Patents by Inventor Yoshihiro Sato

Yoshihiro Sato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10500638
    Abstract: One aspect of the present invention is a lubricant to be incorporated into a powder metallurgical mixed powder containing an iron-based powder. The lubricant includes a flaky organic material having an average particle diameter of from 0.1 ?m to less than 3 ?m. Another aspect of the present invention is a powder metallurgical mixed powder which contains an iron-based powder and the lubricant. Yet another aspect of the present invention is a method for producing a sintered compact. The method includes the step of mixing materials to give a powder metallurgical mixed powder containing an iron-based powder and the lubricant. The powder metallurgical mixed powder is compacted using a die to give a powder compact. The powder compact is sintered to give a sintered compact.
    Type: Grant
    Filed: December 1, 2015
    Date of Patent: December 10, 2019
    Assignee: Kobe Steel, Ltd.
    Inventors: Yoshihiro Ito, Eiichiro Yoshikawa, Nobuaki Akagi, Yuji Taniguchi, Mitsuhiro Sato
  • Publication number: 20190371839
    Abstract: An imaging device according to the present disclosure includes: a photoelectric converter generating signal charge; a semiconductor substrate including a first semiconductor layer on a surface; a charge accumulation region of a first conductivity type in the first semiconductor layer; a first transistor including, as a source or a drain, a first impurity region of the first conductivity type in the first semiconductor layer; and a blocking structure between the charge accumulation region and the first transistor. The blocking structure includes a second impurity region of a second conductivity type in the first semiconductor layer, between the charge accumulation region and the first impurity region, and a first electrode above the first semiconductor layer, overlapping at least part of the second impurity region in plan view, the first electrode being configured to be applied with a constant voltage in a period when the charge accumulation region accumulates the signal charge.
    Type: Application
    Filed: May 14, 2019
    Publication date: December 5, 2019
    Inventors: YOSHIHIRO SATO, JUNJI HIRASE
  • Publication number: 20190371840
    Abstract: An imaging device according to the present disclosure includes: a photoelectric converter that generates signal charge; a semiconductor substrate including a first semiconductor layer containing an impurity of a first conductivity type and an impurity of a second conductivity type; and a first transistor including a first impurity region of the second conductivity type in the first semiconductor layer. The first semiconductor layer includes: a charge accumulation region of the second conductivity type, for accumulating the signal charge; and a blocking structure between the charge accumulation region and the first transistor. The blocking structure includes a second impurity region of the first conductivity type, a third impurity region of the second conductivity type, and a fourth impurity region of the first conductivity type, which are arranged in that order in a direction from the first impurity region toward the charge accumulation region, at the surface of the first semiconductor layer.
    Type: Application
    Filed: May 20, 2019
    Publication date: December 5, 2019
    Inventors: JUNJI HIRASE, YOSHINORI TAKAMI, YOSHIHIRO SATO
  • Patent number: 10495042
    Abstract: Peripheral sections of two diaphragms are stacked on each other. The peripheral sections of the two diaphragms form an outer rim of a diaphragm damper. The outer rim is continuously sealed and joined by laser welding over the entire circumference of the outer rim. The thickness of the tip of the outer rim is set in correspondence with the spot diameter of a laser beam at the tip of the outer rim. A weld bead is formed by welding in the entire area of the tip of the outer rim.
    Type: Grant
    Filed: July 28, 2016
    Date of Patent: December 3, 2019
    Assignee: Eagle Industry Co., LTD.
    Inventors: Toshiaki Iwa, Yoshihiro Ogawa, Yasushi Fujiwara, Yusuke Sato
  • Patent number: 10497739
    Abstract: An image capture device includes pixels and a signal line that is arranged across two or more of the pixels. Each pixel includes: a semiconductor substrate, a photoelectric converter including a first electrode, a second electrode, and a photoelectric conversion layer; a first transistor including first and second impurity regions in the substrate; a wiring layer between the substrate and the second electrode; and a capacitor arranged between the wiring layer and the substrate in a normal direction of the substrate and including a third electrode, a fourth electrode between the third electrode and the substrate, and a dielectric layer. The first impurity region is electrically connected to the second electrode, the fourth electrode is electrically connected to one of the first and second impurity regions, and at least either the third or fourth electrodes covers the first impurity region when viewed along the normal direction.
