Abstract: A mask-integrated surface protective tape, containing: a substrate film; a temporary-adhesive layer provided on the substrate film; and a mask material layer provided on the temporary-adhesive layer; wherein the mask material layer and the temporary-adhesive layer each contain a (meth)acrylic copolymer; and wherein the mask-integrated surface protective tape is used for a method of producing a semiconductor chip utilizing a plasma-dicing.

Abstract: According to one embodiment, a picking system includes a picking robot and a control device. The picking robot transfers an object from a first space to a second space by using a robot hand. The control device controls the picking robot. When a first measurement result related to a shape of the object in the first space when viewed along a first direction is acquired, the control device performs a first calculation of calculating a position candidate for placing the object in the second space based on the first measurement result. When a second measurement result related to a shape of the object when viewed along a second direction is acquired, the control device performs a second calculation of calculating a position of the robot hand when placing the object in the second space based on the second measurement result and the position candidate.

Abstract: According to one embodiment, a robot hand grips an object. The robot hand includes first and second communicators, and a hand controller. The first communicator communicates grip data with a first device. The grip data is related to a gripping operation. The second communicator communicates a start notification and an end notification with a second device. The second communicator can communicate faster than the first communicator. The start notification is for starting the gripping operation. The end notification indicates an end of the gripping operation. The hand controller controls the gripping operation. In response to the start notification input to the second communicator, the hand controller starts the gripping operation. In response to the end of the gripping operation, the hand controller performs outputting the end notification, and outputting at least one of a result of the gripping operation or a state of the robot hand.

Abstract: An object handling control device includes one or more processors configured to acquire at least object information and status information representing an initial position and a destination of an object; set, when a grasper grasping the object moves from the initial position to the destination, a first region, a second region, and a third region in accordance with the object information and the status information; and calculate a moving route along which the object is moved from the initial position to the destination with reference to the first region, the second region, and the third region.

Abstract: According to one embodiment, an object handling device causes a hand to grasp, convey, and place an object in a container. The object handling device includes one or more processors configured to calculate an expanded interference region by combining an interference region of the hand interfering with another object and an interference region of the grasped object interfering with the another object; calculate at least a placement position between the placement position and a placement posture of the object in the container in accordance with information on an obstacle in the container and the expanded interference region; and calculate a release position at which the hand releases the object, on the basis of the placement position of the object.

Abstract: A mask-integrated surface protective film, containing: a substrate film, and a mask material layer provided on the substrate film; wherein the mask material layer is an ethylene-vinyl acetate copolymer resin, an ethylene-methyl acrylate copolymer resin, or an ethylene-butyl acrylate copolymer resin; and wherein the thickness of the mask material layer is 50 ?m or less.

Abstract: An object handling control device includes one or more processors configured to acquire at least object information and status information representing an initial position and a destination of an object; set, when a grasper grasping the object moves from the initial position to the destination, a first region, a second region, and a third region in accordance with the object information and the status information; and calculate a moving route along which the object is moved from the initial position to the destination with reference to the first region, the second region, and the third region.

Abstract: A wafer-fixing tape, having: an temporary-adhesive layer provided on a substrate film, wherein the substrate film contains an ionomer resin comprising a terpolymer crosslinked by a metal ion, and wherein an arithmetic average roughness Ra of a surface of the substrate film opposite to the temporary-adhesive layer 5b is from 0.1 to 3.0 ?m; a processing method of a semiconductor wafer; and a semiconductor chip.

Abstract: According to one embodiment, an object handling device causes a hand to grasp, convey, and place an object in a container. The object handling device includes one or more processors configured to calculate an expanded interference region by combining an interference region of the hand interfering with another object and an interference region of the grasped object interfering with the another object; calculate at least a placement position between the placement position and a placement posture of the object in the container in accordance with information on an obstacle in the container and the expanded interference region; and calculate a release position at which the hand releases the object, on the basis of the placement position of the object.

Abstract: A method of processing a semiconductor wafer, in which a mask is formed: by cutting, with CO2 laser, a portion corresponding to a street, out of a temporary-adhesive of a surface protective tape to protect on a patterned face; carrying out dicing with SF6 plasma; and carrying out ashing, by removing a layer of the temporary-adhesive, with O2 plasma; a semiconductor chip; and a surface protective tape.

Abstract: A method of producing a semiconductor chip, including the following steps (a) to (d): (a) a step of, in the state of having laminated a mask-integrated surface protective tape on the side of a patterned surface of a semiconductor wafer, grinding the backing-face of the semiconductor wafer; laminating a wafer fixing tape on the backing-face side of the ground semiconductor wafer; and supporting and fixing the wafer to a ring flame; (b) a step of, after peeling the surface protective tape thereby to expose the mask material layer on top, forming an opening of a street of the semiconductor wafer; (c) a plasma dicing step of segmentalizing the semiconductor wafer by a plasma irradiation to singulate it into semiconductor chips; and (d) an ashing step of removing the mask material layer by the plasma irradiation.

Abstract: A mask-integrated surface protective tape, containing: a substrate film; a temporary-adhesive layer provided on the substrate film; and a mask material layer provided on the temporary-adhesive layer; wherein the mask material layer and the temporary-adhesive layer each contain a (meth)acrylic copolymer; and wherein the mask-integrated surface protective tape is used for a method of producing a semiconductor chip utilizing a plasma-dicing.

Abstract: A method of producing a semiconductor chip, including the following steps (a) to (d): (a) a step of, in the state of having laminated a mask-integrated surface protective tape on the side of a patterned surface of a semiconductor wafer, grinding the backing-face of the semiconductor wafer; laminating a wafer fixing tape on the backing-face side of the ground semiconductor wafer; and supporting and fixing the wafer to a ring flame; (b) a step of, after peeling the surface protective tape thereby to expose the mask material layer on top, forming an opening of a street of the semiconductor wafer; (c) a plasma dicing step of segmentalizing the semiconductor wafer by a plasma irradiation to singulate it into semiconductor chips; and (d) an ashing step of removing the mask material layer by the plasma irradiation.

Abstract: A mask-integrated surface protective film, containing: a substrate film, and a mask material layer provided on the substrate film; wherein the mask material layer is an ethylene-vinyl acetate copolymer resin, an ethylene-methyl acrylate copolymer resin, or an ethylene-butyl acrylate copolymer resin; and wherein the thickness of the mask material layer is 50 ?m or less.

Abstract: A wafer-fixing tape, having: an temporary-adhesive layer provided on a substrate film, wherein the substrate film contains an ionomer resin comprising a terpolymer crosslinked by a metal ion, and wherein an arithmetic average roughness Ra of a surface of the substrate film opposite to the temporary-adhesive layer 5b is from 0.1 to 3.0 ?m; a processing method of a semiconductor wafer; and a semiconductor chip.

Abstract: A method of processing a semiconductor wafer, in which a mask is formed: by cutting, with CO2 laser, a portion corresponding to a street, out of a temporary-adhesive of a surface protective tape to protect on a patterned face; carrying out dicing with SF6 plasma; and carrying out ashing, by removing a layer of the temporary-adhesive, with O2 plasma; a semiconductor chip; and a surface protective tape.

Abstract: A cutting device comprises an endless band cutter extending between two pulleys, a sliding piece slidingly contacting with the rear face of the endless band cutter to remove adherent from the endless band cutter, and a side plate so arranged as to separate interlayer extra fringe which has been cut off by the endless band cutter from the circumference defining face of the sheets of plate glass. This arrangement prevents the interlayer extra fringe which has been cut off from being taken up by the pulleys and from getting on the plate glass.