Patents by Inventor Yoshihisa Nakagawa
Yoshihisa Nakagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240134238Abstract: A display panel includes a display region and a peripheral region other than the display region. The display panel includes, in the peripheral region, a gate drive circuit and a first trunk line extending in a column direction. The first trunk line includes a first edge on a first side corresponding to the display region side in the row direction and a second edge on a second side corresponding to a side opposite to the display region in the row direction. The first trunk line includes a first portion and a second portion, each including the first edge and the second edge, and the first edge of the second portion is closer to the second side in the row direction than the first edge of the first portion. The first portion is not provided with an element, and the second portion includes a region provided with an element.Type: ApplicationFiled: September 26, 2023Publication date: April 25, 2024Inventors: Hidetoshi NAKAGAWA, Yoshihisa TAKAHASHI, Masahiro MATSUDA
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Publication number: 20240136369Abstract: A display panel includes a display region defined by a plurality of pixels P and a peripheral region other than the display region. The display panel includes a gate drive circuit and a dummy capacitance portion in the peripheral region. The gate drive circuit includes a shift register. The dummy capacitance portion includes a plurality of capacitance elements connected in parallel and connected to a dummy stage. Each of the plurality of capacitance elements includes a first capacitance electrode, a second capacitance electrode, and a dielectric layer positioned between the first capacitance electrode and the second capacitance electrode. The dummy capacitance portion further includes at least one first connection portion with two ends respectively connected to the first capacitance electrode of any one of the plurality of capacitance elements and to the first capacitance electrode of any other one of the plurality of capacitance elements.Type: ApplicationFiled: September 26, 2023Publication date: April 25, 2024Inventors: Hidetoshi NAKAGAWA, Yoshihisa TAKAHASHI, Masahiro MATSUDA
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Publication number: 20240066047Abstract: The present disclosure provides a compound having a STING agonistic activity, which may be expected to be useful as an agent for the prophylaxis or treatment of STING-related diseases. The present disclosure relates to a compound represented by the formula (I): wherein each symbol is as defined in the description, or a salt thereof.Type: ApplicationFiled: May 1, 2023Publication date: February 29, 2024Inventors: MASATO YOSHIKAWA, MORIHISA SAITOH, TAISUKE KATO, YAYOI NAKAYAMA, TOMOHIRO SEKI, YASUO NAKAGAWA, YUSUKE TOMINARI, MASAKI SETO, YUSUKE SASAKI, MASANORI OKANIWA, TSUNEO ODA, AKITO SHIBUYA, KOSUKE HIDAKA, ZENYU SHIOKAWA, SHUMPEI MURATA, ATSUTOSHI OKABE, YOSHIHISA NAKADA, MICHIYO MOCHIZUKI, BRIAN SCOTT FREEZE, TAISUKE TAWARAISHI, YASUFUMI WADA, PAUL D. GREENSPAN
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Publication number: 20200138802Abstract: Methods of further reducing cardiovascular risk in subjects with coronary artery disease on moderate intensity statins.Type: ApplicationFiled: November 3, 2019Publication date: May 7, 2020Inventors: Yasushi Saito, Ryozo Nagai, Masunori Matsuzaki, Takeshi Kimura, Hiroaki Shimokawa, Hiroyuki Daida, Satoshi Iimuro, Hiroshi Iwata, Yukio Ozaki, Ichiro Sakuma, Yoshihisa Nakagawa, Kiyoshi Hibi, Takafumi Hiro, Yoshihiro Fukumoto, Seiji Hokimoto, Katsumi Miyauchi, Yasuo Ohashi
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Patent number: 10029592Abstract: A cushion body includes a seat pad; and a seat cover covering a surface of the seat pad in a state in which a surface of the seat cover is bonded to the surface of the seat pad. The seat pad includes a drawing groove into which an intermediate part of the seat cover is drawn such that a surface of the intermediate part of the seat cover is bonded to the drawing groove; and a deformation promoting structure configured to promote bending of a vicinity portion in vicinity of the drawing groove so as to promote bending of one pad portion with respect to another pad portion in a direction in which a groove width of the drawing groove is increased, the one pad portion being separated from the other pad portion by the drawing groove.Type: GrantFiled: October 18, 2016Date of Patent: July 24, 2018Assignee: TOYOTA BOSHOKU KABUSHIKI KAISHAInventors: Mitsuyoshi Ochiai, Tetsuo Hayashida, Yoshiyuki Murata, Yoshihisa Nakagawa, Ami Inagaki
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Publication number: 20170113588Abstract: A cushion body includes a seat pad; and a seat cover covering a surface of the seat pad in a state in which a surface of the seat cover is bonded to the surface of the seat pad. The seat pad includes a drawing groove into which an intermediate part of the seat cover is drawn such that a surface of the intermediate part of the seat cover is bonded to the drawing groove; and a deformation promoting structure configured to promote bending of a vicinity portion in vicinity of the drawing groove so as to promote bending of one pad portion with respect to another pad portion in a direction in which a groove width of the drawing groove is increased, the one pad portion being separated from the other pad portion by the drawing groove.Type: ApplicationFiled: October 18, 2016Publication date: April 27, 2017Applicant: TOYOTA BOSHOKU KABUSHIKI KAISHAInventors: Mitsuyoshi OCHIAI, Tetsuo HAYASHIDA, Yoshiyuki MURATA, Yoshihisa NAKAGAWA, Ami INAGAKI
