Patents by Inventor Yoshihisa Ogiwara

Yoshihisa Ogiwara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5122849
    Abstract: A silicon thin film transistor array includes a plurality of silicon thin film transistors in an array-like form, each silicon thin film transistor including an insulating substrate, a gate electrode formed on the insulating substrate, a gate insulating layer formed on the insulating substrate containing the gate electrode, a pair of first impurity contained silicon layers formed on the gate insulating layer in such a manner as to transversely cross a terminal part of the gate electrode, an intrinsic silicon layer formed on the pair of first impurity contained silicon layers and on the gate insulating layer between the pair of first impurity contained silicon layers in such a manner as to connect the pair of first impurity contained silicon layers, a protective insulation layer formed on the intrinsic silicon layer, and a source electrode and a drain electrode formed at contact parts of the pair of first impurity contained silicon layers; gate wiring for connecting the gate electrodes of the silicon thin film
    Type: Grant
    Filed: August 8, 1990
    Date of Patent: June 16, 1992
    Assignees: Seikosha Co., Ltd., Nippon Precision Circuits Ltd.
    Inventors: Sakae Tanaka, Yoshiaki Watanabe, Katsuo Shirai, Yoshihisa Ogiwara
  • Patent number: 5121177
    Abstract: A silicon thin film transistor array includes a plurality of silicon thin film transistors in an array-like form, each silicon thin film transistor including an insulating substrate, a gate electrode formed on the insulating substrate, a gate insulating layer formed on the insulating substrate containing the gate electrode, a pair of first impurity contained silicon layers formed on the gate insulating layer in such a manner as to transversely cross a terminal part of the gate electrode, an intrinsic silicon layer formed on the pair of first impurity contained silicon layers and on the gate insulating layer between the pair of first impurity contained silicon layers in such a manner as to connect the pair of first impurity contained silicon layers, a protective insulation layer formed on the intrinsic silicon layer, and a source electrode and a drain electrode formed at contact parts of the pair of first impurity contained silicon layers; gate wiring for connecting the gate electrodes of the silicon thin film
    Type: Grant
    Filed: August 8, 1990
    Date of Patent: June 9, 1992
    Assignees: Seikosha Co., Ltd., Nippon Precision Circuits Ltd.
    Inventors: Sakae Tanaka, Yoshiaki Watanabe, Katsuo Shirai, Yoshihisa Ogiwara
  • Patent number: 5121178
    Abstract: A silicon thin film transistor array includes a plurality of silicon thin film transistors in an array-like form, each silicon thin film transistor including an insulating substrate, a gate electrode formed on the insulating substrate, a gate insulating layer formed on the insulating substrate containing the gate electrode, a pair of first impurity contained silicon layers formed on the gate insulating layer in such a manner as to transversely cross a terminal part of the gate electrode, an intrinsic silicon layer formed on the pair of first impurity contained silicon layers and on the gate insulating layer between the pair of first impurity contained silicon layers in such a manner as to connect the pair of first impurity contained silicon layers, a protective insulating layer formed on the intrinsic silicon layer, and a source electrode and a drain electrode formed at contact parts of the pair of first impurity contained silicon layers; gate wiring for connecting the gate electrodes of the silicon thin film
    Type: Grant
    Filed: August 8, 1990
    Date of Patent: June 9, 1992
    Assignees: Seikosha Co., Ltd., Nippon Precision Circuits Ltd.
    Inventors: Sakae Tanaka, Yoshiaki Watanabe, Katsuo Shirai, Yoshihisa Ogiwara
  • Patent number: 5114869
    Abstract: A method for producing a reverse staggered type silicon thin film transistor includes the steps of forming a gate insulating layer on a substrate having a gate electrode, the gate insulating layer having a transistor-forming portion; forming an intrinsic silicon film on the transistor-forming portion of the gate insulating layer; forming an n-type silicon layer on the intrinsic silicon layer; forming a source electrode on the n-type silicon layer; forming a drain electrode on the n-type silicon layer; forming a resist layer on the source electrode and drain electrode and having the same shape thereof; subsequently removing a portion of the n-type silicon layer by using the resist layer as a mask, such that there remains a predetermined thickness of the n-type silicon layer; and doping the predetermined thickness of the n-type silicon layer with p-type impurities by using the resist layer as a mask.
    Type: Grant
    Filed: May 26, 1989
    Date of Patent: May 19, 1992
    Assignees: Seikosha Co., Ltd., Nippon Precision Circuits Ltd.
