Abstract: An information processing apparatus includes reproduction control means for controlling reproduction of a first parameter in order to reproduce an edit applied to a first image, generation means for generating a second parameter from a plurality of first parameters reproduced by the reproduction control means, and edit means for editing the first image based on the second parameter generated by the generation means, and generating a second image.

Abstract: A waterproof electrical connector for electrically connecting wiring to a mating connector having a concavity, the waterproof electrical connector having a contact connected to an end of a wire, a housing having a fitting section configured to at least partially house the contact and configured for insertion into the concavity, a seal integrally arranged on an outer periphery surface near a top end of the fitting section, which sealingly contacts an inner wall of the concavity when the fitting section is inserted into the concavity, and a lock which prevents the housing from exiting the concavity once the fitting section has been inserted into concavity to a predetermined depth is disclosed.

Abstract: An aqueous marking ink composition that contains at least 1 to 20% by mass of a resin which is water-soluble and has a hydrophobic part in a molecule thereof, a colorant containing at least 5 to 30% by mass of titanium oxide, 0.05 to 2% by mass of at least one selected from acetylene glycols, acetylene alcohols or derivatives thereof, 1 to 20% by mass of a water-soluble solvent having a vapor pressure of 5 mmHg or less at 25° C. and water. The composition can provide good wetting property to a non-absorbing surface of metals, resins and the like stained with oils, can write smoothly thereon at a low viscosity without being repelled to make it possible to obtain drawn lines having a high masking property and a high fixing property, and is readily redispersed by a simple stirring operation.

Abstract: An information processing apparatus includes a pattern extraction unit, a rule extraction unit, and a reflection information generation unit. The pattern extraction unit is configured to extract an operation pattern of each of users from operation history information obtained from a plurality of devices to be operated, the operation history information at least including information regarding operation histories of the users and device states. The rule extraction unit is configured to extract incorrect operation patterns from the operation patterns extracted by the pattern extraction unit, the incorrect operation patterns being operation patterns caused by incorrect operations performed by the users. The reflection information generation unit is configured to identify a cause of the incorrect operations from types of the incorrect operation patterns and generate, based on the cause of the incorrect operations, reflection information configured to be reflected in functions of the devices to be operated.

Abstract: An information processing apparatus includes an obtaining unit configured to obtain feature quantities of an image; and a detector configured to detect a gazing point at which a user gazes within the image, wherein the gazing point detected by the detector among the feature quantities obtained by the obtaining unit or the feature quantities extracted from the image in a predetermined range containing the gazing point is stored.

Abstract: The present invention provides a circuit board connecting structure enabled to obtain the reliable connection between circuit patterns by restricting the elongation of a flexible base material even when connecting portions are arranged in a face-to-face configuration and are press-contacted with each other. A circuit board connecting structure 10 includes a first circuit board 11, and a second circuit board 12. The circuit board connecting structure 10 is configured so that when a first connecting portion 13 and a second connecting portion 14 are sandwiched by a pair of pressing jigs 18, 19 and are press-contacted with each other, one 23 of first outer dummy terminals is accommodated between columns of ones 33, 33 of second outer dummy terminals, while the other first outer dummy terminal 24 is accommodated between columns of the other ones 34, 34 of the second outer dummy terminals.

Abstract: The invention provides a connecting structure of a circuit board, a connecting part of the circuit board, and an electronic device capable of alleviating a temperature difference between the connecting parts under hot pressure welding. A connecting structure 10 of a circuit board comprises a first circuit board 11 and a second circuit board 12, with a first connecting part 15 and a second connecting part 16 opposedly disposed via an adhesive 13. The first connecting part 15 and the second connecting part 16 are pinched by a pair of pressurizing jigs 20 and subjected to hot pressure welding so that first circuit patterns 17 and second circuit patterns 18 are in contact with each other.

Abstract: An object of the present invention is to provide a semiconductor device by packaging a plurality of semiconductor chips three-dimensionally in a smaller thickness, with a smaller footprint, at the lower cost without using any other components and through a simpler manufacturing process of the semiconductor device than with the conventional methods. A flip chip packaging structure is formed by directly connecting a first semiconductor chip (101) reduced in thickness by back grinding and a substrate (105) via a bump electrode (102) to a wiring pattern (106). Also, a second semiconductor chip (103) is formed with an electrode (104) that is higher than the sum of the thickness of the first semiconductor chip (101) and the height of the electrode (102), and the electrode (104) is directly connected to the wiring pattern (106) on the substrate (105), whereby the most-compact three-dimensional semiconductor packaged device is produced.

