Abstract: Providing a terminal material for connectors provided with a base material in which at least a surface layer is made of copper or copper alloy, a nickel-plating layer made of nickel or nickel alloy coating a surface of the base material, and a silver-nickel alloy plating layer formed on at least a part of the nickel-plating layer, the silver-nickel alloy plating layer having a film thickness of 0.5 ?m to 20 ?m inclusive, a nickel content of 0.03 at % to 1.20 at % inclusive, and an average crystal grain size of 10 nm to 150 nm inclusive, to improve abrasion resistance and heat resistance.

Abstract: A base material at least a surface is made of copper or copper alloy and a silver-nickel-potassium alloy plating layer formed on at least a part of the base material are provided; the silver-nickel-potassium alloy plating layer has a film thickness of 0.5 ?m or more and 20.0 ?m or less, a nickel content of 0.02% by mass or more and 0.60% by mass or less, and a potassium content of 0.03% by mass or more and 1.00% by mass or less; and an average crystal grain size of the silver-nickel-potassium alloy plating layer is preferably 10 nm or more and 150 nm or less.

Abstract: A terminal material for a connector provided with a base material in which at least a surface layer is made of copper or copper alloy, a nickel-plating layer made of nickel or nickel alloy and formed on a surface of the base material, a silver-nickel alloy plating layer made of silver-nickel alloy and formed on at least a part of the nickel-plating layer, and a silver-plating layer made of silver and formed on the silver-nickel alloy plating layer; the silver-nickel alloy plating layer has a film thickness 0.05 µm or more and less than 0.50 µm and a nickel content 0.03 at% or more and 1.00 at% or less.

Abstract: In a method for producing high-purity electrolytic copper, a first additive (A) containing an aromatic ring of a hydrophobic group and a polyoxyalkylene group of a hydrophilic group, a second additive (B) formed of polyvinyl alcohols, and a third additive (C) formed of tetrazoles are added to a copper electrolyte, copper electrolysis is performed by controlling each concentration of the first additive (A), the second additive (B), and the third additive (C), a current density and a bath temperature, and accordingly, electrolytic copper in which a concentration of Ag is less than 0.2 mass ppm, a concentration of S is less than 0.07 mass ppm, a concentration of all impurities is less than 0.2 mass ppm, and an area ratio of crystal grains having an average crystal grain misorientation (referred to as a GOS value) exceeding 2.5° is 10% or less is obtained.

Abstract: Providing a terminal material for connectors provided with a base material in which at least a surface layer is made of copper or copper alloy, a nickel-plating layer made of nickel or nickel alloy coating a surface of the base material, and a silver-nickel alloy plating layer formed on at least a part of the nickel-plating layer, the silver-nickel alloy plating layer having a film thickness of 0.5 ?m to 20 ?m inclusive, a nickel content of 0.03 at % to 1.20 at % inclusive, and an average crystal grain size of 10 nm to 150 nm inclusive, to improve abrasion resistance and heat resistance.

Abstract: An anti-corrosion terminal material including a base material made of copper or copper alloy and a coating film laminated on the base material: the coating film includes: a first coating film, provided with a zinc layer made of zinc alloy and a tin layer made of tin or tin alloy which are laminated in this order, and formed at a planned core contact part; and a second coating film including the tin layer but not comprising the zinc layer, which is provided at a planned contact part being a contact part when the terminal is formed: and the zinc layer has a thickness not less than 0.1 ?m and not more than 5.0 ?m and zinc concentration not less than 30% by mass and not more than 95% by mass, and has any one or more of nickel, iron, manganese, molybdenum, cobalt, cadmium, lead and tin as a balance.

Abstract: A terminal material for a connector provided with a base material in which at least a surface layer is made of copper or copper alloy, a nickel-plating layer made of nickel or nickel alloy and formed on a surface of the base material, a silver-nickel alloy plating layer made of silver-nickel alloy and formed on at least a part of the nickel-plating layer, and a silver-plating layer made of silver and formed on the silver-nickel alloy plating layer; the silver-nickel alloy plating layer has a film thickness 0.05 µm or more and less than 0.50 µm and a nickel content 0.03 at% or more and 1.00 at% or less.