    Inventors: Sakae Tanaka, Yoshiaki Watanabe, Katsuo Shirai, Yoshihisa Ogiwara
  • Patent number: 5111261
    Abstract: A silicon thin film transistor array includes a plurality of silicon thin film transistors in an array-like form, each silicon thin film transistor including an insulating substrate, a gate electrode formed on the insulating substrate, a gate insulating layer formed on the insulating substrate containing the gate electrode, a pair of first impurity contained silicon layers formed on the gate insulating layer in such a manner as to transversely cross a terminal part of the gate electrode, an intrinsic silicon layer formed on the pair of first impurity contained silicon layers and on the gate insulating layer between the pair of first impurity contained silicon layers in such a manner as to connect the pair of first impurity contained silicon layers, a protective insulation layer formed on the intrinsic silicon layer, and a source electrode and a drain electrode formed at contact parts of the pair of first impurity contained silicon layers; gate wiring for connecting the gate electrodes of the silicon thin film
    Type: Grant
    Filed: August 8, 1990
    Date of Patent: May 5, 1992
    Assignees: Seikosha Co., Ltd., Nippon Precision Circuits, Ltd.
    Inventors: Sakae Tanaka, Yoshiaki Watanabe, Katsuo Shirai, Yoshihisa Ogiwara
  • Patent number: 5109260
    Abstract: A silicon thin film transistor array includes a plurality of silicon thin film transistors in an array-like form, each silicon thin film transistor including an insulating substrate, a gate electrode formed on the insulating substrate, a gate insulating layer formed on the insulating substrate containing the gate electrode, a pair of first impurity contained silicon layers formed on the gate insulating layer in such a manner as to transversely cross a terminal part of the gate electrode, an intrinsic silicon layer formed on the pair of first impurity contained silicon layers and on the gate insulating layer between the pair of first impurity contained silicon layers in such a manner as to connect the pair of first impurity contained silicon layers, a protective insulation layer formed on the intrinsic silicon layer, and a source electrode and a drain electrode formed at contact parts of the pair of first impurity contained silicon layers; gate wiring for connecting the gate electrodes of the silicon thin film
    Type: Grant
    Filed: August 8, 1990
    Date of Patent: April 28, 1992
    Assignees: Seikosha Co., Ltd., Nippon Precision Circuits Ltd.
    Inventors: Sakae Tanaka, Yoshiaki Watanabe, Katsuo Shirai, Yoshihisa Ogiwara
  • Patent number: 5071779
    Abstract: A silicon thin film transistor array includes a plurality of silicon thin film transistors in an array-like form, each silicon thin film transistor including an insulating substrate, a gate electrode formed on the insulating substrate, a gate insulating layer formed on the insulating substrate containing the gate electrode, a pair of first impurity contained silicon layers formed on the gate insulating layer in such a manner as to transversely cross a terminal part of the gate electrode, an intrinsic silicon layer formed on the pair of first impurity contained silicon layers and on the gate insulating layer between the pair of first impurity contained silicon layers in such a manner as to connect the pair of first impurity contained silicon layers, a protective insulation layer formed on the intrinsic silicon layer, and a source electrode and a drain electrode formed at contact parts of the pair of first impurity contained silicon layers; gate wiring for connecting the gate electrodes of the silicon thin film
    Type: Grant
    Filed: March 15, 1990
    Date of Patent: December 10, 1991
    Assignees: Seikosha Co., Ltd., Nippon Precision Circuits Ltd.
    Inventors: Sakae Tanaka, Yoshiaki Watanabe, Katsuo Shirai, Yoshihisa Ogiwara
  • Patent number: 5053354
    Abstract: A reverse staggered type silicon thin film transistor includes a substrate having a gate electrode; a gate insulating layer on the substrate and the gate electrode, the gate insulating layer having a transistor-forming portion; a lower layer silicon film on the transistor-forming portion of the gate insulating layer and in contact therewith, the lower layer silicon film being formed at a first temperature and with a first thickness; an upper layer silicon film formed on the transistor-forming portion of the gate insulating layer at a second temperature which is lower than the first temperature and with a second thickness greater than the first thickness; an n-type silicon layer on the upper layer silicon film and in contact therewith; a source electrode on the n-type silicon layer; and a drain electrode on the n-type silicon layer.
    Type: Grant
    Filed: June 8, 1990
    Date of Patent: October 1, 1991
    Assignees: Seikosha Co., Ltd., Nippon Precision Circuits Ltd.