    Type: Grant
    Filed: October 29, 2018
    Date of Patent: December 3, 2019
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Masayuki Takase, Yuuko Tomekawa, Yoshihiro Sato
  • Patent number: 10495041
    Abstract: A holding member for a diaphragm damper device including a plurality of diaphragm dampers is formed from an elastic member. The holding member includes a band that can be elastically tightened to circumferential walls of two adjacent ones of the diaphragm dampers and hooks arranged on two sides of the band. The hooks elastically hold each of the diaphragm dampers that are stacked.
    Type: Grant
    Filed: July 28, 2016
    Date of Patent: December 3, 2019
    Assignee: Eagle Industry Co., LTD.
    Inventors: Toshiaki Iwa, Yoshihiro Ogawa, Yasushi Fujiwara, Yusuke Sato
  • Publication number: 20190361419
    Abstract: The present invention is applied to a distributed control system in which a plurality of control devices (a central control device, an individual control device, and the like) are connected via a network. For example, the central control device executes a start-up deadline determination processing for setting a start-up deadline in consideration of the performance of a device to be controlled, and communication processing for transmitting a packet including identification information of a command and information of the start-up deadline to the individual control device. For example, when receiving the packet transmitted from the central control device, the individual control device controls execution of the command on the device to be controlled on the basis of the start-up deadline included in the packet.
    Type: Application
    Filed: September 22, 2017
    Publication date: November 28, 2019
    Inventors: Tatsuya MARUYAMA, Yasushi TOMITA, Yasuo SATO, Yoshihiro MIZUNO, Makoto AIKAWA
  • Publication number: 20190344473
    Abstract: A masking method for honeycomb formed body, including bonding a film on at least one bottom face of a honeycomb formed body in a quadrangular prism shape such that an adhesive surface is in contact with the bottom face. The step of bonding the film includes bonding of the film so as to have a bottom face covering portion that covers a whole surface of the bottom face and a pair of outer edge portions along one pair of opposite sides of a quadrangle defining an outer peripheral shape of the bottom face and a pair of protruding portions protruding from another pair of opposite sides of the quadrangle. At least a part of the adhesive surface of each of the pair of protruding portions is bonded so as to be in contact with a pair of opposing lateral faces of the honeycomb formed body.
    Type: Application
    Filed: March 19, 2019
    Publication date: November 14, 2019
    Applicant: NGK INSULATORS, LTD.
    Inventors: Nobuhiro FUJIE, Yuji WATANABE, Ken ITADU, Yoshihiro SATO
  • Patent number: 10468184
    Abstract: In a coil component 1 and a method for manufacturing the same, a winding part of a coil is grown by plating so as to extend between resin walls of a resin body provided before the coil is grown by plating. The resin wall is interposed between adjacent turns of the winding part of the coil during the plating growth, and therefore contact between adjacent turns of the winding part of the coil cannot occur.
    Type: Grant
    Filed: November 24, 2015
    Date of Patent: November 5, 2019
    Assignee: TDK CORPORATION
    Inventors: Hitoshi Ohkubo, Masazumi Arata, Manabu Ohta, Shou Kawadahara, Yoshihiro Maeda, Takahiro Kawahara, Hokuto Eda, Shigeki Sato
  • Publication number: 20190329219
    Abstract: The production method includes: a gel-crushing step of grinding a crosslinked hydrogel polymer to obtain a particulate crosslinked hydrogel polymer; a heating drying step of obtaining dried particles from the particulate crosslinked hydrogel polymer by using a continuous stirring drying machine; a post-crosslinking step of post-crosslinking the particulate crosslinked hydrogel polymer or the dried particles; and a sizing step of adjusting a particle size of the dried particles or the post-crosslinked dried particles to obtain water-absorbent resin powder. The particulate crosslinked hydrogel polymer contains a gel fluidizer. A gel temperature of the particulate crosslinked hydrogel polymer containing the gel fluidizer, the gel temperature being measured by a contact thermometer, is not lower than 50° C. In the production method, the dried particles or the post-crosslinked dried particles is forcedly cooled before the sizing step.
