Abstract: A method for producing an L-amino acid such as L-glutamic acid is provided. An L-amino acid is produced by culturing in a culture medium a bacterium belonging to the family Enterobacteriaceae and having an L-amino acid-producing ability, and collecting the L-amino acid from the culture medium and/or cells of the bacterium, wherein the bacterium has been modified to have one or more of the following modifications: (A) modification of reducing the activity of a BudA protein; (B) modification of reducing the activity of a BudB protein; (C) modification of reducing the activity of a BudC protein; (D) modification of reducing the activity of a PAJ_3461 protein; (E) modification of reducing the activity of a PAJ_3462 protein; and (F) modification of reducing the activity of a PAJ_3463 protein.

Abstract: A control system assists generation of a distribution content item representing progress of a video game played by a user. The control system includes at least one memory that stores a program; and at least one processor that executes the program to (i) provide the user with address information representing an address of material data on an effect material used for the distribution content item, (ii) under a control condition set in accordance with instructions from the user, update the material data in conjunction with progress of the video game played by the user, and (iii) in conjunction with the progress of the video game played by the user, transmit the material data to the editing system based on a request that uses the address information from an editing system that generates the distribution content item.

Abstract: The purpose of the present invention is to provide a resin-coated ultra-thin glass having high impact resistance, satisfactory bending resistance and high transparency. Provided is a resin-coated ultra-thin glass composed of three layers, i.e., an ultra-thin glass (A) having a thickness of 10 to 100 µm inclusive, an organic film (B) formed on one surface of the ultra-thin glass (A), and an organic film (C) formed on the other surface of the ultra-thin glass (A), in which the organic film (B) is formed from a composition containing a thermoplastic resin (D) having a weight-average molecular weight of 1000 to 70000 and the organic film (C) is formed from a composition containing a siloxane resin (E).

Abstract: A black resin composition is provided that presents an achromatic reflected color tone, has a high visible-light-blocking ability and a high near-infrared penetrability, and exhibits a smaller amount of transmitted scattered light, where the black resin composition includes (A) a resin, (B) a colorant, and (C) an organic solvent, wherein the black composition includes a red pigment and a blue pigment as (B) the colorant, wherein amount of the red pigment is 20 to 80 wt % with respect to the total amount of (B) the colorant, and wherein crystalline size of the red pigment in a colored film composed of a cured product of the black resin composition is 5 nm or more and 25 nm or less, as calculated from a half bandwidth determined from a main peak of an X-ray diffraction spectrum obtained using CuK? rays as an X-ray source.

Abstract: A colored resin composition containing an alkali-soluble resin (A), a colorant (B), an organic solvent (C), and a photosensitizer (D), the colored resin composition containing at least a zirconia compound particle as the colorant (B), wherein the zirconia compound particle contains zirconium nitride having a crystallite size of 10 nm or more and 60 nm or less, and the crystallite size is determined from a half width of a peak derived from a (111) plane in an X-ray diffraction spectrum using a CuK? ray as an X-ray source. The present invention provides a highly sensitive colored resin composition by improving light transmissivity in the ultraviolet region (wavelength 365 nm) generally used in photolithography and by improving a light shielding property in the visible region.

Abstract: A transparent resin composition is provided which contains at least (A) a siloxane resin, (B) an organic solvent, and two or more kinds of (C) surfactants, wherein the surfactants include (C1) a silicone-modified acrylic surfactant and (C2) a thermally decomposable fluorine-containing surfactant, and the total content of the surfactants (C1) and (C2) is 50-500 ppm with respect to the transparent resin composition. Further provided is a transparent resin composition from which a transparent coating film, that suppresses pin hole or unevenness and has a good appearance and an excellent adhesion property to an inorganic film or an organic film, can be formed even when coated by spray coating or inkjet coating.

