Patents by Inventor Yong Sheng

Yong Sheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11723207
    Abstract: The present disclosure relates to an integrated chip comprising a substrate having a first pair of opposing sidewalls that define a trench. The trench extends into a front-side surface of the substrate. A first source/drain region is disposed along the front-side surface of the substrate. A second source/drain region is disposed along the front-side surface of the substrate. A gate structure is disposed within the trench and is arranged laterally between the first source/drain region and the second source/drain region. The gate structure extends along the first pair of opposing sidewalls to an upper surface of the substrate. A bottom surface of the gate structure is disposed below a bottom surface of the first source/drain region.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: August 8, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yong-Sheng Huang, Ming Chyi Liu
  • Publication number: 20230185294
    Abstract: An energy storage device includes a sensor, a communication circuit and a processor. The sensor is configured to detect an abnormal event occurred in the energy storage device. The communication circuit is configured to connect to a local area network. The local area network includes a plurality of nodes formed by the energy storage device and other energy storage devices. The processor is configured to generate, according to the abnormal event detected by the sensor, historical usage data recording the abnormal event. In response to a trigger event, the processor is further configured to: update the historical usage data; and control the communication circuit to transmit at least part of the updated historical usage data to at least one energy storage device adjacent to the energy storage device in the local area network.
    Type: Application
    Filed: December 14, 2022
    Publication date: June 15, 2023
    Inventors: Liang-Yi Hsu, I-Sheng Chen, Yong-Sheng Chen, Wei-Tsung Huang
  • Publication number: 20230143082
    Abstract: A device includes an active region, a select gate, a control gate, a first metal alloy layer, and a second metal alloy layer. The active region has a source region and a drain region. The select gate is over the active region and between the source region and the drain region. The control gate is over the active region and between the source region and the select gate. The first metal alloy layer is in contact with the source region. The second metal alloy layer is in contact with the drain region and higher than a top surface of the control gate.
    Type: Application
    Filed: January 2, 2023
    Publication date: May 11, 2023
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yong-Sheng HUANG, Ming-Chyi LIU
  • Publication number: 20230117612
    Abstract: Various embodiments of the present disclosure are directed towards a method for opening a source line in a memory device. An erase gate line (EGL) and the source line are formed elongated in parallel. The source line underlies the EGL and is separated from the EGL by a dielectric layer. A first etch is performed to form a first opening through the EGL and stops on the dielectric layer. A second etch is performed to thin the dielectric layer at the first opening, wherein the first and second etches are performed with a common mask in place. A silicide process is performed to form a silicide layer on the source line at the first opening, wherein the silicide process comprises a third etch with a second mask in place and extends the first opening through the dielectric layer. A via is formed extending through the EGL to the silicide layer.
    Type: Application
    Filed: December 19, 2022
    Publication date: April 20, 2023
    Inventors: Yong-Sheng Huang, Ming Chyi Liu, Chih-Pin Huang
  • Publication number: 20230120806
    Abstract: A convolution operation method includes: configuring an operation apparatus according to a partition rule; reading an operation data partition; reading a depthwise convolution parameter partition to perform a depthwise weighting operation to generate a depthwise weighted partition; performing a depthwise offset operation to generate a depthwise convolution operation result partition; reading a pointwise convolution parameter partition to perform a pointwise weighting operation on the depthwise convolution operation result partition to generate a pointwise weighted partition, and performing an accumulation process in a depth dimension to generate an output partition; when the output partition meets operation criteria in the depth dimension, performing a pointwise offset operation on the output partition to generate and output a pointwise convolution operation result partition; and when the output partition does not meet the operation criteria in the depth dimension, configuring the output partition to be a pre
    Type: Application
    Filed: July 6, 2022
    Publication date: April 20, 2023
    Inventor: Yong-Sheng CHEN
  • Publication number: 20230067382
    Abstract: The present disclosure relates to an integrated chip comprising a substrate having a first pair of opposing sidewalls that define a trench. The trench extends into a front-side surface of the substrate. A first source/drain region is disposed along the front-side surface of the substrate. A second source/drain region is disposed along the front-side surface of the substrate. A gate structure is disposed within the trench and is arranged laterally between the first source/drain region and the second source/drain region. The gate structure extends along the first pair of opposing sidewalls to an upper surface of the substrate. A bottom surface of the gate structure is disposed below a bottom surface of the first source/drain region.
    Type: Application
    Filed: August 27, 2021
    Publication date: March 2, 2023
    Inventors: Yong-Sheng Huang, Ming Chyi Liu
  • Patent number: 11587939
    Abstract: Various embodiments of the present disclosure are directed towards a method for opening a source line in a memory device. An erase gate line (EGL) and the source line are formed elongated in parallel. The source line underlies the EGL and is separated from the EGL by a dielectric layer. A first etch is performed to form a first opening through the EGL and stops on the dielectric layer. A second etch is performed to thin the dielectric layer at the first opening, wherein the first and second etches are performed with a common mask in place. A silicide process is performed to form a silicide layer on the source line at the first opening, wherein the silicide process comprises a third etch with a second mask in place and extends the first opening through the dielectric layer. A via is formed extending through the EGL to the silicide layer.
