Abstract: According to one embodiment, provided is an active material including a niobium titanium-containing oxide phase and a carbon coating layer. The niobium titanium-containing oxide phase contains a niobium titanium-containing oxide having a monoclinic structure and Na, and a Na content therein is 0 ppm or more and 100 ppm or less. The carbon coating layer coats at least a part of the niobium titanium-containing oxide phase, and contains 0.001% or more of carboxyl group.

Abstract: In general, according to one embodiment, a niobium-titanium oxide is provided. The niobium-titanium oxide satisfies Formulae (1) to (3) below in an L*a*b* color space according to Japanese Industrial Standard JIS Z 8722:2009: 95.0?L*?100??(1) ?1.0?a*?1.0??(2) ?1.0?b*?6.0??(3).

Abstract: A niobium-titanium-based oxide includes niobium-titanium-based oxide particles, wherein an Si2p peak area and an Nb3d peak area, as measured by X-ray photoelectron spectroscopy for the niobium-titanium-based oxide particles, satisfy a ratio A of 0.40?A?1.0, provided that the ratio A is the Si2p peak area/the Nb3d peak area.

Abstract: A semiconductor device capable of reducing the influence of noise and easily securing a breakdown voltage between a source wiring and a drain wiring constituting a capacitance between a source and a drain even when shrinkage of a cell progresses, and a manufacturing method thereof are provided. The drain wiring is electrically connected to a substrate region, and the drain wiring is disposed in contact with an upper surface of an interlayer insulating layer. The source wiring is electrically connected to source regions and are disposed in contact with the upper surface of the interlayer insulating layer. A plurality of MOSFET cells are arranged side by side in a X-direction. The drain wiring and the source wiring extends in the X direction and are adjacent to each other in a Y direction crossing the X direction to form a capacitor.

Abstract: A support device includes: a force measurement sensor structure which includes a shaft having first and second end sections, an intermediate element movably provided between the first and second end sections, first and second elastic members respectively provided between the first end section and the intermediate element and between the second end section and the intermediate element, a linear potentiometer detecting the one dimensional direction position of the intermediate element, and a gripping unit transmitting a force to the intermediate element in an interlocking manner with movement of upper or lower limb; a drive unit changing a load applied to the intermediate element; a control unit controlling the drive unit; and a wearable unit including a front frame provided on a front side of a user, a rear frame connected to the front frame, provided on a rear side of the user, and supporting the drive unit, and an arm suspending a wire which connects the force measurement sensor structure and the drive unit,

Abstract: A support device includes: a force measurement sensor structure which includes a shaft having first and second end sections, an intermediate element movably provided between the first and second end sections, first and second elastic members respectively provided between the first end section and the intermediate element and between the second end section and the intermediate element, a linear potentiometer detecting the one dimensional direction position of the intermediate element, and a gripping unit transmitting a force to the intermediate element in an interlocking manner with movement of upper or lower limb; a drive unit changing a load applied to the intermediate element; a control unit controlling the drive unit; and a wearable unit including a front frame provided on a front side of a user, a rear frame connected to the front frame, provided on a rear side of the user, and supporting the drive unit, and an arm suspending a wire which connects the force measurement sensor structure and the drive unit,

Abstract: A semiconductor element housing package includes a substrate, a frame body disposed on the substrate; an insulating substrate disposed in a frame-body-surrounded region of the substrate; a first mounting member disposed on the insulating substrate, for mounting a power semiconductor element thereon; a second mounting member disposed on the insulating substrate so as to be spaced away from the first mounting member; a first lead member having a first bend; and a second lead member having a second bend. The first lead member is disposed so as to pass through the frame body from an exterior thereof and extend over the first mounting member and makes connection therewith through the first bend. The second lead member is disposed so as to pass through the frame body from the exterior thereof and extend over the second mounting member and makes connection therewith through the second bend.

Abstract: There are provided a substrate for mounting a device and a package for housing the device employing the same in which a power semiconductor device can be readily set for a temperature suitable for operation and can thus function in a proper fashion. The substrate for mounting the device includes a support body having, on one main surface of the support body, a device mounting portion for mounting a power semiconductor device, the support body having a plurality of columnar parts that are spaced apart in a thickness direction with respect to the device mounting portion and are arranged apart from each other; and a heat accumulating region which is disposed between the columnar parts and is lower in thermal conductivity than the support body.

Abstract: A semiconductor element housing package includes a substrate, a frame body disposed on the substrate; an insulating substrate disposed in a frame-body-surrounded region of the substrate; a first mounting member disposed on the insulating substrate, for mounting a power semiconductor element thereon; a second mounting member disposed on the insulating substrate so as to be spaced away from the first mounting member; a first lead member having a first bend; and a second lead member having a second bend. The first lead member is disposed so as to pass through the frame body from an exterior thereof and extend over the first mounting member and makes connection therewith through the first bend. The second lead member is disposed so as to pass through the frame body from the exterior thereof and extend over the second mounting member and makes connection therewith through the second bend.

Abstract: A structure includes a circuit substrate including a first substrate and a second substrate. The first substrate has a region where an electronic component is to be mounted. The second substrate has a side surface connected to a first side surface of the first substrate. The structure further includes a frame on the circuit substrate, enclosing the region in a plane view. The frame crosses the boundary between the first substrate and the second substrate.