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Patent number: 9578782Abstract: A heat dissipation device includes: a first plate with a first surface on which a first heat dissipation fin is formed; a second plate with a first surface on which a second heat dissipation fin is formed, and a heat conduction unit that passes through a first through-hole of the first plate and a second through-hole of the second plate.Type: GrantFiled: March 26, 2015Date of Patent: February 21, 2017Assignee: FUJITSU LIMITEDInventors: Kenichi Uesugi, Yoshihisa Nakagawa, Atsushi Kaneko, Hiroshi Nakamura, Hideki Sonobe, Toshimitsu Kobayashi
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Publication number: 20160128234Abstract: A cooling device including: a heat receiver in which a working fluid is enclosed, a heat sink in which the working fluid is enclosed, an air tube made of metal so as to have flexibility, the air tube coupling the heat receiver and the heat sink, the air tube in which the working fluid of a gas phase flows through, and a liquid tube made of metal so as to have flexibility, the liquid tube coupling the heat receiver and the heat sink, the liquid tube in which the working fluid of a liquid phase flows through.Type: ApplicationFiled: October 27, 2015Publication date: May 5, 2016Inventors: Kenichi UESUGI, Yoshihisa NAKAGAWA, Hiromu SHOJI, Atsushi KANEKO, Toshimitsu KOBAYASHI, Hideki SONOBE, Hiroshi NAKAMURA
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Patent number: 9215822Abstract: A base station, includes: an electronic unit; a housing, including a resin, configured to accommodate the electronic unit; a valve, provided in the housing and including a communication channel communicating an inside of the housing with an outside, configured to open the communication channel if an internal pressure of the housing exceeds a value.Type: GrantFiled: March 28, 2013Date of Patent: December 15, 2015Assignee: FUJITSU LIMITEDInventors: Kenichi Uesugi, Yoshihisa Nakagawa, Hideki Sonobe, Toshimitsu Kobayashi, Atsushi Kaneko
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Publication number: 20150305200Abstract: A heat dissipation device includes: a first plate with a first surface on which a first heat dissipation fin is formed; a second plate with a first surface on which a second heat dissipation fin is formed, and a heat conduction unit that passes through a first through-hole of the first plate and a second through-hole of the second plate.Type: ApplicationFiled: March 26, 2015Publication date: October 22, 2015Inventors: Kenichi UESUGI, Yoshihisa NAKAGAWA, Atsushi KANEKO, Hiroshi NAKAMURA, Hideki SONOBE, Toshimitsu KOBAYASHI
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Publication number: 20130321989Abstract: A base station, includes: an electronic unit; a housing, including a resin, configured to accommodate the electronic unit; a valve, provided in the housing and including a communication channel communicating an inside of the housing with an outside, configured to open the communication channel if an internal pressure of the housing exceeds a value.Type: ApplicationFiled: March 28, 2013Publication date: December 5, 2013Applicant: FUJITSU LIMITEDInventors: Kenichi UESUGI, Yoshihisa Nakagawa, Hideki Sonobe, Toshimitsu Kobayashi, Atsuhi Kaneko
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Publication number: 20120080171Abstract: A heat relay mechanism includes a heat-dissipating member for dissipating heat, a buffer member contacted with the heat-dissipating member at a first surface, a thermally deformable member connected to a second surface of the buffer member and deforms at a high temperature, a heat pipe connected to the thermally deformable member at one end, and a device connected to another end of the heat pipe.Type: ApplicationFiled: September 6, 2011Publication date: April 5, 2012Applicant: FUJITSU LIMITEDInventors: Kenichi UESUGI, Yoshihisa Nakagawa, Toshimitsu Kobayashi, Hideki Sonobe, Atsushi Kaneko
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Patent number: 7448876Abstract: The card mounting configuration includes a card with a height that is approximately half that of conventional cards and integration of a front plate and a back plate of the card with a support to prevent circuit board distortion. A card ejector is attached on the front plate, and a plug-in connector is provided on the back plate. A housing with guides to receive the cards contains two levels, upper and lower, wherein six cards are mounted into each level. A plug-in connector on the card passes through a hole in a back board or supplemental backplane of the housing and is connected to a part of an external line connector that appears inside the housing.Type: GrantFiled: December 7, 2006Date of Patent: November 11, 2008Assignee: Fujitsu LimitedInventors: Kazuo Hirafuji, Yoshihisa Nakagawa, Hideki Sonobe
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Patent number: 7426111Abstract: A rack structure which is capable of improving heat-dissipating efficiency thereof within a limited space, and a communication apparatus which is capable of enhancing cooling efficiency by applying the rack structure thereto. In the rack structure of the communication apparatus, the air used for cooling printed circuit boards within a lower shelf and thereby increased in temperature is cooled by causing the same to flow through the heat-dissipating duct on a lateral side and is then used again for cooling printed circuit boards within an upper shelf. This makes it possible to increase the heat-dissipating efficiency of the communication apparatus to thereby improve the cooling performance thereof. As a consequence, the necessity of increasing the number of cooling fans or increasing the size of fans becomes small, and the cooling performance of the communication apparatus can be maintained within a limited installation space.Type: GrantFiled: May 11, 2007Date of Patent: September 16, 2008Assignee: Fujitsu LimitedInventors: Hideki Sonobe, Kazuo Hirafuji, Yoshihisa Nakagawa