    Type: Grant
    Filed: January 27, 2022
    Date of Patent: February 21, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yong-Sheng Huang, Ming Chyi Liu, Chih-Pin Huang
  • Publication number: 20230050689
    Abstract: There is provided a method of synthesizing a porous carbon-sulfur composite comprising the step of carbonizing a carbon material having a metal-organic framework (MOF) at a temperature of 800-1000° C. to produce a porous carbon, mixing and heating the porous carbon with sulfur to infuse the sulfur (melt diffusion) into the pores of the porous carbon and removing excess sulfur not infused into the pores or present on the surface of the porous carbon. There is also provided a cathode comprising the porous carbon-sulfur composite and a method of preparing the cathode by mixing with conductive carbon and a polymer binder. The cathode finds use in an electrochemical cell comprising a sodium or lithium anode.
    Type: Application
    Filed: November 27, 2020
    Publication date: February 16, 2023
    Inventors: Yong WANG, Yong Sheng Alex ENG, Zhi Wei SEH
  • Publication number: 20230005115
    Abstract: A method (400) of capturing and processing electroluminescence (EL) images (1910) of a PV array (40) is disclosed herein.
    Type: Application
    Filed: December 30, 2020
    Publication date: January 5, 2023
    Applicant: Quantified Energy Labs Pte. Ltd.
    Inventors: Karl Georg BEDRICH, Yong Sheng KHOO, Yan WANG
  • Patent number: 11545584
    Abstract: A memory device includes an active region, a select gate, a control gate, and a blocking layer. The active region includes a bottom portion and a protruding portion protruding from the bottom portion. A source is in the bottom portion and a drain is in the protruding portion. The select gate is above the bottom portion. A top surface of the select gate is lower than a top surface of the protruding portion. The control gate is above the bottom portion. The blocking layer is between the select gate and the control gate.
    Type: Grant
    Filed: April 14, 2021
    Date of Patent: January 3, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yong-Sheng Huang, Ming-Chyi Liu
  • Publication number: 20220406109
    Abstract: A distance determination method has: detecting a first received signal strength indicator (RSSI) of a first electronic device by a second electronic device; detecting a second RSSI of the second electronic device by the first electronic device; obtaining the first RSSI from the second electronic device by the first electronic device; and calculating a motion direction and a distance of the second electronic device relative to the first electronic device according to the first RSSI and the second RSSI by the first electronic device.
    Type: Application
    Filed: June 2, 2022
    Publication date: December 22, 2022
    Inventors: Liang-Yi Hsu, I-Sheng Chen, Yong-Sheng Chen, Wei-Tsung Huang
  • Publication number: 20220336605
    Abstract: The present disclosure relates to an integrated chip comprising a substrate having a first top surface disposed at a first height, a second top surface disposed at a second height that is less than the first height, and a connecting surface extending from the first top surface to the second top surface. A first source/drain region is disposed along the first top surface of the substrate. A second source/drain region is disposed along the second top surface of the substrate and is laterally separated from the first source/drain region by a channel region of the substrate. A gate structure is arranged between the first source/drain region and the second source/drain region. The gate structure extends from over the first top surface of the substrate to over the connecting surface of the substrate. The gate structure also extends below the first top surface of the substrate.
    Type: Application
    Filed: June 30, 2022
    Publication date: October 20, 2022
    Inventors: Yong-Sheng Huang, Ming Chyi Liu
  • Publication number: 20220325092
    Abstract: There is provided a composite comprising a) a short chain sulfur; and b) a carbon-supported conductive polymer such as polyacrylonitrile, wherein sulfur atoms of said short chain sulfur are covalently linked to the conductive polymer of said carbon-supported conductive polymer via a C—S bond. A method of preparing said composite comprising polymerizing a plurality of monomers in the presence of a carbon scaffold, mixing elemental sulfur and heating the mixture to obtain said composite is also disclosed. An electrochemical cell comprising said composite as cathode, a sodium anode and a liquid electrolyte such as sodium trifluoromethanesulfonate dissolved in a mixture of solvents is disclosed.
    Type: Application
    Filed: August 26, 2020
    Publication date: October 13, 2022
    Inventors: Alex Yong Sheng ENG, Zhi Wei SEH
  • Patent number: 11462563
    Abstract: A memory device and a manufacturing method are provided. The method includes: forming a first conductive pattern on a substrate; forming an active structure over the first conductive pattern, wherein the active structure comprises a gate pattern, a channel pillar and a charge storage layer, the channel pillar penetrates the gate pattern and electrically connects with the first conductive pattern, and the charge storage layer is disposed between the gate pattern and the channel pillar; forming a second conductive pattern over the active structure, wherein the second conductive pattern is electrically connected with the channel pillar; and performing formation of the active structure one more time, such that the channel pillars of the active structures are vertically spaced apart from each other, and electrically connected to the second conductive pattern extending in between the channel pillars.
