Abstract: A substrate processing apparatus includes a substrate cleaning device; a chip cleaning device; a chip bonding device; a transfer section; a first substrate transfer arm; and a first frame transfer arm. The substrate cleaning device is configured to clean a substrate. The chip cleaning device is configured to clean chips in a state where the chips are attached to a frame via a tape. The chip bonding device is configured to bond the chips to the substrate. The first substrate transfer arm is configured to hold and transfer the substrate. The first frame transfer arm is configured to hold and transfer the frame together with the chips. The first substrate transfer arm transfers the substrate from the substrate cleaning device to the chip bonding device, and the first frame transfer arm transfers the chips together with the frame from the chip cleaning device to the chip bonding device.

Abstract: A power generation system includes an internal combustion engine, an electrical generator, and a power transmission mechanism. A method for controlling the system includes executing rotation speed control of driving the electrical generator by using electric power supplied from a battery, and matching a rotation speed of the electrical generator with a target rotation speed at the time of starting the power generation system. Output possible electric power of the battery and rotation speed of the electrical generator are acquired. A filtering process of reducing a component of a resonance frequency band of a spring-mass system including the engine, generator, and power transmission mechanism is executed on the rotation speed of the electrical generator. An upper limit torque of the electrical generator is calculated based on the filtered rotation speed and the output possible electric power. The rotation speed control is executed under a limitation of the upper limit torque.

Abstract: A power generation system includes an internal combustion engine, an electrical generator, and a power transmission mechanism. A method for controlling the system includes executing rotation speed control of driving the electrical generator by using electric power supplied from a battery, and matching a rotation speed of the electrical generator with a target rotation speed at the time of starting the power generation system. Output possible electric power of the battery and rotation speed of the electrical generator are acquired. A filtering process of reducing a component of a resonance frequency band of a spring-mass system including the engine, generator, and power transmission mechanism is executed on the rotation speed of the electrical generator. An upper limit torque of the electrical generator is calculated based on the filtered rotation speed and the output possible electric power. The rotation speed control is executed under a limitation of the upper limit torque.

Abstract: Semiconductor devices and corresponding methods of manufacture are disclosed. The method includes forming a first device structure on a first substrate, a first laser liftoff layer on the first device structure, a protective layer on the first laser liftoff layer, and a second substrate on the protective layer. The method includes de-attaching, through applying radiation on the first laser liftoff layer, the protective layer from the first laser liftoff layer, with a first surface of the second substrate remaining in contact with a second surface of the protective layer. The protective layer is transparent to the radiation.

Abstract: A method of processing a substrate that includes: forming an infrared (IR) absorbing separation layer over a first substrate; forming one or more layers over the IR absorbing separation layer; bonding the first substrate and a second substrate at a bonding interface between the one or more layers and the second substrate using a direct bonding technique to form a wafer stack; exposing the wafer stack to an infrared (IR) light irradiation to separate the first substrate from the one or more layers.

Abstract: A first circuit outputs first information indicating presence/absence of a magnetic wall between two adjacent portions among portions of a magnetic body, and second information based on the combination of magnetization states of the two portions. A first storage circuit stores first bits corresponding to the portions. A most significant bit of the first bits has a value independent of a magnetization state of a corresponding one of the portions, and the first bits have a value based on the first information. A second storage circuit stores the second information. The second circuit causes the first storage circuit to output the first bits when a value of a least significant bit of the first bits matches a value of the second information, and otherwise third bits having inverse values of the first bits.

Abstract: A method of processing a substrate, includes emitting light including vacuum ultraviolet light to a front surface of the substrate, which has a resist film formed thereon from a resist material for EUV lithography, before an exposure process in an interior of a processing container.

Abstract: A boost converter control method in one aspect of the present invention is the control method of the boost converter that boosts a voltage input from a power supply and supplies a boosted voltage to a load-side. The control method of the boost converter is securing an output electric power required according to an operation point of a motor connected to the load-side, calculating a lower limit voltage value at which the output voltage of the boost converter does not oscillate, setting a target output voltage of the boost converter to a value equal to or higher than the lower limit voltage, and controlling the boost converter so as to output a voltage according to the target output voltage.

Abstract: A control method for a motor system, the motor system having a battery; a boost converter configured to increase DC voltage supplied by the battery; an inverter connected to the boost converter and configured to execute a conversion between DC power and AC power; and a motor generator connected to the inverter. The control method comprising: a limiting power determination step of determining a limiting power in response to an operating point of the motor generator such that an oscillation of a terminal voltage of the boost converter at a side of the inverter is suppressed; and a controlling step of controlling the operating point of the motor generator such that a passing power of the boost converter does not exceed the limiting power.

Abstract: A method of processing a substrate, includes emitting light including vacuum ultraviolet light to a front surface of the substrate, which has a resist film formed thereon from a resist material for EUV lithography, before an exposure process in an interior of a processing container.

Abstract: A control method for a motor system, the motor system having a battery; a boost converter configured to increase DC voltage supplied by the battery; an inverter connected to the boost converter and configured to execute a conversion between DC power and AC power; and a motor generator connected to the inverter. The control method comprising: a limiting power determination step of determining a limiting power in response to an operating point of the motor generator such that an oscillation of a terminal voltage of the boost converter at a side of the inverter is suppressed; and a controlling step of controlling the operating point of the motor generator such that a passing power of the boost converter does not exceed the limiting power.

