Patents by Inventor Yoshihide Okawa

Yoshihide Okawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12042840
    Abstract: A hot press processing device 1 includes steps of: a heating step of heating a workpiece W; a press step of press-molding the workpiece W heated in the heating step; a cooling step of cooling a part of the workpiece W press-molded in the press step and causing it to undergo martensite transformation to form a hard zone Zh in the workpiece W, and cooling another part of the workpiece W and causing it to undergo ferrite/bainite transformation to form a soft zone Zs in the workpiece W. In the cooling step, the hot press processing device 1 cools a predetermined portion Zb in the soft zone Zs after increasing rigidity and hardness of the predetermined portion Zb.
    Type: Grant
    Filed: February 14, 2019
    Date of Patent: July 23, 2024
    Assignee: MAZDA MOTOR CORPORATION
    Inventors: Naoyuki Irie, Ichirou Ino, Yoshihide Hirao, Chie Okawa
  • Publication number: 20240047847
    Abstract: An antenna device includes an antenna, a first base member, a second base member, a support, and a first fixing member. The antenna, the first base member, the second base member, and the support are arrayed in this order. The first base member and the second base member are spaced apart from each other and coupled via the first fixing member.
    Type: Application
    Filed: December 10, 2021
    Publication date: February 8, 2024
    Applicant: KYOCERA Corporation
    Inventors: Yoshihide OKAWA, Sentarou YAMAMOTO
  • Publication number: 20240047894
    Abstract: An antenna device includes a first substrate and an antenna. The first substrate has a through hole penetrating in the thickness direction. The antenna includes a second substrate and an element portion including a circuit unit on the second substrate. The second substrate is located in the through hole with a gap from the first substrate.
    Type: Application
    Filed: December 10, 2021
    Publication date: February 8, 2024
    Applicant: KYOCERA Corporation
    Inventors: Yoshihide OKAWA, Sentarou YAMAMOTO
  • Publication number: 20230387565
    Abstract: An antenna device includes an antenna portion, a connecting portion, and a support. The connecting portion connects the antenna portion and the support. The support is located above the antenna portion and includes a channel extending from an inflow opening located opposite to the antenna portion to an outflow opening located farther from the antenna portion than the inflow opening.
    Type: Application
    Filed: October 28, 2021
    Publication date: November 30, 2023
    Applicant: KYOCERA Corporation
    Inventors: Yoshihide OKAWA, Sentarou YAMAMOTO
  • Publication number: 20230282791
    Abstract: A wiring board includes a metal substrate, an insulating resin layer positioned on the metal substrate, the insulating resin layer including: a first surface facing the metal substrate, a second surface positioned opposite to the first surface, third surfaces positioned between the first surface and the second surface, first ridge portions where the first surface meets the third surfaces, second ridge portions where the second surface meets the third surfaces; and a first closed pore group closer to the first ridge portions than to the second ridge portions. The first closed pore group includes a plurality of closed pores densely contained.
    Type: Application
    Filed: July 21, 2021
    Publication date: September 7, 2023
    Applicant: KYOCERA Corporation
    Inventors: Kazuhiro OKAMOTO, Sentarou YAMAMOTO, Yuhei MATSUMOTO, Yoshihide OKAWA
  • Publication number: 20230160560
    Abstract: A substrate support body includes a support plate, an enclosure member, and a bonding material. The enclosure member is arranged on the support plate. The bonding material is arranged on an entire surface of an inner region of the enclosure member and is bonded to the support plate.
    Type: Application
    Filed: April 23, 2021
    Publication date: May 25, 2023
    Applicant: KYOCERA Corporation
    Inventors: Yuhei MATSUMOTO, Sentarou YAMAMOTO, Kazuhiro OKAMOTO, Yoshihide OKAWA
  • Publication number: 20220367759
    Abstract: A light emitting element mounting package includes a substrate and an insulating layer, the insulating layer is provided on a first surface of the substrate and has a through hole that penetrates in a direction perpendicular to the first surface, and a wall surface facing the through hole has a stepped portion, in which a diameter of the through hole is small on the side closer to the substrate and is large on the side far from the substrate.
