Abstract: In an ingot cutting apparatus that cuts an ingot using a plurality of stretched wires, load sensors are provided on the new wire side and the old wire side of the ingot, and loads applied to the new wire side and the old wire side of the ingot are measured using the load sensors on the new wire side and the old wire side. When measuring the loads, for example, the center of moment about the X-axis that is the running direction of the wire is calculated. When the deviation from the center of gravity of the ingot is greater than or equal to a reference value, notification for replacement of the wire, control of the conveying speed of the wire, control of the pressing speed of the ingot, and so forth are performed through a control unit.

Abstract: In an ingot cutting apparatus that cuts an ingot using a plurality of stretched wires, load sensors are provided on the new wire side and the old wire side of the ingot, and loads applied to the new wire side and the old wire side of the ingot are measured using the load sensors on the new wire side and the old wire side. When measuring the loads, for example, the center of moment about the X-axis that is the running direction of the wire is calculated. When the deviation from the center of gravity of the ingot is greater than or equal to a reference value, notification for replacement of the wire, control of the conveying speed of the wire, control of the pressing speed of the ingot, and so forth are performed through a control unit.

Abstract: Disclosed is a communication technology in which the effect of packet loss can be easily reduced to the extent that it can be ignored, even on networks where packet loss can easily occur. Specifically, a communication device is disclosed that includes a packet loss determination unit that determines whether a packet that transmits image information has been lost, and an interpolated packet transmission unit that transmits an interpolated packet when a packet that transmits image information has been lost.

Abstract: Task: To provide communication technology in which clock synchronization accuracy can be easily maintained, even on networks where packets can be easily lost. Resolution Means: A communication device, comprising: a transmission unit that includes a flag processing unit that, upon receipt of one or a plurality of MPEG-2 TS packets, applies flag information to the packets at a predetermined interval in the forward reproduction direction of the packets, and a time stamp application unit that generates MPEG-2 TTS packets by applying a time stamp value calculated using a GPS clock to each of the one or a plurality of MPEG-2 TS packets, including the MPEG-2 TS packets having the flag information applied by the flag processing unit, and transmits the MPEG-2 TTS packets to a transmission path.

Abstract: Disclosed is a communication technology in which the effect of packet loss can be easily reduced to the extent that it can be ignored, even on networks where packet loss can easily occur. Specifically, a communication device is disclosed that includes a packet loss determination unit that determines whether a packet that transmits image information has been lost, and an interpolated packet transmission unit that transmits an interpolated packet when a packet that transmits image information has been lost.

Abstract: Task: To provide communication technology in which clock synchronization accuracy can be easily maintained, even on networks where packets can be easily lost. Resolution Means: A communication device, comprising: a transmission unit that includes a flag processing unit that, upon receipt of one or a plurality of MPEG-2 TS packets, applies flag information to the packets at a predetermined interval in the forward reproduction direction of the packets, and a time stamp application unit that generates MPEG-2 TTS packets by applying a time stamp value calculated using a GPS clock to each of the one or a plurality of MPEG-2 TS packets, including the MPEG-2 TS packets having the flag information applied by the flag processing unit, and transmits the MPEG-2 TTS packets to a transmission path.

Abstract: A three-dimensional circuit board is formed by comprising a board, a first wiring-electrode group provided on a plurality of steps above the board, and a second wiring-electrode connected to the first wiring-electrode group at least in an altitude direction, in which at least a connecting portion between the first wiring-electrode group and the second wiring-electrode is integrated in a continuously identical shape.

Abstract: A conductive bump formed on an electrode surface of an electronic component. This conductive bump is composed of a plurality of photosensitive resin layers having different conductive filler contents. Consequently, this conductive bump is able to realize conflicting functions, namely, improvement in adhesion strength with the electrode and reduction of contact resistance.

Abstract: Three-dimensional structure (40) of the present invention includes first module board (28), second module board (37), and substrate joining member (10) that unifies board (28) and board (37) into one body, thereby electrically connecting these two elements together. The unification is done by molding the outer wall of housing (12) of substrate joining member (10) with resin (29). Substrate joining member (10) used in the three-dimensional structure (40) includes multiple lead terminals (14) made of conductive material, and a frame-shaped and insulating housing (12) to which frame the lead terminals (14) are fixed vertically in a predetermined array. Housing (12) includes projections (18) on at least two outer wall faces of its frame shape.

