Abstract: A semiconductor integrated circuit device having a control signal system for avoiding failure to check an indefinite signal propagation prevention circuit, for facilitating a check included in an automated tool, and for facilitating a power shutdown control inside a chip. In the semiconductor integrated circuit device, power shutdown priorities are provided by independent power domains (Area A to Area I). A method for preventing a power domain having a lower priority from being turned OFF when a circuit having a high priority is turned ON is also provided.

Abstract: A method for making an activatable material having a handling film layer thereon, comprising the steps of providing a continuous mass of a polymeric material having a longitudinal axis and being capable of adhering to a metal surface; applying a handling layer (e.g., film) over at least one side of the mass; forming stress relief indentations in the mass, with the handling layer at least partially extending into the indentations, wherein the stress relief indentations allow a resulting part to be applied in conforming geometry with a surface to which it is applied. The teachings also contemplate parts made by the above method and use thereof to bond to surfaces having a non-planar portion.

Abstract: A semiconductor integrated circuit device having a control signal system for avoiding failure to check an indefinite signal propagation prevention circuit, for facilitating a check included in an automated tool, and for facilitating a power shutdown control inside a chip. In the semiconductor integrated circuit device, power shutdown priorities are provided by independent power domains (Area A to Area I). A method for preventing a power domain having a lower priority from being turned OFF when a circuit having a high priority is turned ON is also provided.

Abstract: A semiconductor integrated circuit device having a control signal system for avoiding failure to check an indefinite signal propagation prevention circuit, for facilitating a check included in an automated tool, and for facilitating a power shutdown control inside a chip. In the semiconductor integrated circuit device, power shutdown priorities are provided by independent power domains (Area A to Area I). A method for preventing a power domain having a lower priority from being turned OFF when a circuit having a high priority is turned ON is also provided.

Abstract: A data processing device includes a load circuit including a central processing unit and operated by supplied electric power, a step-down power supply circuit stepping down an external power supply voltage and including an output node coupled to the load circuit, the step-down power supply circuit including a first step-down unit stepping down the external power supply voltage, and a bias current control circuit controlling a magnitude of bias current flowing through an auxiliary path from the output node to a ground, the auxiliary path is separate from a path to the load circuit, and a control circuit increasing the magnitude of the bias current, prior to a change of an operation state of the load circuit by which a relatively large change occurs to an amount of current consumed by the load circuit.

Abstract: A semiconductor integrated circuit device having a control signal system for avoiding failure to check an indefinite signal propagation prevention circuit, for facilitating a check included in an automated tool, and for facilitating a power shutdown control inside a chip. In the semiconductor integrated circuit device, power shutdown priorities are provided by independent power domains (Area A to Area I). A method for preventing a power domain having a lower priority from being turned OFF when a circuit having a high priority is turned ON is also provided.

Abstract: A semiconductor integrated circuit device having a control signal system for avoiding failure to check an indefinite signal propagation prevention circuit, for facilitating a check included in an automated tool, and for facilitating a power shutdown control inside a chip. In the semiconductor integrated circuit device, power shutdown priorities are provided by independent power domains (Area A to Area I). A method for preventing a power domain having a lower priority from being turned OFF when a circuit having a high priority is turned ON is also provided.

Abstract: A method for making an activatable material having a handling film layer thereon, comprising the steps of providing a continuous mass of a polymeric material having a longitudinal axis and being capable of adhering to a metal surface; applying a handling layer (e.g., film) over at least one side of the mass; forming stress relief indentations in the mass, with the handling layer at least partially extending into the indentations, wherein the stress relief indentations allow a resulting part to be applied in conforming geometry with a surface to which it is applied. The teachings also contemplate parts made by the above method and use thereof to bond to surfaces having a non-planar portion.

Abstract: A method for making an activatable material having a handling film layer thereon, comprising the steps of providing a continuous mass of a polymeric material having a longitudinal axis and being capable of adhering to a metal surface; applying a handling layer (e.g., film) over at least one side of the mass; forming stress relief indentations in the mass, with the handling layer at least partially extending into the indentations, wherein the stress relief indentations allow a resulting part to be applied in conforming geometry with a surface to which it is applied. The teachings also contemplate parts made by the above method and use thereof to bond to surfaces having a non-planar portion.

Abstract: A data processing device includes a load circuit including a central processing unit and operated by supplied electric power, a step-down power supply circuit stepping down an external power supply voltage and including an output node coupled to the load circuit, the step-down power supply circuit including a first step-down unit stepping down the external power supply voltage, and a bias current control circuit controlling a magnitude of bias current flowing through an auxiliary path from the output node to a ground, the auxiliary path is separate from a path to the load circuit, and a control circuit increasing the magnitude of the bias current, prior to a change of an operation state of the load circuit by which a relatively large change occurs to an amount of current consumed by the load circuit.

