Patents by Inventor Yonggang Li

Yonggang Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7485017
    Abstract: A microelectronic package substrate and an electrically conductive pin. The substrates includes: a die-side surface adapted to receive a die thereon; a printed circuit board (PCB)-side surface adapted to be mechanically and electrically bonded to a PCB; an array of land pads on the PCB-side surface, the land pads defining anchoring recesses therein; an array of electrically conductive pins electrically and mechanically bonded to respective ones of the land pads, the pins having anchoring elements thereon mated with corresponding ones of the anchoring recesses of the land pads, the anchoring elements and anchoring recesses being configured such that a mating thereof inhibits a tilting of the pins on the land pads; and a plurality of pin-attach solder joints mechanically and electrically bonding the pins to corresponding ones of the land pads.
    Type: Grant
    Filed: June 5, 2007
    Date of Patent: February 3, 2009
    Assignee: Intel Corporation
    Inventors: Mengzhi Pang, Yonggang Li
  • Publication number: 20090004403
    Abstract: A method of providing a patterned conductive layer. The method includes: providing a build-up layer comprising an insulating material; laser irradiating selected portions of the build-up layer according to a predetermined pattern of the patterned conductive layer to be provided, laser irradiating comprising using a laser beam having a photon energy higher than a bonding energy of at least some of the chemical bonds of the insulating material to yield predetermined laser-weakened portions of the build-up layer according to the predetermined pattern; removing the laser-weakened portions of the build-up layer to yield recesses according to the predetermined pattern; and filling the recesses with a conductive material to yield the patterned conductive layer.
    Type: Application
    Filed: June 29, 2007
    Publication date: January 1, 2009
    Inventor: Yonggang Li
  • Publication number: 20090002958
    Abstract: A method of fabricating a substrate core structure comprises, providing first and second patterned conductive layers defining openings therein on each side of a starting insulating layer; providing a first and a second supplemental insulating layers onto respective ones of a first and a second patterned conductive layer; laser drilling a set of via openings extending through at least some of the conductive layer openings of the first and second patterned conductive layers; filling the set of via openings with a conductive material to provide a set of conductive vias; and providing a first and a second supplemental patterned conductive layer onto respective ones of the first and the second supplemental insulating layers, the set of conductive vias contacting the first supplemental patterned conductive layer at one side thereof and the second supplemental patterned conductive layer at another side thereof.
    Type: Application
    Filed: June 28, 2007
    Publication date: January 1, 2009
    Inventors: Yonggang Li, Islam Salama, Charan Gurumurthy, Hamid Azimi
  • Publication number: 20090001550
    Abstract: A method of fabricating a substrate core structure, and a substrate core structure formed according to the method. The method includes: laser drilling a first set of via openings through a starting insulating layer; filling the first set of via openings with a conductive material to provide a first set of conductive vias; providing first and second patterned conductive layers on opposite sides of the starting insulating layer; providing a supplemental insulating layer onto the first patterned conductive layer; laser drilling a second set of via openings through the supplemental insulating layer; filling the second set of via openings with a conductive material to provide a second set of conductive vias; and providing a supplemental patterned conductive layer onto an exposed side of the supplemental insulating layer, the second set of conductive vias contacting the first patterned conductive layer and the supplemental patterned conductive layer at opposite sides thereof.
    Type: Application
    Filed: June 28, 2007
    Publication date: January 1, 2009
    Inventors: Yonggang Li, Islam Salama, Charan Gurumurthy
  • Publication number: 20080305655
    Abstract: A microelectronic package substrate and an electrically conductive pin. The substrates includes: a die-side surface adapted to receive a die thereon; a PCB-side surface adapted to be mechanically and electrically bonded to a PCB; an array of land pads on the PCB-side surface, the land pads defining anchoring recesses therein; an array of electrically conductive pins electrically and mechanically bonded to respective ones of the land pads, the pins having anchoring elements thereon mated with corresponding ones of the anchoring recesses of the land pads, the anchoring elements and anchoring recesses being configured such that a mating thereof inhibits a tilting of the pins on the land pads; and a plurality of pin-attach solder joints mechanically and electrically bonding the pins to corresponding ones of the land pads.
