Abstract: A method of processing a substrate, includes emitting light including vacuum ultraviolet light to a front surface of the substrate, which has a resist film formed thereon from a resist material for EUV lithography, before an exposure process in an interior of a processing container.

Abstract: A boost converter control method in one aspect of the present invention is the control method of the boost converter that boosts a voltage input from a power supply and supplies a boosted voltage to a load-side. The control method of the boost converter is securing an output electric power required according to an operation point of a motor connected to the load-side, calculating a lower limit voltage value at which the output voltage of the boost converter does not oscillate, setting a target output voltage of the boost converter to a value equal to or higher than the lower limit voltage, and controlling the boost converter so as to output a voltage according to the target output voltage.

Abstract: A control method for a motor system, the motor system having a battery; a boost converter configured to increase DC voltage supplied by the battery; an inverter connected to the boost converter and configured to execute a conversion between DC power and AC power; and a motor generator connected to the inverter. The control method comprising: a limiting power determination step of determining a limiting power in response to an operating point of the motor generator such that an oscillation of a terminal voltage of the boost converter at a side of the inverter is suppressed; and a controlling step of controlling the operating point of the motor generator such that a passing power of the boost converter does not exceed the limiting power.

Abstract: A method of processing a substrate, includes emitting light including vacuum ultraviolet light to a front surface of the substrate, which has a resist film formed thereon from a resist material for EUV lithography, before an exposure process in an interior of a processing container.

Abstract: A control method for a motor system, the motor system having a battery; a boost converter configured to increase DC voltage supplied by the battery; an inverter connected to the boost converter and configured to execute a conversion between DC power and AC power; and a motor generator connected to the inverter. The control method comprising: a limiting power determination step of determining a limiting power in response to an operating point of the motor generator such that an oscillation of a terminal voltage of the boost converter at a side of the inverter is suppressed; and a controlling step of controlling the operating point of the motor generator such that a passing power of the boost converter does not exceed the limiting power.

Abstract: A boost converter control method in one aspect of the present invention is the control method of the boost converter that boosts a voltage input from a power supply and supplies a boosted voltage to a load-side. The control method of the boost converter is securing an output electric power required according to an operation point of a motor connected to the load-side, calculating a lower limit voltage value at which the output voltage of the boost converter does not oscillate, setting a target output voltage of the boost converter to a value equal to or higher than the lower limit voltage, and controlling the boost converter so as to output a voltage according to the target output voltage.

Abstract: A technique enabling a stable resist pattern forming process, when substrate processing apparatuses that perform a resist coating process separately from a developing process. A wafer having been heated after a resist coating process in a first substrate processing apparatus is also heated before an exposure process in a second substrate processing apparatus. Thus, even when amine in an atmosphere adheres to the wafer while it is being transported from the first substrate processing apparatus to the second substrate processing apparatus, the amine scatters by the heating process. At least one of a heating time and a heating temperature is adjusted based on a substrate rest time which includes a period of time between a time point at which a FOUP 10 is unloaded from the first substrate processing apparatus and a time point at which the FOUP 10 is loaded into the second substrate processing apparatus.

Abstract: A technique enabling a stable resist pattern forming process, when substrate processing apparatuses that perform a resist coating process separately from a developing process. A wafer having been heated after a resist coating process in a first substrate processing apparatus is also heated before an exposure process in a second substrate processing apparatus. Thus, even when amine in an atmosphere adheres to the wafer while it is being transported from the first substrate processing apparatus to the second substrate processing apparatus, the amine scatters by the heating process. At least one of a heating time and a heating temperature is adjusted based on a substrate rest time which includes a period of time between a time point at which a FOUP 10 is unloaded from the first substrate processing apparatus and a time point at which the FOUP 10 is loaded into the second substrate processing apparatus.

Abstract: A memory module having different types of memory mounted together on a double-sided substrate has a first edge and opposite second edge and includes a plurality of memory controllers, a plurality of flash memories, and a plurality of second memories having a higher signal transmission rate than the flash memories. A socket terminal for connecting the double-sided substrate to a motherboard is formed on the front surface and the back surface of the double-sided substrate on the first edge side; the memory controllers are disposed on the second edge side; the second memories are disposed on the second edge side at positions opposite the positions at which the memory controllers are disposed; and the flash memories are disposed on at least the back surface thereof at positions that are closer to the first edge than are the positions at which the memory controllers and the second memories are disposed.

Abstract: A delivery reel for an elongated sheet, having a disk-shaped flange member on which a sheet roll is positioned; an auxiliary core member of generally cylindrical shape split in the circumferential direction to enable expansion in diameter, and inserted into the inside diameter part of the sheet roll; a main core member fitted into the auxiliary core member which has been inserted into the sheet roll; and a stopper member attached to the circumferential edge of the flange member, and jutting toward the outside in the radial direction. The main core member has a plate spring. In a state in which the auxiliary core member has been inserted into the inside diameter part of the sheet roll, and the main core member has been fitted into the auxiliary core member, the plate spring presses the inside peripheral surface of the auxiliary core member toward the outside in the radial direction.

Abstract: The computer having a module board with semiconductor elements mounted on both sides thereof, a motherboard on which a plurality of units of the module board are mounted, and a rack cabinet on which a plurality of units of the motherboard are mounted includes a thermo-siphon that is thermally connected to the semiconductor elements mounted on one side of the module board, a metal plate that is thermally connected to the semiconductor elements mounted on one side of the module board, a thermally-conductive member that transfers the heat of the metal plate to the thermo-siphon in a situation where the heat of the semiconductor elements mounted on one side of the module board is transferred to the metal plate, and a pressing member that presses the thermo-siphon and the metal plate against the semiconductor elements mounted on the module board.

