Patents by Inventor Yong-kyun Sun

Yong-kyun Sun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8132305
    Abstract: A package cutting apparatus includes at least two spindles installed at a sawing robot and cutting a frame including a plurality of packages into packages using cutting bits; a frame loading jig loading the frame so that the frame is cut; and a frame-and-unit picker installed at an orthogonal robot to load and unload the frame on and from the frame loading jig, wherein a state of the cutting bit installed at the spindle is checked.
    Type: Grant
    Filed: August 30, 2007
    Date of Patent: March 13, 2012
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Tai-Kew Choi, Yong-Kyun Sun, Hee-Sang Yang, Yo-Se Eum, Ho-Soo Jang
  • Patent number: 7650687
    Abstract: Provided are a die attaching apparatus, a cleaning system and a method having components which can be easily replaced with new ones adapted to various packages within a short period of time. Surfaces of a die pressing member and a heat plate are prevented from being contaminated. The die pressing member is detachably attached to a lower end of an attaching unit which may directly apply a pressure to dies. A heat plate grinder on which a grinding apparatus for grinding the heat plate is mounted is spaced a predetermined distance from the die pressing member. A heat plate cleaner is attached to a side wall of the heat plate grinder and removes residues remaining on the heat plate.
    Type: Grant
    Filed: June 16, 2005
    Date of Patent: January 26, 2010
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jung-Hwan Woo, Ho-Jae Byon, Jae-Bong Shin, Yong-Kyun Sun, Hyun-Ho Kim, Choo-Ho Kim, Youn-Sung Ko
  • Patent number: 7602171
    Abstract: A system for testing memory modules having a rotating-type board mounting portion with a plurality of mounting surfaces positioned at different planes and connected around an axis to form a rotatable structure, at least one circuit board mounted on each mounting surface, an input/output portion, a rotational motor coupled to a rotational shaft for rotating the rotatable structure, and a central controller electrically connected to the circuit boards.
    Type: Grant
    Filed: September 12, 2006
    Date of Patent: October 13, 2009
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sun Choi, Dong-soo Lee, Yong-kyun Sun, Hyun-ho Kim
  • Publication number: 20080090311
    Abstract: A dipping detecting device used in the fabrication of semiconductor devices. The dipping detecting device includes a gripper used as a conductive first electrode and configured to pick up a semiconductor device in order to dip the semiconductor device into a dipping solution. A conductor used as a second electrode and formed at a side of the gripper. The conductor electrically insulated from the gripper. A power source unit applying a power to the gripper and the conductor and detecting a current flow, wherein a dipping state of the semiconductor device is detected depending on the flow of current.
    Type: Application
    Filed: September 20, 2007
    Publication date: April 17, 2008
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-joo ROH, Yong-kyun SUN, Youn-sung KO
  • Publication number: 20080056832
    Abstract: A package cutting apparatus includes at least two spindles installed at a sawing robot and cutting a frame including a plurality of packages into packages using cutting bits; a frame loading jig loading the frame so that the frame is cut; and a frame-and-unit picker installed at an orthogonal robot to load and unload the frame on and from the frame loading jig, wherein a state of the cutting bit installed at the spindle is checked.
    Type: Application
    Filed: August 30, 2007
    Publication date: March 6, 2008
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Tai-Kew CHOI, Yong-Kyun SUN, Hee-Sang YANG, Yo-Se EUM, Ho-Soo JANG
  • Publication number: 20070138466
    Abstract: An apparatus for testing a semiconductor module may include a test shelf, test modules and a transfer robot. The test shelf may include multilayered test cells in which a plurality of test cells may be arranged in each of a plurality of layers. The test modules may be each provided in the test cells. The transfer robot may insert the semiconductor module into the test module. The transfer robot may separate the semiconductor module from the test module.
    Type: Application
    Filed: November 28, 2006
    Publication date: June 21, 2007
    Inventors: Dong-Soo Lee, Seon-O Kim, Yong-Kyun Sun, Hyo-Gyu Kim
  • Publication number: 20070079187
    Abstract: A system for testing memory modules having a rotating-type board mounting portion with a plurality of mounting surfaces positioned at different planes and connected around an axis to form a rotatable structure, at least one circuit board mounted on each mounting surface, an input/output portion, a rotational motor coupled to a rotational shaft for rotating the rotatable structure, and a central controller electrically connected to the circuit boards.