Abstract: A step down unit steps down an external power supply voltage Vcc. A bias current control circuit controls the magnitude of bias current flowing through an auxiliary path connecting an output node and the ground. A system controller increases the magnitude of the bias current, prior to a change of the operation state of a load circuit by which a relatively large change occurs to the amount of current consumed by the load circuit including a central processing unit.

Abstract: A semiconductor integrated circuit device having a control signal system for avoiding failure to check an indefinite signal propagation prevention circuit, for facilitating a check included in an automated tool, and for facilitating a power shutdown control inside a chip. In the semiconductor integrated circuit device, power shutdown priorities are provided by independent power domains (Area A to Area I). A method for preventing a power domain having a lower priority from being turned OFF when a circuit having a high priority is turned ON is also provided.

Abstract: A semiconductor integrated circuit device having a control signal system for avoiding failure to check an indefinite signal propagation prevention circuit, for facilitating a check included in an automated tool, and for facilitating a power shutdown control inside a chip. In the semiconductor integrated circuit device, power shutdown priorities are provided by independent power domains (Area A to Area I). A method for preventing a power domain having a lower priority from being turned OFF when a circuit having a high priority is turned ON is also provided.

Abstract: A semiconductor integrated circuit device having a control signal system for avoiding failure to check an indefinite signal propagation prevention circuit, for facilitating a check included in an automated tool, and for facilitating a power shutdown control inside a chip. In the semiconductor integrated circuit device, power shutdown priorities are provided by independent power domains (Area A to Area I). A method for preventing a power domain having a lower priority from being turned OFF when a circuit having a high priority is turned ON is also provided.

Abstract: A semiconductor integrated circuit device having a control signal system for avoiding failure to check an indefinite signal propagation prevention circuit, for facilitating a check included in an automated tool, and for facilitating a power shutdown control inside a chip. In the semiconductor integrated circuit device, power shutdown priorities are provided by independent power domains (Area A to Area I). A method for preventing a power domain having a lower priority from being turned OFF when a circuit having a high priority is turned ON is also provided.

Abstract: A method for making an activatable material having a handling film layer thereon, comprising the steps of providing a continuous mass of a polymeric material having a longitudinal axis and being capable of adhering to a metal surface; applying a handling layer (e.g., film) over at least one side of the mass; forming stress relief indentations in the mass, with the handling layer at least partially extending into the indentations, wherein the stress relief indentations allow a resulting part to be applied in conforming geometry with a surface to which it is applied. The teachings also contemplate parts made by the above method and use thereof to bond to surfaces having a non-planar portion.

Abstract: A semiconductor integrated circuit device provided with a first circuit block BLK1, a second circuit block DRV1 and a conversion circuit MIO1 for connecting the first circuit block to the second circuit block. The first circuit block includes a first mode for applying a supply voltage and a second mode for shutting off the supply voltage. The conversion circuit is provided with a function for maintaining the potential of an input node of the second circuit block at an operation potential, thereby suppressing a penetrating current flow when the first circuit block is in the second mode. The conversion circuit (MIO1 to MIO4) are commonly used for connecting circuit blocks.

Abstract: A semiconductor integrated circuit device having a control signal system for avoiding failure to check an indefinite signal propagation prevention circuit, for facilitating a check included in an automated tool, and for facilitating a power shutdown control inside a chip. In the semiconductor integrated circuit device, power shutdown priorities are provided by independent power domains (Area A to Area I). A method for preventing a power domain having a lower priority from being turned OFF when a circuit having a high priority is turned ON is also provided.

Abstract: Efficient reduction in power consumption is achieved by combinational implementation of a power cutoff circuit technique using power supply switch control and a DVFS technique for low power consumption. A power supply switch section fed with power supply voltage, a circuit block in which a power cutoff is performed by the power supply switch section, and a level shifter are formed in a DEEP-NWELL region formed over a semiconductor substrate. Another power supply switch section fed with another power supply voltage, a circuit block in which a power cutoff is performed by the power supply switch section, and a level shifter are formed in another DEEP-NWELL region formed over the semiconductor substrate. In this arrangement, there arises no possibility of short-circuiting between different power supplies via each DEEP-NWELL region formed over the semiconductor substrate.

Abstract: A semiconductor integrated circuit device having a control signal system for avoiding failure to check an indefinite signal propagation prevention circuit, for facilitating a check included in an automated tool, and for facilitating a power shutdown control inside a chip. In the semiconductor integrated circuit device, power shutdown priorities are provided by independent power domains (Area A to Area I). A method for preventing a power domain having a lower priority from being turned OFF when a circuit having a high priority is turned ON is also provided.