Patents by Inventor Yoshihiko Aoyagi

Yoshihiko Aoyagi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11098227
    Abstract: The conductive adhesive includes a thermosetting resin (A) and a conductive filler (B), and has a loss modulus at 200° C. from 5.0×104 Pa to 4.0×105 Pa.
    Type: Grant
    Filed: August 2, 2018
    Date of Patent: August 24, 2021
    Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
    Inventors: Yoshihiko Aoyagi, Osamu Isobe, Kenji Kamino
  • Patent number: 10723920
    Abstract: A conductive adhesive contains a thermosetting resin (A), a conductive filler (B), and a filling-performance improver (C). The thermosetting resin (A) contains a first resin component (A1) having a first functional group, and a second resin component (A2) having a second functional group that reacts with the first functional group. The filling-performance improver (C) contains an organic salt. The conductive adhesive contains from 40 to 140 parts by mass of the filling-performance improver (C) relative to 100 parts by mass of the thermosetting resin.
    Type: Grant
    Filed: August 2, 2018
    Date of Patent: July 28, 2020
    Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
    Inventors: Yoshihiko Aoyagi, Osamu Isobe, Kenji Kamino
  • Publication number: 20200040231
    Abstract: A conductive adhesive contains a thermosetting resin (A), a conductive filler (B), and a filling-performance improver (C). The thermosetting resin (A) contains a first resin component (A1) having a first functional group, and a second resin component (A2) having a second functional group that reacts with the first functional group. The filling-performance improver (C) contains an organic salt. The conductive adhesive contains from 40 to 140 parts by mass of the filling-performance improver (C) relative to 100 parts by mass of the thermosetting resin.
    Type: Application
    Filed: August 2, 2018
    Publication date: February 6, 2020
    Inventors: Yoshihiko AOYAGI, Osamu ISOBE, Kenji KAMINO
  • Patent number: 10529467
    Abstract: A coaxial cable is configured so that adhesion between an insulating layer and a shield layer can be improved without addition of an adhesive component and roughening of an adhesive surface. The coaxial cable includes a center conductor, the insulating layer covering the outer periphery of the center conductor, the shield layer covering the outer periphery of the insulating layer, and a sheath covering the outer periphery of the shield layer. An anchor layer containing resin whose glass-transition point is equal to or lower than 15° C. is provided between the insulating layer and the shield layer.
    Type: Grant
    Filed: December 20, 2016
    Date of Patent: January 7, 2020
    Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
    Inventors: Yoshihiko Aoyagi, Yoshinori Kawakami, Kiyotaka Urashita
  • Publication number: 20200002582
    Abstract: The conductive adhesive includes a thermosetting resin (A) and a conductive filler (B), and has a loss modulus at 200° C. from 5.0×104 Pa to 4.0×105 Pa.
    Type: Application
    Filed: August 2, 2018
    Publication date: January 2, 2020
    Inventors: Yoshihiko AOYAGI, Osamu ISOBE, Kenji KAMINO
  • Patent number: 10403418
    Abstract: Cost reduction in a multicore cable is realized by reduction in the frequency of damaging a coaxial cable upon removal of a covering layer. A multicore cable 10 includes multiple coaxial cables 11 arranged in parallel, and ground members 15, 16 conductively connected with the coaxial cables 11. Each coaxial cable includes an internal conductor 11a, an internal insulating layer 11b covering an outer peripheral surface of the internal conductor 11a, an external conductor 11c covering an outer peripheral surface of the internal insulating layer 11b, a covering layer 11d covering an outer peripheral surface of the external conductor 11c, a removed portion 11e formed in such a manner that part of the covering layer 11d in a circumferential direction is removed such that the external conductor 11c is exposed, and a conductive member 21 filling the removed portion 11e. The ground member 15 is conductively connected with the conductive member 21 filling the removed portion 11e.
    Type: Grant
    Filed: February 21, 2017
    Date of Patent: September 3, 2019
    Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
    Inventors: Yoshihiko Aoyagi, Yoshinori Kawakami, Kiyotaka Urashita
  • Publication number: 20190115124
    Abstract: Cost reduction in a multicore cable is realized by reduction in the frequency of damaging a coaxial cable upon removal of a covering layer. A multicore cable 10 includes multiple coaxial cables 11 arranged in parallel, and ground members 15, 16 conductively connected with the coaxial cables 11. Each coaxial cable includes an internal conductor 11a, an internal insulating layer 11b covering an outer peripheral surface of the internal conductor 11a, an external conductor 11c covering an outer peripheral surface of the internal insulating layer 11b, a covering layer 11d covering an outer peripheral surface of the external conductor 11c, a removed portion 11e formed in such a manner that part of the covering layer 11d in a circumferential direction is removed such that the external conductor 11c is exposed, and a conductive member 21 filling the removed portion 11e. The ground member 15 is conductively connected with the conductive member 21 filling the removed portion 11e.