    Type: Application
    Filed: June 5, 2007
    Publication date: December 11, 2008
    Inventors: Mengzhi Pang, Yonggang Li
  • Publication number: 20080234287
    Abstract: The invention discloses novel sulfur-containing naphthalimide derivatives, and the preparation and uses thereof. The conjugated plane of naphthalimide derivatives of the invention is enlarged by incorporating 5- or 6-membered heteroaromatic ring and/or introducing S heteroatom, thus increasing the anti-tumor activity of naphthalimide. The compounds of the invention displays significant inhibiting activities to the proliferation of various tumor cells such as human lung cancer, gastric cancer, liver cancer, leucocythemia and the like. The inhibition of cell proliferation is dose-dependent.
    Type: Application
    Filed: May 7, 2008
    Publication date: September 25, 2008
    Inventors: Xuhong Qian, Yonggang Li, Yufang Xu, Jian Ding, Liping Lin, Zehong Miao, Hong Zhu, Baoyuan Qu
  • Patent number: 7407878
    Abstract: A method of providing electrically conductive bumps on electrode pads of a microelectronic substrate. The method includes: providing a microelectronic substrate including electrode pads exhibiting an electrode pad pattern; providing solder portions onto respective ones of the electrode pads according to the electrode pad pattern; reflowing the solder portions to form solder bumps therefrom, reflowing comprising applying localized heating to each of the solder portions to reflow the same.
    Type: Grant
    Filed: September 28, 2006
    Date of Patent: August 5, 2008
    Assignee: Intel Corporation
    Inventor: Yonggang Li
  • Publication number: 20080156059
    Abstract: An apparatus and method is disclosed for drawing continuous metallic wire having a first diameter to a metallic fiber having a reduced second diameter. A feed mechanism moves the wire at a first linear velocity. A laser beam heats a region of the wire to an elevated temperature. A draw mechanism draws the heated wire at a second and greater linear velocity for providing a drawn metallic fiber having the reduced second diameter.
    Type: Application
    Filed: June 25, 2007
    Publication date: July 3, 2008
    Inventors: Nathaniel R. Quick, Aravinda Kar, Yonggang Li, Raymond R. McNeice
  • Publication number: 20080114045
    Abstract: The present invention relates to novel processes for the preparation of candesartan or of a protected form of candesartan, of a candesartan salt or of a candesartan ester; compounds which can be used in processes according to the invention, processes for their preparation, their use in processes according to the invention; a novel polymorphic form of candesartan cilexetil, a process for its preparation and its use for the production of a medicament.
    Type: Application
    Filed: December 15, 2005
    Publication date: May 15, 2008
    Applicant: Graf-Arco-Str. 3
    Inventors: Yaping Wang, Yonggang Li, Yulin Li, Guojun Zheng, Yi Li, Stefan Koecher
  • Publication number: 20080085595
    Abstract: A method of providing electrically conductive bumps on electrode pads of a microelectronic substrate. The method includes: providing a microelectronic substrate including electrode pads exhibiting an electrode pad pattern; providing solder portions onto respective ones of the electrode pads according to the electrode pad pattern; reflowing the solder portions to form solder bumps therefrom, reflowing comprising applying localized heating to each of the solder portions to reflow the same.
    Type: Application
    Filed: September 28, 2006
    Publication date: April 10, 2008
    Inventor: Yonggang Li
  • Patent number: 7237422
    Abstract: An apparatus and method is disclosed for drawing continuous metallic wire having a first diameter to a metallic fiber having a reduced second diameter. A feed mechanism moves the wire at a first linear velocity. A laser beam heats a region of the wire to an elevated temperature. A draw mechanism draws the heated wire at a second and greater linear velocity for providing a drawn metallic fiber having the reduced second diameter.
