Abstract: A lead frame for use in producing of a semiconductor integrated circuit comprises a lead frame member, a plurality of leads, a tie bar, a plurality of auxiliary leads, a support-stay portion and a connecting portion. A semiconductor element such as an IC chip is mounted on a semiconductor-element-mounting portion of the lead frame member, while the leads are arranged along and extending from a side portion of the lead frame member. The tie bar is connected among the leads and auxiliary leads at their tip-edge portions. Herein, the auxiliary leads are electrically unconnected from the semiconductor element. Further, the support-stay portion is provided at a corner portion of the lead frame member. The connecting portion is provided between a base-edge portion of the support-stay portion and a base portion of the auxiliary lead. A location of the connecting portion is selected in such a manner than the connecting portion will be unaffected by bending of the leads.

Abstract: An electroplating apparatus carries out an electroplating on a work by using an insoluble anode for keeping the electrolyte clean, and, thereafter, makes up ionized metal into the electrolyte by respectively connecting a soluble anode and the insoluble anode with a positive electrode and a negative electrode, thereby preventing an operator from the make-up work.

Abstract: An electroplating apparatus carries out an electroplating on a work by using an insoluble anode for keeping the electrolyte clean, and, thereafter, makes up ionized metal into the electrolyte by respectively connecting a soluble anode and the insoluble anode with a positive electrode and a negative electrode, thereby preventing an operator from the make-up work.

Abstract: A thermo-compression tool incorproated in an assembly/disassembly system melts solder films of conductive leads of an electric circuit componet for bonding the conductive leads to pads of a circuit board, and nozzles blow high-temperature nitrogen gas to the conductive leads during the bonding work for preventing the solder films from oxidization.

Abstract: An electroplating apparatus positively biases an anode with respect to a work dipped in an electrolyte in an electrolysis vessel for depositing metal on the work, and an inert ambience is created over the electrolyte so that the electrolyte is never oxidized.

Abstract: A lead frame at least provides a semiconductor-element-mounting portion, plural leads and plural auxiliary leads. The auxiliary leads are arranged to be associated with plural leads, while a tie bar is provided and connected among the leads. According to a method of making the lead frame, an IC-chip mounting process, a wire-bonding process, a sealing process, a resin-cutting process and a dambar-cutting process are sequentially effected on the lead frame. After effecting the dambar-cutting process, a thin-plating process is effected so as to form a thin-plated layer, approximately having a thickness of 5 .mu.m to 15 .mu.m, on the leads. Then, the leads are bent by a predetermined bending process. Thereafter, a thick-plating process is effected so as to form an uniform thick-plated layer, approximately having a thickness of 15 .mu.m to 100 .mu.m, on the leads. After effecting the thick-plating process, a trimming process is effected on the leads.