    Type: Application
    Filed: October 28, 2020
    Publication date: November 17, 2022
    Applicant: KYOCERA Corporation
    Inventors: Yuhei MATSUMOTO, Sentarou YAMAMOTO, Kazuhiro OKAMOTO, Yoshihide OKAWA
  • Publication number: 20220328718
    Abstract: A light emitting element mounting package includes a substrate, an insulating layer, and a metal layer. The insulating layer includes a through hole penetrating in a thickness direction and is provided on the substrate. The metal layer is disposed on the substrate in at least the through hole, and includes a protruding portion extending from the substrate along an inner wall of the through hole. The protruding portion has the shape of a connected body in which metal particles are connected together. The inner wall of the insulating layer includes, closer to the substrate, an inclined surface where the through hole becomes wider, and the protruding portion contacts the inclined surface.
    Type: Application
    Filed: August 26, 2020
    Publication date: October 13, 2022
    Applicant: KYOCERA Corporation
    Inventors: Yoshihide OKAWA, Sentarou YAMAMOTO, Kazuhiro OKAMOTO, Yuhei MATSUMOTO, Kazuki NISHIMOTO, Kouichirou SUGAI
  • Patent number: 9023680
    Abstract: A method for producing a compound semiconductor layer comprises dissolving a metal feedstock comprising at least one of a group I-B element and a group III-B element, in a metal state, in a mixed solvent comprising an organic compound containing a chalcogen element and a Lewis base organic compound to produce a solution for forming a semiconductor; forming a coat using the solution for forming a semiconductor; and heat-treating the coat.
    Type: Grant
    Filed: July 27, 2010
    Date of Patent: May 5, 2015
    Assignee: KYOCERA Corporation
    Inventors: Seiichiro Inai, Yoshihide Okawa, Isamu Tanaka, Koichiro Yamada
  • Publication number: 20130153014
    Abstract: A photoelectric converter is disclosed. The photoelectric converter includes an electrode layer and a semiconductor layer. The semiconductor layer is on the electrode layer. The semiconductor layer contains a chalcopyrite compound semiconductor. The semiconductor layer comprises a plurality of sub-layers. The plurality of sub-layers comprises a first sub-layer. The first sub-layer is located closest to the electrode layer. The first sub-layer has a first thickness smaller than an average thickness of the rest of the plurality of sub-layers.
    Type: Application
    Filed: September 26, 2011
    Publication date: June 20, 2013
    Applicant: KYOCERA CORPORATION
    Inventors: Ryo Matsuoka, Manabu Kyuzo, Nobuyuki Horiuchi, Rui Kamada, Daisuke Toyota, Yoshihide Okawa
  • Patent number: 8278134
    Abstract: The production method of a photoelectric conversion device comprises adding a chalcogenide powder of a group-IIIB element to an organic solvent including a single source precursor containing a group-IB element, a group-IIIB element, and a chalcogen element to prepare a solution for forming a semiconductor, and forming a semiconductor containing a group-I-III-VI compound by use of the solution for forming a semiconductor.
    Type: Grant
    Filed: March 29, 2010
    Date of Patent: October 2, 2012
    Assignee: Kyocera Corporation
    Inventors: Isamu Tanaka, Seiichiro Inai, Yoshihide Okawa, Daisuke Nishimura, Sentaro Yamamoto
  • Publication number: 20120070937
    Abstract: A method for producing a compound semiconductor layer comprises dissolving a metal feedstock comprising at least one of a group I-B element and a group III-B element, in a metal state, in a mixed solvent comprising an organic compound containing a chalcogen element and a Lewis base organic compound to produce a solution for forming a semiconductor; forming a coat using the solution for forming a semiconductor; and heat-treating the coat.
    Type: Application
    Filed: July 27, 2010
    Publication date: March 22, 2012
    Applicant: KYOCERA CORPORATION
    Inventors: Seiichiro Inai, Yoshihide Okawa, Isamu Tanaka, Koichiro Yamada
  • Publication number: 20110244624
    Abstract: The production method of a photoelectric conversion device comprises the steps of adding a chalcogenide powder of a group-IIIB element to an organic solvent including a single source precursor containing a group-IB element, a group-IIIB element, and a chalcogen element to prepare a solution for forming a semiconductor, and forming a semiconductor containing a group-I-III-VI compound by use of the solution for forming a semiconductor.
    Type: Application
    Filed: March 29, 2010
    Publication date: October 6, 2011
    Applicant: KYOCERA CORPORATION
    Inventors: Isamu Tanaka, Seiichiro Inai, Yoshihide Okawa, Daisuke Nishimura, Sentaro Yamamoto