Abstract: The present invention aims to provide a beverage with increased fullness. In particular, the present invention aims to provide a non-alcoholic beer-taste beverage with increased fullness. The present invention relates to, for example, a non-alcoholic beer-taste beverage containing adenosine at a concentration of 8 ppm or more.

Abstract: The present invention relates to a browning-inhibiting composition containing a compound represented by the following formula (1): wherein R21, R22, R23, R24, R26 and R27 each independently represent a hydrogen atom or a substituent, and at least one of R21 or R23 is a hydrogen atom; when R23 represents a hydrogen atom, at least one of R22 or R24 represents a substituent; R25 represents a hydrogen atom, an oxygen atom, or a substituent; R22 and R23, or R23 and R24 may be bonded together to form a ring with an oxygen atom and a carbon atom to which these Rs are bonded; R25 and R26, or R26 and R27 may be bonded together to form a ring structure with carbon atoms to which these Rs are bonded; X represents an oxygen atom or —CH2—; and a dashed line may represent a double bond.

Abstract: The present invention aims to provide a beverage with increased fullness. In particular, the present invention aims to provide a non-alcoholic beer-taste beverage with increased fullness. The present invention relates to a non-alcoholic beer-taste beverage containing 2?-deoxyadenosine at a concentration of 1 ppm or more.

Abstract: A glycated protein is disclosed having a glycated side chain amino group of lysine, the glycated protein having a glycated side chain amino group of at least one of lysine at position 160 or lysine at position 189 of an amino acid sequence represented by SEQ ID NO: 1 of: (a1) a protein having the amino acid sequence represented by SEQ ID NO: 1; (a2) a protein having an amino acid sequence wherein 1 to 9 amino acids are deleted, substituted, inserted, and/or added in a region other than at least one of lysine at position 160 or lysine at position 189; and (a3) a protein having an amino acid sequence having at least 98% identity with the amino acid sequence represented by SEQ ID NO: 1, in which at least one of an amino acid at position 160 or an amino acid at position 189 is lysine.

Abstract: The present invention aims to provide a non-alcoholic beer-taste beverage with an enhanced rich flavor and a reduced sour flavor using a grain-derived raw material. The present invention relates to a non-alcoholic beer-taste beverage having an alcohol content of less than 1.0%, the non-alcoholic beer-taste beverage containing a glycated protein which is a grain-derived protein, has a glycated amino group of lysine, and has a molecular weight of 35 to 50 kDa.

Abstract: It is an object of the present invention to provide a capsule comprising a functional substance and having good shape stability and a good feeling of use. A method for producing a capsule, comprising steps of mixing gelatin and a functional substance; adding a carbodiimide crosslinking agent to crosslink the gelatin with the carbodiimide crosslinking agent; solidifying the crosslinked gelatin; and grinding the solidified gelatin.

Abstract: The present invention relates to a browning-inhibiting composition containing a compound represented by the following formula (1): wherein R21, R22, R23, R24, R26 and R27 each independently represent a hydrogen atom or a substituent, and at least one of R21 or R23 is a hydrogen atom; when R23 represents a hydrogen atom, at least one of R22 or R24 represents a substituent; R25 represents a hydrogen atom, an oxygen atom, or a substituent; R22 and R23, or R23 and R24 may be bonded together to form a ring with an oxygen atom and a carbon atom to which these Rs are bonded; R25 and R26, or R26 and R27 may be bonded together to form a ring structure with carbon atoms to which these Rs are bonded; X represents an oxygen atom or —CH2—; and a dashed line may represent a double bond.

Abstract: It is an object of the present invention to provide a capsule comprising a functional substance and having good shape stability and a good feeling of use. A method for producing a capsule, comprising steps of mixing gelatin and a functional substance; adding a carbodiimide crosslinking agent to crosslink the gelatin with the carbodiimide crosslinking agent; solidifying the crosslinked gelatin; and grinding the solidified gelatin.

Abstract: An electronic device includes a first drive substrate (a pressure chamber substrate and a vibration plate) including a piezoelectric element formed thereon, and a second substrate (a sealing plate) bonded to the first drive substrate, a bonding resin forms an accommodating space that surrounds and accommodates a drive region of the piezoelectric element between the first substrate and the second substrate, and a reinforced resin that supports the first substrate and the second substrate in a position deviated from the drive region in the accommodating space.

