Patents by Inventor Yoshiaki Udagawa

Yoshiaki Udagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200249205
    Abstract: An ultrasonic probe (1) sends out ultrasound waves to a steel sheet (100) obliquely at a plurality of angles, using transmission signals provided from a transmission signal processing unit (3a). In addition, the ultrasonic probe (1) receives echoes corresponding to the plurality of angles from the steel sheet (100). A reception signal processing unit (3b) determines amplitudes of the echoes received by the ultrasonic probe (1) and corresponding to the plurality of angles, and periods of time from when the ultrasound waves are sent out until the echoes are received, as reception times, and identifies a location of a flaw (101) in the steel sheet (100) from the reception times and a ratio between the amplitudes.
    Type: Application
    Filed: December 7, 2017
    Publication date: August 6, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventors: Tomonori KIMURA, Tomonobu GOTOU, Yoshiaki KUNII, Hisashi UDAGAWA, Akira HOSOYA
  • Patent number: 7007506
    Abstract: A refrigeration system allows the refrigerant to circulate through a closed circulation channel. A dry evaporator is incorporated in the circulation channel. The dry evaporator is designed to keep a quality smaller than 1.0 in evaporating the refrigerant. The quantity of heat transfer per unit area, namely, a heat transfer coefficient depends on the quality. The heat transfer coefficient remarkably drops when the quality of the refrigerant exceeds a predetermined threshold level before the quality actually reaches 1.0. The quality of the refrigerant kept below the predetermined threshold level during vaporization of the refrigetant in the dry evaporator allows a reliable establishment of a higher performance of cooling. On the other hand, if a refrigerant completely evaporates in a dry evaporator in a conventional manner, the heat transfer coefficient of the refrigerant remarkably drops after the quality of the refrigerant exceeds the predetermined threshold level.
    Type: Grant
    Filed: May 4, 2004
    Date of Patent: March 7, 2006
    Assignee: Fujitsu Limited
    Inventors: Hideo Kubo, Hisashi Kawashima, Jie Wei, Junichi Ishimine, Masahiro Suzuki, Yoshiaki Udagawa, Masahiro Mochizuki
  • Publication number: 20040200229
    Abstract: A refrigeration system allows the refrigerant to circulate through a closed circulation channel. A dry evaporator is incorporated in the circulation channel. The dry evaporator is designed to keep a quality smaller than 1.0 in evaporating the refrigerant. The quantity of heat transfer per unit area, namely, a heat transfer coefficient depends on the quality. The heat transfer coefficient remarkably drops when the quality of the refrigerant exceeds a predetermined threshold level before the quality actually reaches 1.0. The quality of the refrigerant kept below the predetermined threshold level during vaporization of the refrigetant in the dry evaporator allows a reliable establishment of a higher performance of cooling. On the other hand, if a refrigerant completely evaporates in a dry evaporator in a conventional manner, the heat transfer coefficient of the refrigerant *remarkably drops after the quality of the refrigerant exceeds the predetermined threshold level.
    Type: Application
    Filed: May 4, 2004
    Publication date: October 14, 2004
    Applicant: FUJITSU LIMITED
    Inventors: Hideo Kubo, Hisashi Kawashima, Jie Wei, Junichi Ishimine, Masahiro Suzuki, Yoshiaki Udagawa, Masahiro Mochizuki
  • Patent number: 6748755
    Abstract: A refrigeration system allows the refrigerant to circulate through a closed circulation channel. A dry evaporator is incorporated in the circulation channel. The dry evaporator is designed to keep a quality smaller than 1.0 in evaporating the refrigerant. The quantity of heat transfer per unit area, namely, a heat transfer coefficient depends on the quality. The heat transfer coefficient remarkably drops when the quality of the refrigerant exceeds a predetermined threshold level before the quality actually reaches 1.0. The quality of the refrigerant kept below the predetermined threshold level during vaporization of the refrigerant in the dry evaporator allows a reliable establishment of a higher performance of cooling. On the other hand, if a refrigerant completely evaporates in a dry evaporator in a conventional manner, the heat transfer coefficient of the refrigerant remarkably drops after the quality of the refrigerant exceeds the predetermined threshold level.