    Type: Application
    Filed: November 16, 2017
    Publication date: October 31, 2019
    Inventors: Hiroyasu WATABE, Mai SATO, Ryota WAKABAYASHI, Yoshihiro SHOBO, Shin-ya KATSUBE, Motohiro IMURA, Koji HONDA, Yoshifumi ADACHI, Tsuyoshi YORINO, Masafumi INOUE, Tomoyuki ARAKE, Hiroki HAYASHI, Naoki KATAKURA, Shin-ichi FUJINO, Kunihiko ISHIZAKI, Tokio SHUTO
  • Publication number: 20190329220
    Abstract: The production method includes a drying step of drying a particulate crosslinked hydrogel polymer obtained by polymerizing a monomer, which is a material of a water-absorbent resin, using a heating device to obtain dried particles. The heating device includes: a rotary container that contains the particulate crosslinked hydrogel polymer therein and rotates; and a plurality of heating tubes that are located within the rotary container, extend in an axial direction of the rotary container, and rotate together with the rotary container. A gel temperature of the particulate crosslinked hydrogel polymer to be subjected to the drying step, the gel temperature being measured by a contact thermometer, is not lower than 50° C.
    Type: Application
    Filed: November 16, 2017
    Publication date: October 31, 2019
    Inventors: Hiroyasu WATABE, Mai SATO, Ryota WAKABAYASHI, Yoshihiro SHOBO, Shin-ya KATSUBE, Motohiro IMURA, Koji HONDA, Shin-ichi FUJINO, Kunihiko ISHIZAKI, Tokio SHUTO
  • Patent number: 10446549
    Abstract: An imaging device includes: a semiconductor substrate including a first impurity region and a second impurity region; a first insulating layer on a portion of a surface of the semiconductor substrate; a second insulating layer on another portion of the surface of the semiconductor substrate, a thickness of the first insulating layer being greater than a thickness of the second insulating layer; a first transistor including: a first gate electrode facing the surface of the semiconductor substrate via the first insulating layer; the first impurity region as one of a source and a drain; and the second impurity region as the other of the source and the drain; and a photoelectric converter electrically connected to the first impurity region. The first insulating layer covers the first impurity region, and the second insulating layer covers the second impurity region.
    Type: Grant
    Filed: April 15, 2019
    Date of Patent: October 15, 2019
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Yoshihiro Sato, Ryota Sakaida, Satoshi Shibata, Taiji Noda
  • Publication number: 20190299487
    Abstract: A bottom face processing method of a pillar-shaped honeycomb structure including steps of: preparing a pillar-shaped honeycomb structure including a plurality of first cells which extend in parallel with each other from a first bottom face to a second bottom face, and each of which is opened in the first bottom face and has a protruding plugged portion in the second bottom face, and a plurality of second cells each of which is adjacent to at least one of the first cells with a partition wall interposed therebetween, which extend in parallel with each other from the first bottom face to the second bottom face, and each of which has a protruding plugged portion in the first bottom face, and is opened in the second bottom face; and removing the protruding portion from the plugged portion of each of the first cells and the second cells of the pillar-shaped honeycomb structure.
    Type: Application
    Filed: March 15, 2019
    Publication date: October 3, 2019
    Applicant: NGK INSULATORS, LTD.
    Inventors: Nobuhiro FUJIE, Yuji WATANABE, Ken ITADU, Yoshihiro SATO
  • Publication number: 20190273880
    Abstract: An imaging device includes a semiconductor layer including an impurity region of a first conductivity type, a photoelectric converter electrically connected to the impurity region, and a transistor having a gate of a second conductivity type different from the first conductivity type, a source and a drain, the transistor including the impurity region as one of the source and the drain, the gate being electrically connected to the impurity region.
    Type: Application
    Filed: May 13, 2019
    Publication date: September 5, 2019
    Inventors: Junji HIRASE, Yoshihiro SATO, Yoshinori TAKAMI, Masayuki TAKASE, Masashi MURAKAMI
  • Publication number: 20190264072
    Abstract: The invention provides a joining film having sufficient connection heat resistance and high reliability, for which a joining process of joining a semiconductor element and a substrate is simple and easy, a tape for wafer processing, a method for producing a joined body, and a joined body. Disclosed is a joining film 13 for joining a semiconductor element 2 and a substrate 40, the joining film having an electroconductive joining layer 13a formed by molding an electroconductive paste containing metal fine particles (P) into a film form; and a tack layer 13b having tackiness and being laminated with the electroconductive joining layer. The tack layer 13b is thermally decomposed by heating at the time of joining, the metal fine particles (P) of the electroconductive joining layer 13a are sintered, and thereby the semiconductor element 2 and the substrate 40 are joined.