Abstract: The present invention provides a high-purity electrolytic copper 10 having a Cu purity excluding gas components (O, F, S, C, and Cl) is 99.9999 mass % or more, a content of S is 0.1 mass ppm or less, and an area ratio of crystals having a (101)±10° orientation is less than 40%, when crystal orientation is measured by electron backscatter diffraction in a cross section along a thickness direction.

Abstract: Providing a terminal material for connectors provided with a base material in which at least a surface layer is made of copper or copper alloy, a nickel-plating layer made of nickel or nickel alloy coating a surface of the base material, and a silver-nickel alloy plating layer formed on at least a part of the nickel-plating layer, the silver-nickel alloy plating layer having a film thickness of 0.5 ?m to 20 ?m inclusive, a nickel content of 0.03 at % to 1.20 at % inclusive, and an average crystal grain size of 10 nm to 150 nm inclusive, to improve abrasion resistance and heat resistance.

Abstract: Providing an anti-corrosion terminal material having high corrosion resistance effect and good adhesiveness of a film. A first film is formed on at least a part of a base material in which at least a surface is made of copper or copper alloy; in the first film, a zinc layer made of zinc or zinc alloy is formed on a mixed layer in which a copper-tin alloy region made of copper tin alloy and a tin region made of tin or tin alloy other than copper tin alloy are mixed; the zinc layer is in contact with both the copper-tin alloy region and the tin region of the mixed layer; a ratio R1/R2 is 0.05 or more and 2.5 or less where a length in contact with the copper-tin alloy region in a cross section along a thickness direction is R1 (?m) and a length in contact with the tin layer is R2 (?m).

Abstract: To provide a method of manufacturing a connector terminal material and a terminal for a connector to improve wear resistance and heat resistance. A connector terminal material of the present invention is provided with a base material in which at least a surface layer is made of copper or copper alloy and a silver-nickel alloy layer covering at least a part of a surface of the base material and having a film thickness of 0.5 ?m or more and 50 ?m or less; and nickel content of the silver-nickel alloy layer is 0.05 at % or more and 2.0 at % or less. Between the base material and the silver-nickel alloy layer, a nickel layer made of nickel or nickel alloy is provided; and a film thickness of the nickel layer is preferably 0.5 ?m or more and 5 ?m or less.

Abstract: Provided is a tin-plated copper terminal material, a terminal formed from the terminal material, and an electric-wire terminal structure using the terminal: the terminal material has a substrate of copper or a copper alloy; an intermediate zinc layer of a zinc alloy that is formed on the substrate and has a thickness of 0.10 ?m to 5.00 ?m; and a tin layer of tin or a tin alloy that is formed on the intermediate zinc layer and in which the length proportion occupied by low-angle grain boundaries is 2% to 30% with respect to the total length of all crystal grain boundaries; wherein galvanic corrosion is effectively suppressed.

Abstract: A terminal material for a connector terminal, using a copper or copper alloy substrate is crimped to an end of wire formed from an aluminum wire material; and a terminal using this terminal material: a zinc layer 4 that is formed of zinc or a zinc alloy and a tin layer 5 that is formed of tin or a tin alloy are sequentially laminated in this order on a substrate 2 that is formed of copper or a copper alloy: with respect to the zinc layer and the tin layer, the adhesion amount of tin contained in the whole layers is from 0.5 mg/cm2 to 7.0 mg/cm2 (inclusive) and the adhesion amount of zinc contained in the whole layers is from 0.07 mg/cm2 to 2.0 mg/cm2 (inclusive), and the content percentage of zinc in the vicinity of the surface is from 0.2% by mass to 10.0% by mass (inclusive).

Abstract: On a base member made of copper or a copper alloy, a zinc-nickel alloy layer including zinc and nickel, and a tin layer made of tin alloy are laminated in this order: the zinc-nickel alloy layer has a thickness of 0.1-5 ?m inclusive and has a nickel content of 5-50 mass % inclusive, the tin layer has a zinc concentration of 0.6-15 mass % inclusive, and, under an oxide layer which is the outermost layer, a metal zinc layer, having a zinc concentration of 5-40 at % inclusive and a thickness of 1-10 nm inclusive in SiO2 conversion, is formed on the tin layer.

