Abstract: A method of heating for hot stamping is configured to heat a plated metallic material while conveying the plated metallic material. A heating device for hot stamping comprises: a first heating tank provided in a conveyance path for the plated metallic material; and a second heating tank provided downstream of the first heating tank in the conveyance path. A heating amount provided by the second heating tank is configured such that a temperature of the plated metallic material becomes equal to or higher than Ac3 point and less than a boiling point of a plating of the plated metallic material, and a heating amount provided by the first heating tank is configured to be larger than the heating amount provided by the second heating tank.

Abstract: A heating device for hot stamping is configured to heat a plated metallic material while conveying the plated metallic material. The heating device for hot stamping comprises: a first heating tank provided in a conveyance path for the plated metallic material; and a second heating tank provided downstream of the first heating tank in the conveyance path. A heating amount provided by the second heating tank is configured such that a temperature of the plated metallic material becomes equal to or higher than Ac3 point and less than a boiling point of a plating of the plated metallic material, and a heating amount provided by the first heating tank is configured to be larger than the heating amount provided by the second heating tank.

Abstract: A heating device for hot stamping is configured to heat a plated metallic material while conveying the plated metallic material. The heating device for hot stamping comprises: a first heating tank provided in a conveyance path for the plated metallic material; and a second heating tank provided downstream of the first heating tank in the conveyance path. A heating amount provided by the second heating tank is configured such that a temperature of the plated metallic material becomes equal to or higher than Ac3 point and less than a boiling point of a plating of the plated metallic material, and a heating amount provided by the first heating tank is configured to be larger than the heating amount provide by the second heating tank.

Abstract: An exhaust heat recovery apparatus (3) is installed below a floor supported by both side members (11, 12) of a vehicle to recover heat from exhaust gas passing through an exhaust pipe (1) of an internal combustion engine. Assistance members (15, 16), which extend in the fore-and-aft direction of the vehicle, are provided between the both side members (11, 12) of the vehicle. The exhaust heat recovery apparatus (3) is installed close to one of the assistance members (15, 16).

Abstract: An exhaust heat recovery apparatus is installed below a floor supported by both side members of a vehicle to recover heat from exhaust gas passing through an exhaust pipe of an internal combustion engine. Assistance members, which extend in the fore-and-aft direction of the vehicle, are provided between the both side members of the vehicle. The exhaust heat recovery apparatus is installed close to one of the assistance members.

Abstract: An exhaust heat recovery apparatus (3) is installed below a floor supported by both side members (11, 12) of a vehicle to recover heat from exhaust gas passing through an exhaust pipe (1) of an internal combustion engine. Assistance members (15, 16), which extend in the fore-and-aft direction of the vehicle, are provided between the both side members (11, 12) of the vehicle. The exhaust heat recovery apparatus (3) is installed close to one of the assistance members (15, 16).

Abstract: An exhaust heat recovery apparatus is installed below a floor supported by both side members of a vehicle to recover heat from exhaust gas passing through an exhaust pipe of an internal combustion engine. Assistance members, which extend in the fore-and-aft direction of the vehicle, are provided between the both side members of the vehicle. The exhaust heat recovery apparatus is installed close to one of the assistance members.

Abstract: According to the present invention, using a computer aided design system for designing semiconductor integrated circuits wherein a plurality of logic cells forming a circuit net are disposed on a semiconductor chip according to a net list specifying a connection pattern assigned among input and output terminals of a plurality of logic cells and a wiring length connecting the terminals.

Abstract: According to the present invention, using a computer aided design system for designing semiconductor integrated circuits wherein a plurality of logic cells forming a circuit net are disposed on a semiconductor chip according to a net list specifying a connection pattern assigned among input and output terminals of a plurality of logic cells and a wiring length connecting the terminals.