    Type: Grant
    Filed: September 4, 2020
    Date of Patent: October 4, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company Ltd.
    Inventors: Yong-Sheng Huang, Ming-Chyi Liu
  • Patent number: 11455287
    Abstract: Embodiments are described for a system and method to analyze data at a plurality of data sources. A data analytic workflow may be received. The data analytic workflow may include at least one operation to be performed on a plurality of data sets stored at a plurality of data sources. Instructions may be created based on the operation to be performed and a type of platform that operates the data sources. Furthermore, the instructions may be transmitted to the data sources such that the data sources may execute the operations on the data sets stored at the data sources.
    Type: Grant
    Filed: August 1, 2013
    Date of Patent: September 27, 2022
    Assignee: TIBCO Software Inc.
    Inventors: Steven Hillion, Yi-Ling Chen, Zhe Dong, Yong-Sheng Yu, Yong Zhao
  • Publication number: 20220302453
    Abstract: A carbonized composite comprising a sulfur chain and a conductive network, wherein said sulfur chain is covalently bonded to said conductive network via one or more C—S bonds. The present disclosure also provides a method of preparing the carbonized composite disclosed herein. The carbonized composite may be used in electrochemical cells comprising a reactive metal anode.
    Type: Application
    Filed: August 26, 2020
    Publication date: September 22, 2022
    Inventors: Yong Sheng Alex Eng, Zhi Wei Seh
  • Patent number: 11417741
    Abstract: The present disclosure relates to an integrated chip comprising a substrate having a first top surface disposed at a first height, a second top surface disposed at a second height that is less than the first height, and a connecting surface extending from the first top surface to the second top surface. A first source/drain region is disposed along the first top surface of the substrate. A second source/drain region is disposed along the second top surface of the substrate and is laterally separated from the first source/drain region by a channel region of the substrate. A gate structure is arranged between the first source/drain region and the second source/drain region. The gate structure extends from over the first top surface of the substrate to over the connecting surface of the substrate. The gate structure also extends below the first top surface of the substrate.
    Type: Grant
    Filed: November 20, 2020
    Date of Patent: August 16, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yong-Sheng Huang, Ming Chyi Liu
  • Publication number: 20220165859
    Abstract: The present disclosure relates to an integrated chip comprising a substrate having a first top surface disposed at a first height, a second top surface disposed at a second height that is less than the first height, and a connecting surface extending from the first top surface to the second top surface. A first source/drain region is disposed along the first top surface of the substrate. A second source/drain region is disposed along the second top surface of the substrate and is laterally separated from the first source/drain region by a channel region of the substrate. A gate structure is arranged between the first source/drain region and the second source/drain region. The gate structure extends from over the first top surface of the substrate to over the connecting surface of the substrate. The gate structure also extends below the first top surface of the substrate.
    Type: Application
    Filed: November 20, 2020
    Publication date: May 26, 2022
    Inventors: Yong-Sheng Huang, Ming Chyi Liu
  • Publication number: 20220149059
    Abstract: Various embodiments of the present disclosure are directed towards a method for opening a source line in a memory device. An erase gate line (EGL) and the source line are formed elongated in parallel. The source line underlies the EGL and is separated from the EGL by a dielectric layer. A first etch is performed to form a first opening through the EGL and stops on the dielectric layer. A second etch is performed to thin the dielectric layer at the first opening, wherein the first and second etches are performed with a common mask in place. A silicide process is performed to form a silicide layer on the source line at the first opening, wherein the silicide process comprises a third etch with a second mask in place and extends the first opening through the dielectric layer. A via is formed extending through the EGL to the silicide layer.
    Type: Application
    Filed: January 27, 2022
    Publication date: May 12, 2022
    Inventors: Yong-Sheng Huang, Ming Chyi Liu, Chih-Pin Huang
  • Publication number: 20220147364
    Abstract: The present disclosure provides a server baseboard, relates to the field of computer technology and can be applied to the fields of cloud computing and big data. A specific implementation scheme is that the server baseboard includes: a main control program module, a switch chip connected to the main control program module, and a plurality of physical network ports for connecting the switch chip to a management network and a baseboard other than the baseboard where the main control program module is located. The server baseboard can reduce the construction cost of the management network, and improve the availability of a server and the security of a service network. The present disclosure also provides a server, a control method, an electronic apparatus, and a readable medium.
    Type: Application
    Filed: June 4, 2021
    Publication date: May 12, 2022
    Inventors: Zhaogeng LI, Yong SHENG, Gang CHENG, Fangyao CHEN, Jie ZHAO