Patents by Inventor Yong Sung Eom

Yong Sung Eom has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160094258
    Abstract: Provided are a transceiver module and a communication apparatus including the same. The transceiver module includes a lower substrate, a thermoelectric device on the lower substrate, and an upper substrate which is disposed on the thermoelectric device and on which high frequency devices cooled by the thermoelectric device are mounted. The upper substrate includes a ceramic printed circuit board (PCB).
    Type: Application
    Filed: September 17, 2015
    Publication date: March 31, 2016
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Hyun-cheol BAE, Yong Sung EOM, Haksun LEE, KWANG-SEONG CHOI
  • Publication number: 20150364445
    Abstract: Provided is a stack module package including: a first substrate where a first device is mounted, and a second substrate where a second device is mounted. The second substrate has a greater thickness than the first substrate, and the second device has a greater thickness than the first device. The first and second devices are vertically connected to each other.
    Type: Application
    Filed: April 13, 2015
    Publication date: December 17, 2015
    Inventors: Kwang Seong CHOI, Hyun Cheol BAE, Yong Sung EOM, Haksun LEE
  • Patent number: 9155236
    Abstract: Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The composition for an anisotropic conductive adhesive includes a low melting point solder particle and a thermo-curable polymer resin. The anisotropic conductive adhesive includes forming a mixture by mixing a polymer resin and a curing agent, and mixing a deforming agent, a catalyst or a reductant with the mixture.
    Type: Grant
    Filed: July 8, 2014
    Date of Patent: October 6, 2015
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Yong Sung Eom, Jong Tae Moon, Sangwon Oh, Keonsoo Jang
  • Publication number: 20150237739
    Abstract: The present invention relates to a pattern-forming composition used to form a conductive circuit pattern. The pattern-forming composition comprises Cu powders, a solder for electrically coupling the Cu powders, a polymer resin, a curing agent and a reductant. According to the present invention, a circuit pattern having superior conductivity can be formed at low cost.
    Type: Application
    Filed: May 5, 2015
    Publication date: August 20, 2015
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Yong Sung EOM, Kwang-Seong CHOI, Hyun-cheol BAE, Jung Hyun NOH, Jong Tae MOON
  • Publication number: 20150228617
    Abstract: Provided is a semiconductor device and a method of manufacturing the same. In the method of manufacturing a semiconductor device, a substrate is prepared which is transparent and has a plurality of first electrodes thereon, and a semiconductor chip having a plurality of second electrodes thereon is disposed on the substrate to allow the first and second electrodes to respectively face each other. A polymer layer including solder particles and an oxidizing agent is formed between the substrate and the semiconductor chip, and the solder particles is locally fused between the first and second electrodes by using a laser beam and a fused solder layer is formed which electrically connects between the first and second electrodes.
    Type: Application
    Filed: July 22, 2014
    Publication date: August 13, 2015
    Inventors: Haksun LEE, KWANG-SEONG CHOI, Yong Sung EOM, Hyun-cheol BAE
  • Patent number: 9034750
    Abstract: A method of fabricating a solder-on-pad structure is provided. The method may include providing a substrate with a pad, coating a solder bump maker including a first resin and a solder powder on the substrate, heating the solder bump maker to a temperature lower than a melting point of the solder powder to aggregate the solder powder on the pad, and removing the first resin.
    Type: Grant
    Filed: March 18, 2013
    Date of Patent: May 19, 2015
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Kwang-Seong Choi, Ho-eun Bae, Hyun-cheol Bae, Yong Sung Eom, Su Jeong Jeon
  • Patent number: 9006037
    Abstract: Provided are methods of forming a bump and a semiconductor device with the same. The method may include providing a substrate with pads, forming a bump maker layer to cover the pads and include a resin and solder particles, thermally treating the bump maker layer to aggregate the solder particles onto the pads, removing the resin to expose the aggregated solder particles, forming a resin layer to cover the aggregated solder particles, and reflowing the aggregated solder particles to form bumps on the pads.