Abstract: An electronic-component-housing package comprises a container including a rectangular mount on which an electronic component is to be mounted and a sidewall surrounding the mount. The electronic-component-housing package comprises a lead terminal extending from an inside of a space enclosed by the sidewall to an outside of the space. A tip part of the lead terminal is extending along one side of the mount.

Abstract: In vehicular control method and apparatus for a shift-by-wire device, a selected shift position is modified to at least one of a vehicular parking position, a neutral position, and a traveling position, the selected shift position is modified to the vehicular parking position when a power switch is switched to an OFF position, and the modification of the shift position to the vehicular parking position is inhibited when an operation pattern of an operation input section while the power switch is in the ON position is made coincident with the operation pattern prescribed as a cipher code which inhibits the shift position modification to the vehicular parking position, the operation patterns being constituted by a combination of operation patterns which would not be carried out in the operation section during an ordinary traveling.

Abstract: An electronic component storing package which generates a large quantity of heat during operation and an electronic apparatus storing such an electronic component are provided. In the electronic component storing package and the electronic apparatus, a heat dissipating member (1) is used which comprising at least five layers including first metal layers (11) having good thermal conductivity and second metal layers (12) having a smaller coefficient of thermal expansion and less thickness compared with the first metal layers (11), the first metal layers (11) and second metal layers (12) being alternately stacked, the first metal layers uppermost and lowermost layers of the layers, a thickness of at least one internally-arranged first metal layer (11a) being thicker than that of the lowermost and uppermost layers.

Abstract: There are provided a substrate for mounting a device and a package for housing the device employing the same in which a power semiconductor device can be readily set for a temperature suitable for operation and can thus function in a proper fashion. The substrate for mounting the device includes a support body having, on one main surface of the support body, a device mounting portion for mounting a power semiconductor device, the support body having a plurality of columnar parts that are spaced apart in a thickness direction with respect to the device mounting portion and are arranged apart from each other; and a heat accumulating region which is disposed between the columnar parts and is lower in thermal conductivity than the support body.

Abstract: In vehicular control method and apparatus for a shift-by-wire device, a selected shift position is modified to at least one of a vehicular parking position, a neutral position, and a traveling position, the selected shift position is modified to the vehicular parking position when a power switch is switched to an OFF position, and the modification of the shift position to the vehicular parking position is inhibited when an operation pattern of an operation input section while the power switch is in the ON position is made coincident with the operation pattern prescribed as a cipher code which inhibits the shift position modification to the vehicular parking position, the operation patterns being constituted by a combination of operation patterns which would not be carried out in the operation section during an ordinary traveling.

Abstract: An electronic-component-housing package comprises a container including a rectangular mount on which an electronic component is to be mounted and a sidewall surrounding the mount. The electronic-component-housing package comprises a lead terminal extending from an inside of a space enclosed by the sidewall to an outside of the space. A tip part of the lead terminal is extending along one side of the mount.

Abstract: A multi-carrier signal transmitter includes a multi-carrier modulation circuit, a power converter, a frequency converter and an interference protection determination circuit, and that the interference protection determination circuit determines a difference in power levels between a higher layer component and a lower layer component of multi-carrier signals in a manner to avoid digital interference. The power converter converts a power level of the multi-carrier signals when necessary based on a data of the determination, and the frequency converter converts a center frequency band of the multi-carrier signals when necessary based on the data of the determination. The digital interference of the hierarchical multi-carrier signals can be prevented.

Abstract: An electronic component storing package which generates a large quantity of heat during operation and an electronic apparatus storing such an electronic component are provided. In the electronic component storing package and the electronic apparatus, a heat dissipating member (1) is used which comprising at least five layers including first metal layers (11) having good thermal conductivity and second metal layers (12) having a smaller coefficient of thermal expansion and less thickness compared with the first metal layers (11), the first metal layers (11) and second metal layers (12) being alternately stacked, the first metal layers uppermost and lowermost layers of the layers, a thickness of at least one internally-arranged first metal layer (11a) being thicker than that of the lowermost and uppermost layers.

Abstract: A battery case as an electronic component case includes a second conductive plate made of metal, an insulating wall having an upper end surface and a bottom end surface, a first conductive plate made of metal joined to an upper end surface of the insulating wall, and a second conductive plate attached to the bottom end surface of the insulating wall. The insulating wall has a first conductor layer formed on an entire perimeter of the upper end surface thereof and a second conductor layer formed on an entire perimeter of a lower surface thereof, an electrode formed at a peripheral portion of the lower surface of the insulating wall so as to be electrically independent from the second conductor layer, an external connection terminal brazed to the electrode, and a connection conductor formed from the first conductor layer to the electrode. The first conductive plate is attached to the insulating wall via the first conductor layer.

Abstract: A structure includes a circuit substrate including a first substrate and a second substrate. The first substrate has a region where an electronic component is to be mounted. The second substrate has a side surface connected to a first side surface of the first substrate. The structure further includes a frame on the circuit substrate, enclosing the region in a plane view. The frame crosses the boundary between the first substrate and the second substrate.