Abstract: A boost converter control method in one aspect of the present invention is the control method of the boost converter that boosts a voltage input from a power supply and supplies a boosted voltage to a load-side. The control method of the boost converter is securing an output electric power required according to an operation point of a motor connected to the load-side, calculating a lower limit voltage value at which the output voltage of the boost converter does not oscillate, setting a target output voltage of the boost converter to a value equal to or higher than the lower limit voltage, and controlling the boost converter so as to output a voltage according to the target output voltage.

Abstract: A technique enabling a stable resist pattern forming process, when substrate processing apparatuses that perform a resist coating process separately from a developing process. A wafer having been heated after a resist coating process in a first substrate processing apparatus is also heated before an exposure process in a second substrate processing apparatus. Thus, even when amine in an atmosphere adheres to the wafer while it is being transported from the first substrate processing apparatus to the second substrate processing apparatus, the amine scatters by the heating process. At least one of a heating time and a heating temperature is adjusted based on a substrate rest time which includes a period of time between a time point at which a FOUP 10 is unloaded from the first substrate processing apparatus and a time point at which the FOUP 10 is loaded into the second substrate processing apparatus.

Abstract: A technique enabling a stable resist pattern forming process, when substrate processing apparatuses that perform a resist coating process separately from a developing process. A wafer having been heated after a resist coating process in a first substrate processing apparatus is also heated before an exposure process in a second substrate processing apparatus. Thus, even when amine in an atmosphere adheres to the wafer while it is being transported from the first substrate processing apparatus to the second substrate processing apparatus, the amine scatters by the heating process. At least one of a heating time and a heating temperature is adjusted based on a substrate rest time which includes a period of time between a time point at which a FOUP 10 is unloaded from the first substrate processing apparatus and a time point at which the FOUP 10 is loaded into the second substrate processing apparatus.

Abstract: A memory module having different types of memory mounted together on a double-sided substrate has a first edge and opposite second edge and includes a plurality of memory controllers, a plurality of flash memories, and a plurality of second memories having a higher signal transmission rate than the flash memories. A socket terminal for connecting the double-sided substrate to a motherboard is formed on the front surface and the back surface of the double-sided substrate on the first edge side; the memory controllers are disposed on the second edge side; the second memories are disposed on the second edge side at positions opposite the positions at which the memory controllers are disposed; and the flash memories are disposed on at least the back surface thereof at positions that are closer to the first edge than are the positions at which the memory controllers and the second memories are disposed.

Abstract: A delivery reel for an elongated sheet, having a disk-shaped flange member on which a sheet roll is positioned; an auxiliary core member of generally cylindrical shape split in the circumferential direction to enable expansion in diameter, and inserted into the inside diameter part of the sheet roll; a main core member fitted into the auxiliary core member which has been inserted into the sheet roll; and a stopper member attached to the circumferential edge of the flange member, and jutting toward the outside in the radial direction. The main core member has a plate spring. In a state in which the auxiliary core member has been inserted into the inside diameter part of the sheet roll, and the main core member has been fitted into the auxiliary core member, the plate spring presses the inside peripheral surface of the auxiliary core member toward the outside in the radial direction.

Abstract: The computer having a module board with semiconductor elements mounted on both sides thereof, a motherboard on which a plurality of units of the module board are mounted, and a rack cabinet on which a plurality of units of the motherboard are mounted includes a thermo-siphon that is thermally connected to the semiconductor elements mounted on one side of the module board, a metal plate that is thermally connected to the semiconductor elements mounted on one side of the module board, a thermally-conductive member that transfers the heat of the metal plate to the thermo-siphon in a situation where the heat of the semiconductor elements mounted on one side of the module board is transferred to the metal plate, and a pressing member that presses the thermo-siphon and the metal plate against the semiconductor elements mounted on the module board.

Abstract: A memory module having different types of memory mounted together on a double-sided substrate has a first edge and opposite second edge and includes a plurality of memory controllers, a plurality of flash memories, and a plurality of second memories having a higher signal transmission rate than the flash memories. A socket terminal for connecting the double-sided substrate to a motherboard is formed on the front surface and the back surface of the double-sided substrate on the first edge side; the memory controllers are disposed on the second edge side; the second memories are disposed on the second edge side at positions opposite the positions at which the memory controllers are disposed; and the flash memories are disposed on at least the back surface thereof at positions that are closer to the first edge than are the positions at which the memory controllers and the second memories are disposed.

Abstract: The computer having a module board with semiconductor elements mounted on both sides thereof, a motherboard on which a plurality of units of the module board are mounted, and a rack cabinet on which a plurality of units of the motherboard are mounted includes a thermo-siphon that is thermally connected to the semiconductor elements mounted on one side of the module board, a metal plate that is thermally connected to the semiconductor elements mounted on one side of the module board, a thermally-conductive member that transfers the heat of the metal plate to the thermo-siphon in a situation where the heat of the semiconductor elements mounted on one side of the module board is transferred to the metal plate, and a pressing member that presses the thermo-siphon and the metal plate against the semiconductor elements mounted on the module board.

Abstract: The disclosed heating device is to perform a heating process on an exposed substrate formed with a resist film before a developing process, the device including a heating part to perform a heating process on the exposed substrate, the heating part including a plurality of two-dimensionally arranged heating elements; a seating part provided at an upper side of the heating part, on which the substrate is disposed; and a control part to correct a setting temperature of the heating part based on temperature correction values, and to control the heating part based on the corrected setting temperature, during the heating process on one substrate by the heating part, wherein the temperature correction values being previously obtained from measured critical dimensions of the resist pattern in another substrate formed with the resist pattern through the heating process by the heating part and then the developing process.