    Type: Application
    Filed: February 21, 2017
    Publication date: April 18, 2019
    Inventors: Yoshihiko AOYAGI, Yoshinori KAWAKAMI, Kiyotaka URASHITA
  • Publication number: 20190108930
    Abstract: Provided is a coaxial cable configured so that adhesion between an insulating layer and a shield layer can be improved without addition of an adhesive component and roughening of an adhesive surface. The coaxial cable includes a center conductor, the insulating layer covering the outer periphery of the center conductor, the shield layer covering the outer periphery of the insulating layer, and a sheath covering the outer periphery of the shield layer. An anchor layer containing resin whose glass-transition point is equal to or lower than 15° C. is provided between the insulating layer and the shield layer.
    Type: Application
    Filed: December 20, 2016
    Publication date: April 11, 2019
    Inventors: Yoshihiko AOYAGI, Yoshinori KAWAKAMI, Kiyotaka URASHITA
  • Patent number: 10206289
    Abstract: Soldering is performed with a high yield ratio even when extremely-thin wires are joined at an extremely-narrow pitch. Moreover, a bridge between conductive joint portions is reduced. A core wire 41 is placed on a preliminarily-soldered conductive joint portion 2. Then, the conductive joint portions 2 and the core wires 41 are covered with an optically-transparent sheet 30. Thus, the state in which the core wire 41 is placed on the conductive joint portion 2 is held. In this state, the optically-transparent sheet 30 is irradiated with light. A preliminary solder 3 is heated and melted to join the core wire 41 and the conductive joint portion 2 together.
    Type: Grant
    Filed: October 29, 2015
    Date of Patent: February 12, 2019
    Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
    Inventors: Yoshihiko Aoyagi, Yoshinori Kawakami, Yoshio Hirano, Kiyotaka Urashita, Ryota Fujikawa, Nobuhiro Fujio
  • Publication number: 20170325338
    Abstract: Soldering is performed with a high yield ratio even when extremely-thin wires are joined at an extremely-narrow pitch. Moreover, a bridge between conductive joint portions is reduced. A core wire 41 is placed on a preliminarily-soldered conductive joint portion 2. Then, the conductive joint portions 2 and the core wires 41 are covered with an optically-transparent sheet 30. Thus, the state in which the core wire 41 is placed on the conductive joint portion 2 is held. In this state, the optically-transparent sheet 30 is irradiated with light. A preliminary solder 3 is heated and melted to join the core wire 41 and the conductive joint portion 2 together.
    Type: Application
    Filed: October 29, 2015
    Publication date: November 9, 2017
    Inventors: Yoshihiko AOYAGI, Yoshinori KAWAKAMI, Yoshio HIRANO, Kiyotaka URASHITA, Ryota FUJIKAWA, Nobuhiro FUJIO
  • Patent number: 9806434
    Abstract: A core wire of a coaxial cable is easily placed and soldered onto a conductive joint portion. Conductive joint portions 2 are formed at a predetermined interval on a substrate 1. A solder resist portion 5 is formed on each side of the conductive joint portion 2. A core wire 41 of a coaxial cable 4 is housed between two of the solder resist portions 5. A core wire 41 is placed on an upper surface 2a of the conductive joint portion 2. In this state, the core wire 41 is, by solder 3, connected to the upper surface 2a of the conductive joint portion 2.
    Type: Grant
    Filed: October 29, 2015
    Date of Patent: October 31, 2017
    Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
    Inventors: Yoshihiko Aoyagi, Yoshinori Kawakami, Yoshio Hirano, Kiyotaka Urashita, Ryota Fujikawa, Nobuhiro Fujio
  • Publication number: 20170250476
    Abstract: A core wire of a coaxial cable is easily placed and soldered onto a conductive joint portion. Conductive joint portions 2 are formed at a predetermined interval on a substrate 1. A solder resist portion 5 is formed on each side of the conductive joint portion 2. A core wire 41 of a coaxial cable 4 is housed between two of the solder resist portions 5. A core wire 41 is placed on an upper surface 2a of the conductive joint portion 2. In this state, the core wire 41 is, by solder 3, connected to the upper surface 2a of the conductive joint portion 2.
    Type: Application
    Filed: October 29, 2015
    Publication date: August 31, 2017
    Inventors: Yoshihiko AOYAGI, Yoshinori KAWAKAMI, Yoshio HIRANO, Kiyotaka URASHITA, Ryota FUJIKAWA, Nobuhiro FUJIO
  • Patent number: 5588103
    Abstract: A document editor for editing and displaying elements of a graphic with a logic structure which have an inclusive, side-by-side, or connective relationship mutually. The document editor comprises an editing unit for editing any element of said logic structure and reflecting the result of editing on other elements, an output unit for externally displaying the result of reflective editing, if necessary, and a control unit for designating display or non-display of the result of reflective editing for each element of said logic structure, and controlling the output unit in terms of display or non-display of the result of reflective editing according to the designation. By the constitution, during document editing and display, stepwise display of details can be controlled according to a logic structure, and any element can be edited in a selected display stage. Eventually, the constitution contributes to a reduction in the quantity of display information and a display time interval.
    Type: Grant
    Filed: July 14, 1994
    Date of Patent: December 24, 1996
    Assignee: Fujitsu Limited
    Inventor: Yoshihiko Aoyagi