Abstract: A memory module having different types of memory mounted together on a double-sided substrate has a first edge and opposite second edge and includes a plurality of memory controllers, a plurality of flash memories, and a plurality of second memories having a higher signal transmission rate than the flash memories. A socket terminal for connecting the double-sided substrate to a motherboard is formed on the front surface and the back surface of the double-sided substrate on the first edge side; the memory controllers are disposed on the second edge side; the second memories are disposed on the second edge side at positions opposite the positions at which the memory controllers are disposed; and the flash memories are disposed on at least the back surface thereof at positions that are closer to the first edge than are the positions at which the memory controllers and the second memories are disposed.

Abstract: The computer having a module board with semiconductor elements mounted on both sides thereof, a motherboard on which a plurality of units of the module board are mounted, and a rack cabinet on which a plurality of units of the motherboard are mounted includes a thermo-siphon that is thermally connected to the semiconductor elements mounted on one side of the module board, a metal plate that is thermally connected to the semiconductor elements mounted on one side of the module board, a thermally-conductive member that transfers the heat of the metal plate to the thermo-siphon in a situation where the heat of the semiconductor elements mounted on one side of the module board is transferred to the metal plate, and a pressing member that presses the thermo-siphon and the metal plate against the semiconductor elements mounted on the module board.

Abstract: The disclosed heating device is to perform a heating process on an exposed substrate formed with a resist film before a developing process, the device including a heating part to perform a heating process on the exposed substrate, the heating part including a plurality of two-dimensionally arranged heating elements; a seating part provided at an upper side of the heating part, on which the substrate is disposed; and a control part to correct a setting temperature of the heating part based on temperature correction values, and to control the heating part based on the corrected setting temperature, during the heating process on one substrate by the heating part, wherein the temperature correction values being previously obtained from measured critical dimensions of the resist pattern in another substrate formed with the resist pattern through the heating process by the heating part and then the developing process.

Abstract: In an information processing system comprising an information processing equipment group and a facility equipment group, both an increase in performance and a reduction in power consumption are obtained, thereby achieving an efficient and flexible operational management. The plurality of information processing equipments are divided into a plurality of groups, each of which includes power feed equipments and cooling equipments.

Abstract: A delivery reel for an elongated sheet, having a disk-shaped flange member on which a sheet roll is positioned; an auxiliary core member of generally cylindrical shape split in the circumferential direction to enable expansion in diameter, and inserted into the inside diameter part of the sheet roll; a main core member fitted into the auxiliary core member which has been inserted into the sheet roll; and a stopper member attached to the circumferential edge of the flange member, and jutting toward the outside in the radial direction. The main core member has a plate spring. In a state in which the auxiliary core member has been inserted into the inside diameter part of the sheet roll, and the main core member has been fitted into the auxiliary core member, the plate spring presses the inside peripheral surface of the auxiliary core member toward the outside in the radial direction.

Abstract: A resist pattern slimming treatment method includes: a slimming treatment step of performing a slimming treatment on a resist pattern by applying a solution containing an acid onto a substrate having the resist pattern formed thereon, then performing a heat treatment, and then performing a developing treatment. A database storing kinds of resist material for the resist pattern, concentrations of acid contained in a solution to be applied onto the substrate having the resist pattern formed thereon, and line widths of the resist pattern corresponding to the kinds of resist material and the concentrations of acid is prepared in advance. The concentration of the acid contained in the solution used in the slimming treatment step is based on a concentration of the acid obtained from the database, using, as search keys, the kind of resist material and a target value of the line width of the resist pattern.

Abstract: From a plurality of preset operation modes, an optimal mode is selected to let the supply air 206 attain a predetermined temperature and humidity. Upon adjusting the opening degrees of dampers 116-119, a cold water valve 156 and a humidifying water valve 154, the system measures the outside air 201, supply air 206 and return air 207 for temperature and humidity to see if a mode boundary is exceeded. If the boundary is exceeded, an assessment time is set. The humidity of the supply air 206 in the mode in effect before the boundary is exceeded is further predicted so as to determine whether the predicted value exceeds the upper limit of a tolerable humidity range or drops below the lower limit thereof.

Abstract: A cooling system for cooling a CPU 200 mounted on a printed circuit board 100 within a housing thereof, has a heat-receiving jacket 310, being thermally connected with a surface of the CPU generating heat therein, and for evaporating liquid refrigerant stored in a pressure-reduced inner space with heat generation thereof. A condenser 320 receives refrigerant vapor from the heat-receiving jacket for condensing the refrigerant vapor into a liquid by transferring the heat into an outside of the apparatus. A thermo siphon is used for circulating the refrigerant due to phase change thereof, and the condenser has fine grooves on an inner wall surface thereof along a direction of flow of the refrigerant, and is also formed flat in a cross-section thereof, for cooling the refrigerant vapor from the heat-receiving jacket on the inner wall surface thereof, efficiently.

Abstract: In an information processing system comprising an information processing equipment group and a facility equipment group, both an increase in performance and a reduction in power consumption are obtained, thereby achieving an efficient and flexible operational management. The plurality of information processing equipments are divided into a plurality of groups, each of which includes power feed equipments and cooling equipments.