    Type: Grant
    Filed: December 28, 2000
    Date of Patent: June 15, 2004
    Assignee: Fujitsu Limited
    Inventors: Hideo Kubo, Hisashi Kawashima, Jie Wei, Junichi Ishimine, Masahiro Suzuki, Yoshiaki Udagawa, Masahiro Mochizuki
  • Patent number: 6621707
    Abstract: An electronic apparatus including a motherboard, a plurality of multi-chip modules mounted to the motherboard and cooling members for cooling the multi-chip modules. A refrigeration unit is arranged to deliver cooling water to the cooling members. A connection structure is provided for each multi-chip module for thermally and mechanically releasably coupling each multi-chip module to the refrigeration unit.
    Type: Grant
    Filed: October 2, 2001
    Date of Patent: September 16, 2003
    Assignee: Fujitsu Limited
    Inventors: Junichi Ishimine, Masahiro Suzuki, Masahiro Miyo, Akihiko Fujisaki, Keizo Takemura, Jie Wei, Hisashi Kawashima, Yoshiaki Udagawa, Haruhiko Yamamoto, Masahiro Mochizuki
  • Publication number: 20030005584
    Abstract: An assembly including at least one heat conductive member each constituted by an aluminum-based die-casting, and a heat pipe attached at a fixing portion thereof to the heat conductive member. The assembly is characterized in that the aluminum-based die-casting is formed of a castable aluminum alloy which includes up to 0.5% by weight of silicon; that the heat conductive member has a groove formed in a surface thereof; and that the heat pipe is accommodated at the fixing portion in the groove, and is held fixed at the fixing portion in the groove by plastically deforming at least one of opposite side walls defining the groove, toward an outer circumferential surface of the heat pipe.
    Type: Application
    Filed: June 27, 2002
    Publication date: January 9, 2003
    Applicant: Sumitomo Light Metal Industries, Ltd.
    Inventors: Noritoshi Komatsu, Osamu Aoya, Takehiro Chinen, Tadashi Katsui, Yoshiaki Udagawa
  • Patent number: 6454362
    Abstract: A cooling device for a portable electronic comprises a radiation plate and a fin for radiating the heat from the CPU. When the plug of an external power. supply is attached to the body of the portable electronic, the CPU may operate at a high clock frequency. The cooling device achieves a high cooling performance by operating a ventilation fan directed to the fin, for example. When the plug is removed from the body of the portable electronic, the CPU may operate at a low clock frequency. Power consumption can be reduced, so that the electric power stored in the built-in battery can be saved. The duration time of the operation can be extended. Calorific power generated at the CPU can also be reduced, so that the cooling device is adapted to suppress the rise in the temperature of the CPU without operation of the ventilation fan.
    Type: Grant
    Filed: December 30, 1999
    Date of Patent: September 24, 2002
    Assignee: Fujitsu Limited
    Inventors: Tadashi Katsui, Keizo Takemura, Minoru Hirano, Masumi Suzuki, Yoshiaki Udagawa, Masuo Ohnishi, Kenichi Fujii
  • Patent number: 6404640
    Abstract: An electronic apparatus including a motherboard, a plurality of multi-chip modules mounted to the motherboard and cooling members for cooling the multi-chip modules. A refrigeration unit is arranged to deliver cooling water to the cooling members. A connection structure is provided for each multi-chip module for thermally and mechanically releasably coupling each multi-chip module to the refrigeration unit.
    Type: Grant
    Filed: January 22, 1999
    Date of Patent: June 11, 2002
    Assignee: Fujitsu Limited
    Inventors: Junichi Ishimine, Masahiro Suzuki, Masahiro Miyo, Akihiko Fujisaki, Keizo Takemura, Jie Wie, Hisashi Kawashima, Yoshiaki Udagawa, Haruhiko Yamamoto, Masahiro Mochizuki
  • Patent number: 6397459
    Abstract: A method and apparatus are provided for mounting circuit elements on a printed wiring board, wherein an integrated circuit having terminals with a first interterminal pitch are mounted onto a first surface of a terminal density. conversion board which converts the first interterminal pitch of the integrated circuit to terminals with a second interterminal pitch larger than the first interterminal pitch on a second surface of the terminal density conversion board; and the terminals on the second surface of the terminal density conversion board with the second interterminal pitch are mounted onto the printed wiring board.