Abstract: An electronic device includes a first substrate that has a drive region in a first surface, and a second substrate that has a second surface that is joined to the first surface by a joining resin portion composed of a photosensitive resin. In the electronic device, a space that houses the drive region is defined between the first surface and the second surface by the joining resin portion, and a joining surface of the joining resin portion joined to the first surface is smaller than a joining surface of the joining resin portion joined to the second surface.

Abstract: An electronic device includes a first substrate that has a drive region in a first surface, and a second substrate that has a second surface that is joined to the first surface by a joining resin portion composed of a photosensitive resin. In the electronic device, a space that houses the drive region is defined between the first surface and the second surface by the joining resin portion, and a joining surface of the joining resin portion joined to the first surface is smaller than a joining surface of the joining resin portion joined to the second surface.

Abstract: An electronic device includes a drive substrate (a pressure chamber substrate and a vibration plate) including a piezoelectric element and electrode wirings related to driving of the piezoelectric element formed thereon, and a sealing plate bonded thereto, the electrode wirings are made of wiring metal containing gold (Au) on the drive substrate through an adhesion layer which is a base layer, and has a removed portion in which a portion of the wiring metal in a region containing a part bonded to a bonding resin is removed and the adhesion layer is exposed.

Abstract: A semiconductor device has a through electrode formed in a through hole which penetrates a Si substrate from one surface to the other surface of the Si substrate, wherein a rectangular electrode pad is provided on the other surface with an insulation film laid between the electrode pad and the other surface, an opening of the through hole on the one surface side is circular, an opening of the through hole on the other surface side is rectangular, and the area of the opening on the other surface side is made smaller than the area of the opening on the one surface side.

Abstract: An electronic device includes a drive substrate (a pressure chamber substrate and a vibration plate) including a piezoelectric element and electrode wirings related to driving of the piezoelectric element formed thereon, and a sealing plate bonded thereto, the electrode wirings are made of wiring metal containing gold (Au) on the drive substrate through an adhesion layer which is a base layer, and has a removed portion in which a portion of the wiring metal in a region containing a part bonded to a bonding resin is removed and the adhesion layer is exposed.

Abstract: An electronic device includes a first drive substrate (a pressure chamber substrate and a vibration plate) including a piezoelectric element formed thereon, and a second substrate (a sealing plate) bonded to the first drive substrate, a bonding resin forms an accommodating space that surrounds and accommodates a drive region of the piezoelectric element between the first substrate and the second substrate, and a reinforced resin that supports the first substrate and the second substrate in a position deviated from the drive region in the accommodating space.

Abstract: A semiconductor device has a through electrode formed in a through hole which penetrates a Si substrate from one surface to the other surface of the Si substrate, wherein a rectangular electrode pad is provided on the other surface with an insulation film laid between the electrode pad and the other surface, an opening of the through hole on the one surface side is circular, an opening of the through hole on the other surface side is rectangular, and the area of the opening on the other surface side is made smaller than the area of the opening on the one surface side.

Abstract: A semiconductor device has a through electrode formed in a through hole which penetrates a Si substrate from one surface to the other surface of the Si substrate, wherein a rectangular electrode pad is provided on the other surface with an insulation film laid between the electrode pad and the other surface, an opening of the through hole on the one surface side is circular, an opening of the through hole on the other surface side is rectangular, and the area of the opening on the other surface side is made smaller than the area of the opening on the one surface side.

Abstract: A semiconductor device has a through electrode formed in a through hole which penetrates a Si substrate from one surface to the other surface of the Si substrate, wherein a rectangular electrode pad is provided on the other surface with an insulation film laid between the electrode pad and the other surface, an opening of the through hole on the one surface side is circular, an opening of the through hole on the other surface side is rectangular, and the area of the opening on the other surface side is made smaller than the area of the opening on the one surface side.

Abstract: A semiconductor device has a through electrode formed in a through hole which penetrates a Si substrate from one surface to the other surface of the Si substrate, wherein a rectangular electrode pad is provided on the other surface with an insulation film laid between the electrode pad and the other surface, an opening of the through hole on the one surface side is circular, an opening of the through hole on the other surface side is rectangular, and the area of the opening on the other surface side is made smaller than the area of the opening on the one surface side.

Abstract: A semiconductor device has a through electrode formed in a through hole which penetrates a Si substrate from one surface to the other surface of the Si substrate, wherein a rectangular electrode pad is provided on the other surface with an insulation film laid between the electrode pad and the other surface, an opening of the through hole on the one surface side is circular, an opening of the through hole on the other surface side is rectangular, and the area of the opening on the other surface side is made smaller than the area of the opening on the one surface side.