    Type: Grant
    Filed: May 29, 2013
    Date of Patent: April 14, 2015
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Kwang-Seong Choi, Yong Sung Eom, Hyun-cheol Bae, Haksun Lee
  • Publication number: 20150043175
    Abstract: Provided is a bonding structure of an electronic equipment including first electrodes extended in a first direction and arranged in a second direction on a stretchable display panel having stretchability, second electrodes extended in a first direction and arranged in a second direction on a substrate and facing the first electrodes, and solder bonding parts interposed between the first electrodes and the second electrodes, facing each other in the second direction, and constituting a plurality of rows in the first direction.
    Type: Application
    Filed: March 18, 2014
    Publication date: February 12, 2015
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: KWANG-SEONG CHOI, Hyun-cheol BAE, Haksun LEE, Yong Sung EOM
  • Publication number: 20140367375
    Abstract: Provided is a method of fabricating a solder particle including adding a first magnetic bar in a first container including a mixture containing first solder particles formed through a mixing process, disposing the first container in a second container including a second magnetic bar, operating the first magnetic bar and the second magnetic bar, and applying heat to the first container to melt the first solder particles.
    Type: Application
    Filed: November 25, 2013
    Publication date: December 18, 2014
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Hyun-cheol BAE, Yong Sung EOM, KWANG-SEONG CHOI, Haksun LEE
  • Publication number: 20140317915
    Abstract: Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The composition for an anisotropic conductive adhesive includes a low melting point solder particle and a thermo-curable polymer resin. The anisotropic conductive adhesive includes forming a mixture by mixing a polymer resin and a curing agent, and mixing a deforming agent, a catalyst or a reductant with the mixture.
    Type: Application
    Filed: July 8, 2014
    Publication date: October 30, 2014
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Yong Sung EOM, Jong Tae MOON, Sangwon OH, Keonsoo JANG
  • Publication number: 20140317918
    Abstract: Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The composition for an anisotropic conductive adhesive includes a low melting point solder particle and a thermo-curable polymer resin. The anisotropic conductive adhesive includes forming a mixture by mixing a polymer resin and a curing agent, and mixing a deforming agent, a catalyst or a reductant with the mixture.
    Type: Application
    Filed: July 8, 2014
    Publication date: October 30, 2014
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Yong Sung EOM, Jong Tae MOON, Sangwon OH, Keonsoo JANG
  • Publication number: 20140318615
    Abstract: A conductive composition for a front electrode busbar of a silicon solar cell includes a metallic powder, a solder powder, a curable resin, a reducing agent, and a curing agent. A method of manufacturing a front electrode busbar of a silicon solar cell includes applying the composition to the front surface of the silicon solar cell wherein its front electrode finger line is formed. A substrate includes a front electrode busbar of a silicon solar cell, formed with a conductive composition. A silicon solar cell includes one or more electrodes containing a conductive composition including a conductive powder, a curable resin, a reducing agent, and a curing agent. A method of manufacturing the silicon solar cell includes forming a first electrode array with a first conductive composition, forming a second electrode, and forming a third electrode with a third conductive composition.
    Type: Application
    Filed: July 7, 2014
    Publication date: October 30, 2014
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Soo Young OH, Yong Sung EOM, Jong Tae MOON, Kwang Seong CHOI
  • Publication number: 20140287556
    Abstract: Provided are methods of forming a bump and a semiconductor device with the same. The method may include providing a substrate with pads, forming a bump maker layer to cover the pads and include a resin and solder particles, thermally treating the bump maker layer to aggregate the solder particles onto the pads, removing the resin to expose the aggregated solder particles, forming a resin layer to cover the aggregated solder particles, and reflowing the aggregated solder particles to form bumps on the pads.