    Inventors: Sakae Tanaka, Yoshiaki Watanabe, Katsuo Shirai, Yoshihisa Ogiwara
  • Patent number: 5045905
    Abstract: An amorphous silicon thin film transistor includes a gate electrode, an amorphous silicon layer on the gate insulating layer, a drain electrode and a source electrode on the amorphous silicon layer such that a portion of the side of the amorphous silicon layer which faces away from the gate electrode is exposed, and an impurity layer for reducing an off current of the transistor, the impurity layer including an impurity forming an acceptor and which is formed on the exposed portion of the amorphous silicon layer, the amorphous silicon layer being of a first conduction type and the acceptor being of a second different conduction type.
    Type: Grant
    Filed: December 12, 1990
    Date of Patent: September 3, 1991
    Assignees: Nippon Precision Circuits Ltd., Seikosha Co., Ltd.
    Inventors: Noboru Motai, Yoshihisa Ogiwara, Yasunari Kanda
  • Patent number: 5021850
    Abstract: A silicon thin film transistor array includes a plurality of silicon thin film transistors in an array-like form, each silicon thin film transistor including an insulating substrate, a gate electrode formed on the insulating substrate, a gate insulating layer formed on the insulating substrate containing the gate electrode, a pair of first impurity contained silicon layers formed on the gate insulating layer in such a manner as to transversely cross a terminal part of the gate electrode, an intrinsic silicon layer formed on the pair of first impurity contained silicon layers and on the gate insulating layer between the pair of first impurity contained silicon layers in such a manner as to connect the pair of first impurity contained silicon layers, a protective insulation layer formed on the intrinsic silicon layer, and a source electrode and a drain electrode formed at contact parts of the pair of first impurity contained silicon layers; gate wiring for connecting the gate electrodes of the silicon thin film
    Type: Grant
    Filed: July 10, 1989
    Date of Patent: June 4, 1991
    Assignees: Seikosha Co., Ltd., Nippon Precision Circuits Ltd.
    Inventors: Sakae Tanaka, Yoshiaki Watanabe, Katsuo Shirai, Yoshihisa Ogiwara
  • Patent number: 4979006
    Abstract: A reverse staggered type silicon thin film transistor includes a substrate having a gate electrode; a gate insulating layer on the substrate and the gate electrode, the gate insulating layer having a transistor-forming portion; a lower layer silicon film on the transistor-forming portion of the gate insulating layer and in contact therewith, the lower layer silicon film being formed at a first temperature and with a first thickness; an upper layer silicon film formed on the transistor-forming portion of the gate insulating layer at a second temperature which is lower than the first temperature and with a second thickness greater than the first thickness; and n-type silicon layer on the upper layer silicon film and in contact therewith; a source electrode on the n-type silicon layer; and a drain electrode on the n-type silicon layer.
    Type: Grant
    Filed: May 26, 1989
    Date of Patent: December 18, 1990
    Assignees: Seikosha Co., Ltd., Nippon Precision Circuits Ltd.
    Inventors: Sakae Tanaka, Yoshiaki Watanabe, Katsuo Shirai, Yoshihisa Ogiwara
  • Patent number: 4916090
    Abstract: A method for manufacturing a amorphous silicon thin film transistor comprises exposing an morphous silicon layer situated between a source electrode and a drain electrode to a gas phase atmosphere having a gas containing an impurity forming an acceptor, then activating said impurity with an electric field or light energy and doping the activated impurity into said amorphous silicon layer. The gas may be a hydrogen compound and it may include an oxidizing gas.
    Type: Grant
    Filed: March 13, 1989
    Date of Patent: April 10, 1990
    Assignees: Nippon Precision Circuits Ltd., Seikosha Co., Ltd.
    Inventors: Noboru Motai, Yoshihisa Ogiwara, Yasunari Kanda
  • Patent number: 4892613
    Abstract: A light shielding thin film is provided on a light transmitting substrate, and the film is covered by a photoresist. The photoresist is exposed and developed to form a pattern, and the film is etched using the pattern as a mask. The pattern is then exposed through the substrate, using the film as a mask, the pattern then being developed to form a pattern of reduced size. The film is then etched using the reduced size pattern as a mask.
    Type: Grant
    Filed: December 27, 1988
    Date of Patent: January 9, 1990
    Assignees: Nippon Precision Circuits Ltd., Seikosha Co., Ltd.
    Inventors: Noboru Motai, Sakae Tanaka, Yoshiaki Watanabe, Katsuo Shirai, Yaeko Suzuki, Yoshihisa Ogiwara, Kazunori Saito, Keiko Shibuki