    Type: Grant
    Filed: March 23, 1999
    Date of Patent: June 4, 2002
    Assignee: Fujitsu, Limited
    Inventors: Osamu Ohshima, Yoshiaki Udagawa, Masahiro Suzuki, Takeshi Nishiyama
  • Publication number: 20020021557
    Abstract: An electronic apparatus including a motherboard, a plurality of multi-chip modules mounted to the motherboard and cooling members for cooling the multi-chip modules. A refrigeration unit is arranged to deliver cooling water to the cooling members. A connection structure is provided for each multi-chip module for thermally and mechanically releasably coupling each multi-chip module to the refrigeration unit.
    Type: Application
    Filed: October 2, 2001
    Publication date: February 21, 2002
    Applicant: Fujitsu Limited,
    Inventors: Junichi Ishimine, Masahiro Suzuki, Akira Tamura, Masahiro Miyo, Akihiko Fujisaki, Keizo Takemura, Jie Wei, Hisashi Kawashima, Yoshiaki Udagawa, Haruhiko Yamamoto, Masahiro Mochizuki
  • Publication number: 20010039724
    Abstract: A method and apparatus are provided for mounting circuit elements on a printed wiring board, wherein an integrated circuit having terminals with a first interterminal pitch are mounted onto a first surface of a terminal density conversion board which converts the first interterminal pitch of the integrated circuit to terminals with a second interterminal pitch larger than the first interterminal pitch on a second surface of the terminal density conversion board; and the terminals on the second surface of the terminal density conversion board with the second interterminal pitch are mounted onto the printed wiring board.
    Type: Application
    Filed: March 23, 1999
    Publication date: November 15, 2001
    Inventors: OSAMU OHSHIMA, YOSHIAKI UDAGAWA, MASAHIRO SUZUKI, TAKESHI NISHIYAMA
  • Publication number: 20010020365
    Abstract: A refrigeration system allows the refrigerant to circulate through a closed circulation channel. A dry evaporator is incorporated in the circulation channel. The dry evaporator is designed to keep a quality smaller than 1.0 in evaporating the refrigerant. The quantity of heat transfer per unit area, namely, a heat transfer coefficient depends on the quality. The heat transfer coefficient remarkably drops when the quality of the refrigerant exceeds a predetermined threshold level before the quality actually reaches 1.0. The quality of the refrigerant kept below the predetermined threshold level during vaporization of the refrigerant in the dry evaporator allows a reliable establishment of a higher performance of cooling. On the other hand, if a refrigerant completely evaporates in a dry evaporator in a conventional manner, the heat transfer coefficient of the refrigerant remarkably drops after the quality of the refrigerant exceeds the predetermined threshold level.
    Type: Application
    Filed: December 28, 2000
    Publication date: September 13, 2001
    Inventors: Hideo Kubo, Hisashi Kawashima, Jie Wei, Junichi Ishimine, Masahiro Suzuki, Yoshiaki Udagawa, Masahiro Mochizuki
  • Patent number: 5936843
    Abstract: A method and apparatus are provided for mounting circuit elements on a printed wiring board, wherein an integrated circuit having terminals with a first interterminal pitch are mounted onto a first surface of a terminal density conversion board which converts the first interterminal pitch of the integrated circuit to terminals with a second interterminal pitch larger than the first interterminal pitch on a second surface of the terminal density conversion board; and the terminals on the second surface of the terminal density conversion board with the second interterminal pitch are mounted onto the printed wiring board.
    Type: Grant
    Filed: March 18, 1998
    Date of Patent: August 10, 1999
    Assignee: Fujitsu Limited
    Inventors: Osamu Ohshima, Yoshiaki Udagawa, Masahiro Suzuki, Takeshi Nishiyama
  • Patent number: 5195020
    Abstract: A cooling system used with a printed circuit board has at least a solid circuit component thereon. The cooling system comprises a cooling header and cooling modules connected to the cooling header. Each of the cooling modules engage to each of the components. The cooling module has a heat transfer plate connected to one end of a bellows which is connected to the cooling header at the other end. A layer of thermally conductive compound, such as a layer of thermal grease, is interposed between the heat transfer plate and the corresponding circuit component. The thermally conductive layer is initially pressed with a pressure higher than a critical pressure, and thereafter, the pressure is reduced to a working pressure exerted on the circuit component provided by the resilient force of the bellows and the hydraulic pressure of the coolant. The critical pressure is predetermined experimentally or practically.