    Type: Application
    Filed: May 15, 2019
    Publication date: August 29, 2019
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Norzafriza NITTA, Yoshihiro SATO, Hidemichi FUJIWARA
  • Publication number: 20190263625
    Abstract: A partially separated fiber bundle includes separation-processed sections, each divided into a plurality of bundles of at least three bundles, and not-separation-processed sections, that are alternately formed along the lengthwise direction of a fiber bundle that comprises a plurality of single fibers. The partially separated fiber bundle is characterized in that, at any width-direction cross-section taken along the lengthwise direction thereof, a rate of single fibers contained in a region at which adjacent divided fiber bundles are joined by a not-separation-processed part is 67% or less relative to the total single fibers in the width-direction cross-section.
    Type: Application
    Filed: June 1, 2017
    Publication date: August 29, 2019
    Inventors: Tetsuya Motohashi, Takafumi Hashimoto, Yasumoto Noguchi, Yoshihiro Kawahara, Tamotsu Suzuki, Chiasa Sato
  • Publication number: 20190259793
    Abstract: An imaging device includes a photoelectric converter that includes a first electrode, a second electrode, and a photoelectric conversion layer between the first electrode and the second electrode, a first transistor that has a gate connected to the first electrode, and a first capacitor and a switching element that are connected, in series, between the first electrode and either a voltage source or a ground.
    Type: Application
    Filed: May 2, 2019
    Publication date: August 22, 2019
    Inventors: Masashi MURAKAMI, Kazuko NISHIMURA, Yutaka ABE, Yoshiyuki MATSUNAGA, Yoshihiro SATO, Junji HIRASE
  • Publication number: 20190255475
    Abstract: A honeycomb segment joined body includes a plurality of honeycomb segments; and joining layers for bonding side surfaces of the plurality of honeycomb segments. Each of the joining layers is a cured product of a pasty joining material, and has a standard deviation of joined widths of 0.30 or less. The honeycomb segment joined body is produced by applying pressurization with vibration when joining side surfaces of a plurality of honeycomb segments using a pasty joining material.
    Type: Application
    Filed: February 4, 2019
    Publication date: August 22, 2019
    Applicant: NGK INSULATORS, LTD.
    Inventors: Yutaka ISHII, Yoshihiro SATO, Michio SUZUKI, Yasutaka WATANABE
  • Publication number: 20190244959
    Abstract: An imaging device includes: a semiconductor substrate including a first impurity region and a second impurity region; a first insulating layer on a portion of a surface of the semiconductor substrate; a second insulating layer on another portion of the surface of the semiconductor substrate, a thickness of the first insulating layer being greater than a thickness of the second insulating layer; a first transistor including: a first gate electrode facing the surface of the semiconductor substrate via the first insulating layer; the first impurity region as one of a source and a drain; and the second impurity region as the other of the source and the drain; and a photoelectric converter electrically connected to the first impurity region. The first insulating layer covers the first impurity region, and the second insulating layer covers the second impurity region.
    Type: Application
    Filed: April 15, 2019
    Publication date: August 8, 2019
    Inventors: Yoshihiro SATO, Ryota SAKAIDA, Satoshi SHIBATA, Taiji NODA
  • Patent number: 10367025
    Abstract: Each unit pixel includes a photoelectric converter, an n-type impurity region forming an accumulation diode together with the semiconductor region, the accumulation diode accumulating a signal charge generated by the photoelectric converter, an amplifier transistor including a gate electrode electrically connected to the impurity region, and an isolation region formed around the amplifier transistor and implanted with p-type impurities. The amplifier transistor includes an n-type source/drain region formed between the gate electrode and the isolation region, and a channel region formed under the gate electrode. A gap in the isolation region is, in a gate width direction, wider at a portion including the channel region than at a portion including the source/drain region.
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: July 30, 2019
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Yoshihiro Sato, Ryohei Miyagawa, Tokuhiko Tamaki, Junji Hirase, Yoshiyuki Ohmori, Yoshiyuki Matsunaga