Abstract: The present disclosure discloses a shift register unit, a gate drive circuit, and a driving method thereof, and relates to the field of display technologies. The shift register unit includes an input sub-circuit, an output control sub-circuit, and an output sub-circuit. The input sub-circuit is coupled to a first node and a first voltage terminal, and is configured to output a first voltage signal to the first node in response to an input control signal. The output control sub-circuit is coupled to the first node, a second node, and a clock signal terminal, and is configured to output an output control signal to the second node in response to the first voltage signal and a clock signal. The output sub-circuit is coupled to the second node, a DC voltage terminal, and an output terminal, and is configured to output a DC voltage signal to the output terminal under the control of the output control signal.

Abstract: The present disclosure discloses a shift register unit, a gate drive circuit, and a driving method thereof, and relates to the field of display technologies. The shift register unit includes an input sub-circuit, an output control sub-circuit, and an output sub-circuit. The input sub-circuit is coupled to a first node and a first voltage terminal, and is configured to output a first voltage signal to the first node in response to an input control signal. The output control sub-circuit is coupled to the first node, a second node, and a clock signal terminal, and is configured to output an output control signal to the second node in response to the first voltage signal and a clock signal. The output sub-circuit is coupled to the second node, a DC voltage terminal, and an output terminal, and is configured to output a DC voltage signal to the output terminal under the control of the output control signal.

Abstract: A FPC flattening jig and a FPC flattening method. The FPC flattening jig includes a pressurization mechanism and a heating mechanism; a bottom of the pressurization mechanism has a planar base surface which is used to contact a warped FPC to exert pressure thereon; the heating mechanism is used to heat the pressurization mechanism, such that the planar base surface of the pressurization mechanism has a predefined temperature when exerting pressure on the FPC. The FPC flattening jig heats the pressurization mechanism by a heating mechanism, and then the heated planar base surface of the pressurization mechanism contacts the warped FPC and exerts pressure thereon. Therefore, the FPC can be flattened. As such, the FPC can be reused, facilitating the improvement on the recycling rate of FPC.

Abstract: The present disclosure relates to an IC chip extractor for removing an IC chip from a panel. The IC chip extractor includes a base plate and a heating head arranged on the base plate. The heating head includes a protrusion protruded from an end of the heating head and a hook arranged at an end of the protrusion, the hook is capable of being in contact with a bottom of a portion the IC chip adjacent to a center of the panel.

Abstract: A film-attaching apparatus comprising a base, a substrate bearing member configured to bear a substrate and a film bearing member configured to bear a film; the film bearing member is rotatable between a closed position and an open position; the film bearing member at the closed position has a bearing surface in opposite to that of the substrate bearing member such that a first portion of the film is contacted with a first portion of the substrate; and the substrate bearing member is movable in translational motion along a direction of the bearing surface of the substrate bearing member upon the film bearing member being at the closed position such that the bearing surfaces of the substrate bearing member and of the film bearing member are movable with respect to each other to attach a second portion of the film onto a second portion of the substrate.

Abstract: Disclosure provides a FPC flattening jig and a FPC flattening method. The FPC flattening jig includes a pressurization mechanism and a heating mechanism; a bottom of the pressurization mechanism has a planar base surface which is used to contact a warped FPC to exert pressure thereon; the heating mechanism is used to heat the pressurization mechanism, such that the planar base surface of the pressurization mechanism has a predefined temperature when exerting pressure on the FPC. The FPC flattening jig heats the pressurization mechanism by a heating mechanism, and then the heated planar base surface of the pressurization mechanism contacts the warped FPC and exerts pressure thereon. Therefore, the FPC can be flattened.

Abstract: The present disclosure relates to an IC chip extractor for removing an IC chip from a panel. The IC chip extractor includes a base plate and a heating head arranged on the base plate. The heating head includes a protrusion protruded from an end of the heating head and a hook arranged at an end of the protrusion, the hook is capable of being in contact with a bottom of a portion the IC chip adjacent to a center of the panel.

Abstract: A film-attaching apparatus comprising a base, a substrate bearing member configured to bear a substrate and a film bearing member configured to bear a film; the film bearing member is rotatable between a closed position and an open position; the film bearing member at the closed position has a bearing surface in opposite to that of the substrate bearing member such that a first portion of the film is contacted with a first portion of the substrate; and the substrate bearing member is movable in translational motion along a direction of the bearing surface of the substrate bearing member upon the film bearing member being at the closed position such that the bearing surfaces of the substrate bearing member and of the film bearing member are movable with respect to each other to attach a second portion of the film onto a second portion of the substrate.