Abstract: Provided is a colored resin composition including: a resin (A); a colorant (B); and an organic solvent (C), the colored resin composition including at least a bisbenzofuranone-based pigment as the colorant (B), wherein the bisbenzofuranone-based pigment has a crystallite size of 10 nm or more and 25 nm or less in a colored film consisting of a cured product of the colored resin composition, the colored resin composition that has excellent light resistance, a high visible light shielding property, and high near-infrared transmissivity, and causes little transmitted scattered light.

Abstract: A colored resin composition containing an alkali-soluble resin (A), a colorant (B), an organic solvent (C), and a photosensitizer (D), the colored resin composition containing at least a zirconia compound particle as the colorant (B), wherein the zirconia compound particle contains zirconium nitride having a crystallite size of 10 nm or more and 60 nm or less, and the crystallite size is determined from a half width of a peak derived from a (111) plane in an X-ray diffraction spectrum using a CuK? ray as an X-ray source. The present invention provides a highly sensitive colored resin composition by improving light transmissivity in the ultraviolet region (wavelength 365 nm) generally used in photolithography and by improving a light shielding property in the visible region.

Abstract: A negative photosensitive resin composition is provided which contains (A) a siloxane resin having a radically polymerizable group and a carboxyl group and/or a dicarboxylic acid anhydride group, (B) a reactive monomer, (C) a radical photopolymerization initiator, (D) silica particles and (E) a siloxane compound having an oxetanyl group. The present invention provides a negative photosensitive resin composition which is capable of forming a cured film that has high glass surface strength, while exhibiting excellent adhesion to an inorganic film or to an organic film.

Abstract: A transparent resin composition is provided which contains at least (A) a siloxane resin, (B) an organic solvent, and two or more kinds of (C) surfactants, wherein the surfactants include (C1) a silicone-modified acrylic surfactant and (C2) a thermally decomposable fluorine-containing surfactant, and the total content of the surfactants (C1) and (C2) is 50-500 ppm with respect to the transparent resin composition. Further provided is a transparent resin composition from which a transparent coating film, that suppresses pin hole or unevenness and has a good appearance and an excellent adhesion property to an inorganic film or an organic film, can be formed even when coated by spray coating or inkjet coating.

Abstract: A colored resin composition is disclosed including a polyimide resin having a specified structure to achieve remarkable heat resistance and enabling the formation of a colored film which is excellent in reliability because a coloring material is highly dispersed and stabilized therein. A colored resin composition is disclosed including (A) an alkali-soluble polyimide resin having a structural unit containing a phenolic hydroxyl group, a sulfonic acid group or a thiol group, (B) a coloring material, (C) a polymeric dispersant, and (D) an organic solvent. A patterned colored layer obtained from the composition of the present invention is useful for a decorative substrate, a touch panel, an organic EL display device and the like.

Abstract: The purpose of the present invention is to provide a negative-type photosensitive coloring composition ideal for forming a white, light-blocking pattern and which not only has excellent chemical resistance, but also has extremely excellent heat resistance and does not yellow or crack even when undergoing high-temperature processing. This negative-type photosensitive coloring composition contains (A) a white pigment, (B) a polysiloxane obtained by co-hydrolyzate condensation of an alkoxysilane compound containing a compound of a specific structure, (C) polyfunctional acrylic monomers, (D) a photoradical polymerization initiator and (E) an organic solvent.

Abstract: The object of the present invention is to provide a solar cell sealing film obtained from a composition comprising chiefly ethylene-vinyl acetate copolymer and organic peroxides for giving crosslinked structure, which suppresses the occurrence of blisters without reduction of crosslink rate, even if the film contains silane-coupling agents for improving adhesive strength. The solar cell sealing film comprises ethylene-vinyl acetate copolymer, an organic peroxide, a silane-coupling agent, and a phosphite compound represented by formula (I): P(OR1)3??(I) wherein, R1 is a branched-chain aliphatic alkyl group having 8 to 14 carbon atoms, and three R1s are the same as or different from each other and further wherein the content of the vinyl acetate recurring unit of the ethylene-vinyl acetate copolymer is in the range of 20 to 35% by weight.

