromium compound, and a method for oligomerizing olefins using the same. The catalyst system for olefin oligomerization according to the present invention invention exhibits high selectivity to 1-hexene or 1-octene while having excellent catalytic activity, thereby enabling more efficient production of alpha-olefins.
    Type: Grant
    Filed: December 2, 2015
    Date of Patent: June 23, 2020
    Assignee: LG CHEM, LTD.
    Inventors: Yong Ho Lee, Eun Ji Shin, Jin Young Park, Seok Pil Sa, Ki Soo Lee