    Type: Grant
    Filed: November 1, 2005
    Date of Patent: July 3, 2007
    Assignee: University of Central Florida
    Inventors: Nathaniel R. Quick, Aravinda Kar, Yonggang Li, Raymond R. McNeice
  • Publication number: 20060111367
    Abstract: The invention discloses novel sulfur-containing naphthalimide derivatives, and the preparation and uses thereof. The conjugated plane of naphthalimide derivatives of the invention is enlarged by incorporating 5-or 6-membered heteroaromatic ring and/or introducing S heteroatom, thus increasing the anti-tumor activity of naphthalimide. The compounds of the invention displays significant inhibiting activities to the proliferation of various tumor cells such as human lung cancer, gastric cancer, liver cancer, leucocythemia and the like. The inhibition of cell proliferation is dose-dependent.
    Type: Application
    Filed: October 31, 2005
    Publication date: May 25, 2006
    Inventors: Xuhong Qian, Yonggang Li, Yufang Xu, Jian Ding, Liping Lin, Zehong Miao, Hong Zhu, Baoyuan Qu
  • Publication number: 20060070420
    Abstract: An apparatus and method is disclosed for drawing continuous metallic wire having a first diameter to a metallic fiber having a reduced second diameter. A feed mechanism moves the wire at a first linear velocity. A laser beam heats a region of the wire to an elevated temperature. A draw mechanism draws the heated wire at a second and greater linear velocity for providing a drawn metallic fiber having the reduced second diameter.
    Type: Application
    Filed: November 1, 2005
    Publication date: April 6, 2006
    Applicant: University of Central Florida
    Inventors: Nathaniel Quick, Oravinda Kar, Yonggang Li, Raymond McNiece
  • Patent number: 7013695
    Abstract: An apparatus and method is disclosed for drawing continuous metallic wire having a first diameter to a metallic fiber having a reduced second diameter. A feed mechanism moves the wire at a first linear velocity. A laser beam heats a region of the wire to an elevated temperature. A draw mechanism draws the heated wire at a second and greater linear velocity for providing a drawn metallic fiber having the reduced second diameter.
    Type: Grant
    Filed: April 20, 2004
    Date of Patent: March 21, 2006
    Inventors: Nathaniel R. Quick, Aravinda Kar, Yonggang Li, Raymond R. McNeice
  • Publication number: 20040194526
    Abstract: An apparatus and method is disclosed for drawing continuous metallic wire having a first diameter to a metallic fiber having a reduced second diameter. A feed mechanism moves the wire at a first linear velocity. A laser beam heats a region of the wire to an elevated temperature. A draw mechanism draws the heated wire at a second and greater linear velocity for providing a drawn metallic fiber having the reduced second diameter.
    Type: Application
    Filed: April 20, 2004
    Publication date: October 7, 2004
    Applicant: University of Central Florida
    Inventors: Nathaniel R. Quick, Aravinda Kar, Yonggang Li, Raymond R. McNeice
  • Patent number: 6732562
    Abstract: An apparatus and method is disclosed for drawing continuous metallic wire having a first diameter to a metallic fiber having a reduced second diameter. A feed mechanism moves the wire at a first linear velocity. A laser beam heats a region of the wire to an elevated temperature. A draw mechanism draws the heated wire at a second and greater linear velocity for providing a drawn metallic fiber having the reduced second diameter.
    Type: Grant
    Filed: May 8, 2001
    Date of Patent: May 11, 2004
    Assignee: University of Central Florida
    Inventors: Nathaniel R. Quick, Aravinda Kar, Yonggang Li, Raymond R. McNeice
  • Publication number: 20020043091
    Abstract: An apparatus and method is disclosed for drawing continuous metallic wire having a first diameter to a metallic fiber having a reduced second diameter. A feed mechanism moves the wire at a first linear velocity. A laser beam heats a region of the wire to an elevated temperature. A draw mechanism draws the heated wire at a second and greater linear velocity for providing a drawn metallic fiber having the reduced second diameter.
    Type: Application
    Filed: May 8, 2001
    Publication date: April 18, 2002
    Inventors: Nathaniel R. Quick, Aravinda Kar, Yonggang Li, Raymond R. McNeice