Abstract: A three-dimensional circuit board is formed by comprising a board, a first wiring-electrode group provided on a plurality of steps above the board, and a second wiring-electrode connected to the first wiring-electrode group at least in an altitude direction, in which at least a connecting portion between the first wiring-electrode group and the second wiring-electrode is integrated in a continuously identical shape.

Abstract: Relay substrate (1) connecting between at least a first circuit board and a second circuit board, including housing (10) having recess (10a) provided in the outer circumference and hole (22) provided in the inner circumference; plural connecting terminal electrodes (12a, 12c) connecting between the top and bottom surfaces of housing (10); shield electrode (11) provided in recess (10a); and ground electrode (13) provided on a part of the top and bottom surfaces of housing (10).

Abstract: A three-dimensional circuit board is formed by comprising a board, a first wiring-electrode group provided on a plurality of steps above the board, and a second wiring-electrode connected to the first wiring-electrode group at least in an altitude direction, in which at least a connecting portion between the first wiring-electrode group and the second wiring-electrode is integrated in a continuously identical shape.

Abstract: An electronic component mounting structure includes an electronic component provided with a plurality of electrode terminals, and a mounting substrate provided with connector terminals in positions corresponding to the electrode terminals. An electrode terminal is connected to a connector terminal via a protrusion electrode disposed on the electrode terminal or the connector terminal, and the protrusion electrode includes a conductive filler and a photosensitive resin. The photosensitive resin varies in resin component crosslink density in the height direction of the protrusion electrode.

Abstract: An electronic part mounting structure includes electronic part having a plurality of electrode terminals, a substrate provided with connection terminals in locations corresponding to these electrode terminals, and protruding electrode for connecting one of electrode terminals and one of connection terminals, where electrode terminal of electronic part and connection terminal of substrate are connected through protruding electrode and protruding electrode is formed of a conductive resin including a photosensitive resin and a conductive filler.

Abstract: A protruding electrodes is formed on a lead electrode of an electronic component, and the protruding electrodes comprises a first conductor formed on the lead electrode of the electronic component, and a second conductor overlaid on the first conductor by using a transfer mold having a concavity. By virtue of this structure, protruding electrodes of any configuration can be formed in fine pitches.

Abstract: Interconnect substrate (1) that connects at least the first circuit board and the second circuit board. Interconnect substrate (1) includes housing (1) and connecting terminal electrodes for connecting the top and bottom faces of housing (10). Housing (10) has protrusion (11) on its outer periphery and opening (13) in its inner periphery.

Abstract: Conductive bump (17) formed on a surface of electrode terminal (11) of an electronic component. Conductive bump (17) is composed of at least a plurality of cured resin materials having different conductive filler densities. Thus, a short circuit and a connection failure due to crush of conductive bump (17) at the time of mounting can be prevented.

Abstract: A first circuit board (1) mounted with an electronic component (16) and a second circuit board (2) are vertically connected three-dimensionally through an interconnecting board (3) wherein the terminal portion (6) of the land electrode (5) on the interconnecting board (3) is buried in the termination material (9) of the interconnecting board (3). Consequently, the chance of peeling or cracking due to peeling stress or shearing stress acting between the upper/lower circuit boards and the land electrode by high density mounting, thermal shock or falling impact can be suppressed or buffered resulting in high reliability.

Abstract: A substrate connecting member connects two circuit boards connected together while maintaining high reliability of the junctions between itself and the circuit boards even if the circuit boards are warped by temperature change of an impact load. The substrate connecting member includes a frame member made of an insulating resin; slit grooves formed in at least one of the inner and outer surfaces of frame side portions composing the frame member, the slit grooves being formed throughout the entire length of the frame side portions in the direction perpendicular to the thickness direction of the frame side portions; and connection conductor portions having connection terminals provided on the top and bottom surfaces, respectively, of the frame side portions in the thickness direction and connecting conductors each connecting connection terminals.

Abstract: Electronic component mounting structure (1) comprising electronic component (10) provided with a plurality of electrode terminals (10a), mounting substrate (12) provided with connector terminals (12a) in positions corresponding to electrode terminals (10a), wherein electrode terminal (10a) is connected to connector terminal (12a) via protrusion electrode (13) disposed on electrode terminal (10a) or connector terminal (12a), and protrusion electrode (13) includes at least conductive filler (13a) and photosensitive resin (13b), and varies in resin component crosslink density of photosensitive resin (13b) in the height direction of protrusion electrode (13).