    Type: Application
    Filed: May 29, 2013
    Publication date: September 25, 2014
    Inventors: Kwang-Seong CHOI, Yong Sung EOM, Hyun-cheol BAE, Haksun LEE
  • Patent number: 8802760
    Abstract: Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The composition for an anisotropic conductive adhesive includes a low melting point solder particle and a thermo-curable polymer resin. The anisotropic conductive adhesive includes forming a mixture by mixing a polymer resin and a curing agent, and mixing a deforming agent, a catalyst or a reductant with the mixture.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: August 12, 2014
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Yong Sung Eom, Jong Tae Moon, Sangwon Oh, Keonsoo Jang
  • Patent number: 8794502
    Abstract: Disclosed are a method of forming a solder on pad on a fine pitch PCB and a method of flip chip bonding a semiconductor device using the same. The method of forming a solder on pad on a fine pitch PCB includes: applying a solder bump maker (SBM) paste with a predetermined thickness to an entire surface of a PCB including a metal pad and a solder mask; heating the SBM paste at a temperature higher than a melting point of solder contained in the SBM paste and then cooling the SBM paste to form a solder on pad; and washing a residual polymer resin and residual solder particles of the SBM paste by using a solvent.
    Type: Grant
    Filed: February 6, 2013
    Date of Patent: August 5, 2014
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Yong Sung Eom, Kwang-Seong Choi, Jung Hyun Noh
  • Publication number: 20140117070
    Abstract: A method of fabricating a solder-on-pad structure is provided. The method may include providing a substrate with a pad, coating a solder bump maker including a first resin and a solder powder on the substrate, heating the solder bump maker to a temperature lower than a melting point of the solder powder to aggregate the solder powder on the pad, and removing the first resin.
    Type: Application
    Filed: March 18, 2013
    Publication date: May 1, 2014
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Kwang-Seong Choi, Ho-eun Bae, Hyun-cheol Bae, Yong Sung EOM, Su Jeong Jeon
  • Publication number: 20140062786
    Abstract: Provided is a sensing device having a multi beam antenna array. The sensing device includes an antenna array including a plurality of antennas, a plurality of low noise amplifiers respectively connected to the antennas to amplify radio frequency signals received from the respective antennas, a delay line box including a plurality of delay lines, each delay line delaying the signals amplified by the low noise amplifiers for a predetermined time, and a detector detecting the output signals of the delay ling box.
    Type: Application
    Filed: August 23, 2013
    Publication date: March 6, 2014
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Dong Suk JUN, Yong Sung EOM, Hyun Seo KANG, Moo Jung CHU, Soo Young OH
  • Publication number: 20130334291
    Abstract: Disclosed are a method of forming a solder on pad on a fine pitch PCB and a method of flip chip bonding a semiconductor device using the same. The method of forming a solder on pad on a fine pitch PCB includes: applying a solder bump maker (SBM) paste with a predetermined thickness to an entire surface of a PCB including a metal pad and a solder mask; heating the SBM paste at a temperature higher than a melting point of solder contained in the SBM paste and then cooling the SBM paste to form a solder on pad; and washing a residual polymer resin and residual solder particles of the SBM paste by using a solvent.
    Type: Application
    Filed: February 6, 2013
    Publication date: December 19, 2013
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Yong Sung EOM, Kwang-Seong Choi, Jung Hyun Noh
  • Patent number: 8547278
    Abstract: A sensing device may include an antenna. The antenna may include a top wafer and a bottom wafer coupled to the top wafer. The antenna may further include an air cavity between the top wafer and the bottom wafer. The sensing device may further include a substrate and an interposer disposed between the antenna and the substrate.
    Type: Grant
    Filed: April 30, 2010
    Date of Patent: October 1, 2013
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Dong Suk Jun, Yong Sung Eom, Hyun Seo Kang, Moo Jung Chu, Soo Young Oh
  • Patent number: 8524571
    Abstract: Disclosed is a vacuum wafer level packaging method for a micro electro mechanical system device, including: forming a plurality of via holes on an upper wafer for protecting a micro electro mechanical system (MEMS) wafer; forming at least one metal layer on inner walls of the plurality of via holes and regions extended from the plurality of via holes; arranging and bonding the upper wafer and the MEMS wafer at atmospheric pressure; applying solder paste to the regions extended from the plurality of via holes; filling a solder in the plurality of via holes by increasing the temperature of a high-vacuum chamber to melt the solder paste; and changing the solder in the plurality of via holes to a solid state by lowering the temperature of the high-vacuum chamber.
    Type: Grant
    Filed: December 2, 2011
    Date of Patent: September 3, 2013
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Jong Tae Moon, Yong Sung Eom, Hyun-Cheol Bae