Abstract: A method for bypassing a defective through silicon via x in a group of n adjacent through silicon vias, includes receiving a plurality of relief signals to identify the defective through silicon via x, activating x?1 switch circuits to connect x?1 data circuits to through silicon vias 1 to x?1 in the group of n adjacent through silicon vias, activating n?x switch circuits to connect n?x data circuits to through silicon vias x+1 to n in the group of n adjacent through silicon vias, and activating a switch circuit to connect a data circuit to an auxiliary through silicon via which is adjacent through silicon via n in the group of n adjacent through silicon vias.

Abstract: Disclosed is a black resin composition with which a black matrix having high insulation properties even after heat treatment at a high temperature and, in addition, achromatic reflection properties can be readily formed. The black resin composition comprises (A) a light-shielding material, (B) an alkali-soluble resin, and (C) an organic solvent, and comprises (A-1) a carbon black and (A-2) titanium nitride compound particles as the light-shielding material (A). The carbon black (A-1) is surface-treated with a sulfur-containing compound, and in the surface composition, the percentage of carbon atoms is 95% or less and the percentage of sulfur atoms is 0.5% or more.

Abstract: The purpose of the present invention is to provide a negative-type photosensitive coloring composition ideal for forming a white, light-blocking pattern and which not only has excellent chemical resistance, but also has extremely excellent heat resistance and does not yellow or crack even when undergoing high-temperature processing. This negative-type photosensitive coloring composition contains (A) a white pigment, (B) a polysiloxane obtained by co-hydrolyzate condensation of an alkoxysilane compound containing a compound of a specific structure, (C) polyfunctional acrylic monomers, (D) a photoradical polymerization initiator and (E) an organic solvent.

Abstract: A method for bypassing a defective through silicon via x in a group of n adjacent through silicon vias, includes receiving a plurality of relief signals to identify the defective through silicon via x, activating x?1 switch circuits to connect x?1 data circuits to through silicon vias 1 to x?1 in the group of n adjacent through silicon vias, activating n?x switch circuits to connect n?x data circuits to through silicon vias x+1 to n in the group of n adjacent through silicon vias, and activating a switch circuit to connect a data circuit to an auxiliary through silicon via which is adjacent through silicon via n in the group of n adjacent through silicon vias.

Abstract: The object of the present invention to provide a solar cell sealing film, which has superior durability that maintains adhesive performance for a long duration under the circumstances of a high temperature and high humidity, exerts high crosslink rate at production of the solar cells, and suppresses occurrence of blister, and a solar cell using the sealing film. The solar cell sealing film includes: ethylene-polar monomer copolymer, an organic peroxide, and a silane-coupling agent, wherein the silane-coupling agent is represented by formula (I): in which R1 represents alkyl group having 1 to 3 carbon atoms, three R1s are the same as or different from each other, and “n” is an integer of 1 to 8; and the silane-coupling agent is contained in the range of 0.02 to 1.0 parts by weight based on 100 parts by weight of the ethylene-polar monomer copolymer.

Abstract: A method for bypassing a defective through silicon via x in a group of n adjacent through silicon vias, includes receiving a plurality of relief signals to identify the defective through silicon via x, activating x?1 switch circuits to connect x?1 data circuits to through silicon vias 1 to x?1 in the group of n adjacent through silicon vias, activating n-x switch circuits to connect n-x data circuits to through silicon vias x+1 to n in the group of n adjacent through silicon vias, and activating a switch circuit to connect a data circuit to an auxiliary through silicon via which is adjacent through silicon via n in the group of n adjacent through silicon vias.

Abstract: A method for bypassing a defective through silicon via x in a group of n adjacent through silicon vias, includes receiving a plurality of relief signals to identify the defective through silicon via x, activating x?1 switch circuits to connect x?1 data circuits to through silicon vias 1 to x?1 in the group of n adjacent through silicon vias, activating n-x switch circuits to connect n-x data circuits to through silicon vias x+1 to n in the group of n adjacent through silicon vias, and activating a switch circuit to connect a data circuit to an auxiliary through silicon via which is adjacent through silicon via n in the group of n adjacent through silicon vias.