    Type: Application
    Filed: September 12, 2006
    Publication date: April 5, 2007
    Inventors: Sun Choi, Dong-soo Lee, Yong-kyun Sun, Hyun-ho Kim
  • Publication number: 20060266792
    Abstract: A multi-chip die bonder may include a first substrate conveyor conveying a substrate in a first direction and a second substrate conveyor conveying a substrate in a second direction. A plurality of dies may be stacked onto the substrate while the substrate is circulating the first substrate conveyor and the second substrate conveyor. A first heater may be provided in a die bonding unit and a second heater may be provided in the first substrate conveyor. An adhesive curing process may be performed together with a die attaching process.
    Type: Application
    Filed: October 24, 2005
    Publication date: November 30, 2006
    Inventors: Youn-Sung Ko, Choo-Ho Kim, Hyun-Ho Kim, Yong-Kyun Sun, Byung-Joon Lee, Il-Sup Choi, Jung-Hwan Woo
  • Publication number: 20060056955
    Abstract: A sawing and sorting system combines a sawing apparatus and a sorting apparatus. The sawing and sorting system comprises a loader. The loader comprises a magazine receiving a plurality of strips. A mounting unit mounts the strip thereon. A plurality of transfer and sawing robots each comprises a picker unit. The picker unit comprises a rotatable chuck table. The transfer and sawing robot transfers the picker unit horizontally and vertically. The rotatable chuck table holds the strip. The picker unit rotates the rotatable chuck table. A plurality of sawing spindle units each comprises a rotary blade. The sawing spindle unit moves the blade horizontally to divide the strip into unit packages. A cleaning unit cleans the unit package. A test means inspects the unit package according to a test criteria. A sorting table mounts the unit package for sorting. An unloader provides trays. A sorting transfer robot sorts the unit packages into the trays.
    Type: Application
    Filed: September 6, 2005
    Publication date: March 16, 2006
    Inventors: Yong-Kuk Kim, Hyun-Ho Kim, Ho-Seong Kim, Yong-Kyun Sun, Tai-Kew Choi
  • Publication number: 20060048381
    Abstract: Provided are a die attaching apparatus, a cleaning system and a method having components which can be easily replaced with new ones adapted to various packages within a short period of time. Surfaces of a die pressing member and a heat plate are prevented from being contaminated. The die pressing member is detachably attached to a lower end of an attaching unit which may directly apply a pressure to dies. A heat plate grinder on which a grinding apparatus for grinding the heat plate is mounted is spaced a predetermined distance from the die pressing member. A heat plate cleaner is attached to a side wall of the heat plate grinder and removes residues remaining on the heat plate.
    Type: Application
    Filed: June 16, 2005
    Publication date: March 9, 2006
    Inventors: Jung-Hwan Woo, Ho-Jae Byon, Jae-Bong Shin, Yong-Kyun Sun, Hyun-Ho Kim, Choo-Ho Kim, Youn-Sung Ko
  • Patent number: 6105567
    Abstract: A wafer sawing apparatus scribes a wafer having a plurality of ICs which are separated from each other by a plurality of scribe streets so as to cut the wafer into individual ICs. During scribing, silicon particles are produced and heat is generated as the scribing blade abrades the wafer surface. These silicon particles may remain on the surface of the ICs and cause defects in later manufacturing processes. Therefore, the wafer sawing apparatus has two side nozzles, one positioned on each side of the scribing blade to spray a washing solution onto the scribing blade and a top surface of the wafer through an arc having a designated angle, and a center nozzle which is positioned adjacent to and ahead of a cutting edge of the scribing blade in the driving direction, which also sprays the washing solution onto the scribing blade and the top surface of the wafer at a designated downward angle.
    Type: Grant
    Filed: February 5, 1998
    Date of Patent: August 22, 2000
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yong Kyun Sun, Sam Bok Jang, Dong Sung Jang