Abstract: An anti-corrosion terminal material including a base material made of copper or copper alloy and a coating film laminated on the base material: the coating film includes: a first coating film, provided with a zinc layer made of zinc alloy and a tin layer made of tin or tin alloy which are laminated in this order, and formed at a planned core contact part; and a second coating film including the tin layer but not comprising the zinc layer, which is provided at a planned contact part being a contact part when the terminal is formed: and the zinc layer has a thickness not less than 0.1 ?m and not more than 5.0 ?m and zinc concentration not less than 30% by mass and not more than 95% by mass, and has any one or more of nickel, iron, manganese, molybdenum, cobalt, cadmium, lead and tin as a balance.

Abstract: A corrosion-resistant terminal material has a substrate made of copper or a copper alloy and a film layered on the substrate. The film has a planned core wire contact part with which a core wire of an electric wire is in contact when the material is formed to a terminal and a planned contact part. The film formed in the planned core wire contact part has a tin layer made of tin or tin alloy and a metallic zinc layer formed on the tin layer; the film formed in the planned contact part has a tin layer made of tin or tin alloy but does not have a metallic zinc layer. A corrosion-resistant terminal uses the corrosion-resistant terminal material described herein.

Abstract: Providing a tin-plated terminal material with high corrosion-prevention effect and low contact resistance, a terminal formed from the terminal material, and an electric wire terminal-end structure. Provided are a base material made of copper or copper alloy, a zinc layer made of zinc or zinc alloy formed on the base material, and a tin layer made of tin or tin alloy formed on the zinc layer: in a whole of the zinc layer and the tin layer, a tin amount per unit area is 0.30 mg/cm2 to 7.00 mg/cm2 inclusive, a zinc amount per unit area is 0.07 mg/cm2 to 2.00 mg/cm2 inclusive, a content percentage of zinc in a vicinity of a surface in the tin layer is 0.2% to 10% by mass inclusive, and a length proportion of low-angle grain boundaries occupied in a total length of crystal boundaries in the tin layer is 2% to 30% inclusive.

Abstract: A terminal material in which galvanic corrosion is not occurred using a copper or copper alloy base material as a terminal crimped to an end part of an electrical wire formed from an aluminum wire material: an intermediate zinc layer 4 formed from zinc or zinc alloy and a tin layer 5 formed from tin or tin alloy are layered in this order on a base material 2 formed from copper or copper alloy; the intermediate zinc layer 4 has a thickness of 0.1 ?m to 5.0 ?m inclusive and a zinc concentration equal to or more than 5 mass %; and the tin layer 5 has a zinc concentration of 0.4 mass % to 15 mass % inclusive and a grain size of the tin layer 5 is 0.1 ?m to 3.0 ?m inclusive preferably.

Abstract: The present invention provides an additive for high-purity copper electrolytic refining and a method of producing high-purity copper using the additive. The additive of the present invention for high-purity copper electrolytic refining can be added to a copper electrolyte in electrolytic refining for producing high-purity copper. The additive includes a main agent formed of a non-ionic surfactant which has a hydrophobic group containing an aromatic ring and a hydrophilic group containing a polyoxyalkylene group, and a stress relaxation agent formed of a polyvinyl alcohol or a derivative thereof.

Abstract: On a base member made of copper or a copper alloy, a zinc-nickel alloy layer including zinc and nickel, and a tin layer made of tin alloy are laminated in this order: the zinc-nickel alloy layer has a thickness of 0.1-5 ?m inclusive and has a nickel content of 5-50 mass % inclusive, the tin layer has a zinc concentration of 0.6-15 mass % inclusive, and, under an oxide layer which is the outermost layer, a metal zinc layer, having a zinc concentration of 5-40 at % inclusive and a thickness of 1-10 nm inclusive in SiO2 conversion, is formed on the tin layer.