Abstract: An electrical connector includes a connector body and a seal protection cap. The connector body includes a cap housing, a body, and a fitting section provided with a seal. The seal protection cap includes a front face plate and a protection section. The front face plate is provided with an opening in order to allow a continuity check from a front face of the fitting section. The protection section extends cylindrically from a peripheral edge of the front face plate along a side face of the fitting section so as to cover the seal. The seal protection cap is applied to the fitting section of the connector body so as to cover the seal.

Abstract: An information processing apparatus includes a pattern extraction unit, a rule extraction unit, and a reflection information generation unit. The pattern extraction unit is configured to extract an operation pattern of each of users from operation history information obtained from a plurality of devices to be operated, the operation history information at least including information regarding operation histories of the users and device states. The rule extraction unit is configured to extract incorrect operation patterns from the operation patterns extracted by the pattern extraction unit, the incorrect operation patterns being operation patterns caused by incorrect operations performed by the users. The reflection information generation unit is configured to identify a cause of the incorrect operations from types of the incorrect operation patterns and generate, based on the cause of the incorrect operations, reflection information configured to be reflected in functions of the devices to be operated.

Abstract: An information processing apparatus includes a pattern extraction unit configured to extract operation patterns from operation history information at least including an operation history of a user and information on a device state obtained from a plurality of operation target devices, a defined pattern database configured to previously register a defined pattern which is a pattern of a combination of defined operations in accordance with the operation target devices, a rule extraction unit configured to extract an unexpected operation pattern from the operation patterns extracted by the pattern extraction unit with reference to the defined pattern database, and a reflection information generation unit configured to generate reflection information to be reflected on a function of the operation target devices from the unexpected operation pattern.

Abstract: An electrical connector includes a connector body and a seal protection cap. The connector body includes a cap housing, a body, and a fitting section provided with a seal. The seal protection cap includes a front face plate and a protection section. The front face plate is provided with an opening in order to allow a continuity check from a front face of the fitting section. The protection section extends cylindrically from a peripheral edge of the front face plate along a side face of the fitting section so as to cover the seal. The seal protection cap is applied to the fitting section of the connector body so as to cover the seal.

Abstract: The present invention provides a circuit board connecting structure enabled to obtain the reliable connection between circuit patterns by restricting the elongation of a flexible base material even when connecting portions are arranged in a face-to-face configuration and are press-contacted with each other. A circuit board connecting structure 10 includes a first circuit board 11, and a second circuit board 12. The circuit board connecting structure 10 is configured so that when a first connecting portion 13 and a second connecting portion 14 are sandwiched by a pair of pressing jigs 18, 19 and are press-contacted with each other, one 23 of first outer dummy terminals is accommodated between columns of ones 33, 33 of second outer dummy terminals, while the other first outer dummy terminal 24 is accommodated between columns of the other ones 34, 34 of the second outer dummy terminals.

Abstract: The invention provides a connecting structure of a circuit board, a connecting part of the circuit board, and an electronic device capable of alleviating a temperature difference between the connecting parts under hot pressure welding. A connecting structure 10 of a circuit board comprises a first circuit board 11 and a second circuit board 12, with a first connecting part 15 and a second connecting part 16 opposedly disposed via an adhesive 13. The first connecting part 15 and the second connecting part 16 are pinched by a pair of pressurizing jigs 20 and subjected to hot pressure welding so that first circuit patterns 17 and second circuit patterns 18 are in contact with each other.

Abstract: An information processing apparatus includes reproduction control means for controlling reproduction of a first parameter in order to reproduce an edit applied to a first image, generation means for generating a second parameter from a plurality of first parameters reproduced by the reproduction control means, and edit means for editing the first image based on the second parameter generated by the generation means, and generating a second image.

Abstract: An information processing apparatus includes an obtaining unit configured to obtain feature quantities of an image; and a detector configured to detect a gazing point at which a user gazes within the image, wherein the gazing point detected by the detector among the feature quantities obtained by the obtaining unit or the feature quantities extracted from the image in a predetermined range containing the gazing point is stored.

Abstract: An object of the present invention is to provide a semiconductor device by packaging a plurality of semiconductor chips three-dimensionally in a smaller thickness, with a smaller footprint, at the lower cost without using any other components and through a simpler manufacturing process of the semiconductor device than with the conventional methods. A flip chip packaging structure is formed by directly connecting a first semiconductor chip (101) reduced in thickness by back grinding and a substrate (105) via a bump electrode (102) to a wiring pattern (106). Also, a second semiconductor chip (103) is formed with an electrode (104) that is higher than the sum of the thickness of the first semiconductor chip (101) and the height of the electrode (102), and the electrode (104) is directly connected to the wiring pattern (106) on the substrate (105), whereby the most-compact three-dimensional semiconductor packaged device is produced.

Abstract: Provided is an oil-based ink composition comprising at least a colorant, titanium oxide, a solvent including propylene glycol monomethyl ether and ethanol, a polyvinylbutyral resin and a ketone resin.