    Type: Grant
    Filed: November 1, 1991
    Date of Patent: March 16, 1993
    Assignee: Fujitsu Limited
    Inventors: Masahiro Suzuki, Haruhiko Yamamoto, Yoshiaki Udagawa
  • Patent number: 5126919
    Abstract: A cooling system includes a cooling module which has a heat transfer plate elastically biased and exposed to the flow of a coolant for transferring heat dissipated from a circuit component on a printed circuit board to the coolant, and a solder or low-melting-point metal for establishing thermal contact between the transfer plate and the circuit component.
    Type: Grant
    Filed: October 25, 1988
    Date of Patent: June 30, 1992
    Assignee: Fujitsu Limited
    Inventors: Haruhiko Yamamoto, Masahiro Suzuki, Yoshiaki Udagawa, Mitsuhiko Nakata, Koji Katsuyama, Izumi Ono, Shunichi Kikuchi
  • Patent number: 4879632
    Abstract: A cooling system includes a cooling module which has a heat transfer plate elastically biased and exposed to the flow of a coolant for transferring heat dissipated from a circuit component on a printed circuit board to the coolant, and a solder or low-melting-point metal for establishing thermal contact between the transfer plate and the circuit component.
    Type: Grant
    Filed: October 3, 1986
    Date of Patent: November 7, 1989
    Assignee: Fujitsu Limited
    Inventors: Haruhiko Yamamoto, Masahiro Suzuki, Yoshiaki Udagawa, Mitsuhiko Nakata, Koji Katsuyama, Izumi Ono, Shunichi Kikuchi
  • Patent number: 4783721
    Abstract: A cooling system including a cooling module which has a heat transfer plate that is exposed to a flow of coolant and is elastically biased toward a circuit component on a printed circuit board for transferring heat dissipated by the component to the coolant, and means for guiding and preventing improper alignment of the transfer plate as the same is resiliently biased toward the circuit component. The coolant module may include a solder or low-melting-point metal for establishing thermal contact between the transfer plate and the circuit component.
    Type: Grant
    Filed: July 30, 1987
    Date of Patent: November 8, 1988
    Assignee: Fujitsu Limited
    Inventors: Haruhiko Yamamoto, Masahiro Suzuki, Yoshiaki Udagawa, Mitsuhiko Nakata, Koji Katsuyama, Izumi Ono, Shunichi Kikuchi
  • Patent number: 4729060
    Abstract: A cooling module for an electronic circuit component on a printed circuit board includes a passage in which a coolant flows, a first heat transfer plate exposed to the flow of the coolant, a second heat transfer plate secured to the circuit component, a compliant member between the first and second heat transfer plates for establishing a compliant contact therebetween, and a bellows connected to the first heat transfer plate to elastically press the first heat transfer plate against the circuit component through the compliant member and the second heat transfer plate.
    Type: Grant
    Filed: January 25, 1985
    Date of Patent: March 1, 1988
    Assignee: Fujitsu Limited
    Inventors: Haruhiko Yamamoto, Masaaki Sakai, Yoshiaki Udagawa, Kouji Katsuyama, Mitsuhiko Nakata
  • Patent number: 4158220
    Abstract: Disclosed is a printed circuit card construction comprising laminated conductor plates, a plurality of poles mounted on the laminated conductor plates, a plurality of mother boards fixed by two adjacent poles, a plurality of Input/Output connectors supported by the mother boards for holding each printed circuit card, and a plurality of power sources, wherein the poles and the power sources are directly connected to the corresponding conductor plates of the laminated conductor plates, which poles act as both mechanical means for supporting the mother boards and electrical means for supplying power to the printed circuit cards.
    Type: Grant
    Filed: December 20, 1977
    Date of Patent: June 12, 1979
    Assignee: Fujitsu Limited
    Inventors: Haruhiko Yamamoto, Yoshiaki Udagawa, Yoshinao Hirose