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Publication number: 20080045068Abstract: The card mounting configuration includes a card with a height that is approximately half that of conventional cards and integration of a front plate and a back plate of the card with a support to prevent circuit board distortion. A card ejector is attached on the front plate, and a plug-in connector is provided on the back plate. A housing contains two levels, upper and lower, wherein six cards are mounted into each level. A plug-in connector passes through a hole in a back board of the housing and is connected to a part of an external line connector that is exposed on the inside of the housing.Type: ApplicationFiled: December 7, 2006Publication date: February 21, 2008Inventors: Kazuo Hirafuji, Yoshihisa Nakagawa, Hideki Sonobe
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Publication number: 20070258211Abstract: A rack structure which is capable of improving heat-dissipating efficiency thereof within a limited space, and a communication apparatus which is capable of enhancing cooling efficiency by applying the rack structure thereto. In the rack structure of the communication apparatus, the air used for cooling printed circuit boards within a lower shelf and thereby increased in temperature is cooled by causing the same to flow through the heat-dissipating duct on a lateral side and is then used again for cooling printed circuit boards within an upper shelf. This makes it possible to increase the heat-dissipating efficiency of the communication apparatus to thereby improve the cooling performance thereof. As a consequence, the necessity of increasing the number of cooling fans or increasing the size of fans becomes small, and the cooling performance of the communication apparatus can be maintained within a limited installation space.Type: ApplicationFiled: May 11, 2007Publication date: November 8, 2007Applicant: FUJITSU LIMITEDInventors: Hideki Sonobe, Kazuo Hirafuji, Yoshihisa Nakagawa
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Patent number: 7188735Abstract: A rack structure body for a machine includes a frame body provided at one of a front surface side and a back surface side of the rack structure body. The frame body includes a main frame part formed by bending and a sub frame part formed by bending. The sub frame part is installed inside of the main frame part. The frame body has a hollow structure.Type: GrantFiled: January 27, 2004Date of Patent: March 13, 2007Assignee: Fujitsu LimitedInventors: Yoshihisa Nakagawa, Hideki Sonobe
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Patent number: 7130193Abstract: The invention relates to a heat radiation member and a cabinet to be installed outdoors in a hermetic state, having a heat radiation function for heat radiation of devices contained therein. The object of the invention is to facilitate maintenance, downsize the cabinet, and prevent occurrence of noise. It includes: a cabinet body containing a heat source; a cover member attached to an aperture of the cabinet and having a guide portion guiding, to an exterior of the cabinet, a heat transfer member for transferring therethrough heat from the heat source by use of a hydraulic fluid; and a heat radiation part being a thermal conductor and in contact with the heat transfer member on a face and covering the heat transfer member from the exterior of the cabinet and having a heat radiation member on a face opposite to the face in contact with the heat transfer member.Type: GrantFiled: May 27, 2004Date of Patent: October 31, 2006Assignee: Fujitsu LimitedInventors: Kazuo Hirafuji, Hideki Sonobe, Yoshihisa Nakagawa
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Publication number: 20050168951Abstract: The invention relates to a heat radiation member and a cabinet to be installed outdoors in a hermetic state, having a heat radiation function for heat radiation of devices contained therein. The object of the invention is to facilitate maintenance, downsize the cabinet, and prevent occurrence of noise. It includes: a cabinet body containing a heat source; a cover member attached to an aperture of the cabinet and having a guide portion guiding, to an exterior of the cabinet, a heat transfer member for transferring therethrough heat from the heat source by use of a hydraulic fluid; and a heat radiation part being a thermal conductor and in contact with the heat transfer member on a face and covering the heat transfer member from the exterior of the cabinet and having a heat radiation member on a face opposite to the face in contact with the heat transfer member.Type: ApplicationFiled: May 27, 2004Publication date: August 4, 2005Inventors: Kazuo Hirafuji, Hideki Sonobe, Yoshihisa Nakagawa
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Publication number: 20040188363Abstract: A rack structure body for a machine includes a frame body provided at one of a front surface side and a back surface side of the rack structure body. The frame body includes a main frame part formed by bending and a sub frame part formed by bending. The sub frame part is installed inside of the main frame part. The frame body has a hollow structure.Type: ApplicationFiled: January 27, 2004Publication date: September 30, 2004Inventors: Yoshihisa Nakagawa, Hideki Sonobe