Patents by Inventor Yoshihito Takei
Yoshihito Takei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20190203088Abstract: An adhesion-imparting agent of the present technology is an organopolysiloxane represented by (R11R12SiO2/2)a(R2SiO3/2)b(R3SiO3/2)c(R4O1/2)d. R11 and R12 each independently represent an aryl group having from 6 to 20 carbons or an alkyl group having from 1 to 20 carbons, R2 represents an alkenyl group, R3 represents an epoxy group-containing group or an oxetanyl group-containing group, and R4 represents a hydrogen atom or an alkyl group having from 1 to 10 carbons; and a, b, c, and d are each a positive number and satisfy relationship formulas of 0.80?a+b+c+d?1.00, c/(a+b+c)>0.01, d/(a+b+c)>0.02, and d/(2a+b+c+d)<0.05.Type: ApplicationFiled: April 26, 2017Publication date: July 4, 2019Inventors: Daisuke Tsushima, Yoshihito Takei, Takeaki Saiki, Kazunori Ishikawa
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Patent number: 10100156Abstract: The curable resin composition of the present technology includes: (A) a straight-chain organopolysiloxane having at least two silicon-bonded hydrogen atoms and at least one aryl group in one molecule and having an average degree of polymerization of greater than 10; (B) a branched-chain organopolysiloxane having at least three alkenyl groups and at least one aryl group in one molecule; and (C) a hydrosilylation reaction catalyst; wherein a proportion of diphenylsiloxane units relative to an amount of all siloxane units is 10 mol % or greater, and the all siloxane units containing siloxane units derived from the straight-chain organopolysiloxane (A) and the branched-chain organopolysiloxane (B).Type: GrantFiled: December 25, 2014Date of Patent: October 16, 2018Assignee: The Yokohama Rubber Co., LTD.Inventors: Emi Kim, Yoshihito Takei, Motoki Takuma, Takeaki Saiki
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Publication number: 20160194457Abstract: Provided is a curable resin composition that contains a silicon-containing compound (A) having a silanol group and an aryl group, a silicon-containing compound (B) having at least two silicon atom-bonded hydrogen atoms and at least one aryl group in one molecule, a branched-chain organopolysiloxane (C) having an alkenyl group and an aryl group, and a hydrosilylation reaction catalyst (D).Type: ApplicationFiled: June 12, 2014Publication date: July 7, 2016Inventors: Yoshihito Takei, Emi Kim, Takeaki Saiki
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Patent number: 9346954Abstract: The object of the present invention is to provide a curable resin composition having excellent adhesion. This curable resin composition contains: a straight-chain organopolysiloxane (A) having at least two silicon-bonded hydrogen atoms and at least one aryl group in each molecule, the degree of polymerization being greater than 10; a branched-chain organopolysiloxane (B) having at least three alkenyl groups and at least one aryl group in each molecule; and a hydrosilylation reaction catalyst (C).Type: GrantFiled: August 26, 2013Date of Patent: May 24, 2016Assignee: The Yokohama Rubber Co., Ltd.Inventors: Emi Kim, Yoshihito Takei, Tsubasa Ito, Kazunori Ishikawa
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Publication number: 20150252191Abstract: The object of the present invention is to provide a curable resin composition having excellent adhesion. This curable resin composition contains: a straight-chain organopolysiloxane (A) having at least two silicon-bonded hydrogen atoms and at least one aryl group in each molecule, the degree of polymerization being greater than 10; a branched-chain organopolysiloxane (B) having at least three alkenyl groups and at least one aryl group in each molecule; and a hydrosilylation reaction catalyst (C).Type: ApplicationFiled: August 26, 2013Publication date: September 10, 2015Inventors: Emi Kim, Yoshihito Takei, Tsubasa Ito, Kazunori Ishikawa
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Patent number: 9051435Abstract: A silanol condensation catalyst including at least the zirconium metal salt expressed by Formula (I) below (wherein n is an integer from 1 to 3; each R1 is a hydrocarbon group having from 1 to 16 carbons; and each R2 is a hydrocarbon group having from 1 to 18 carbons. A heat-curable silicone resin composition for sealing optical semiconductors includes 100 parts by mass of a polysiloxane containing two or more silanol groups in the molecule; from 0.1 to 2,000 parts by mass of a silane compound containing two or more alkoxy groups that are bonded to a silicon atom in the molecule; and a zirconium metal salt expressed by Formula (I). A sealed optical semiconductor is formed by sealing a LED chip by applying the heat-curable silicone resin composition to the LED chip, heating the LED chip, and curing the heat-curable silicone resin composition.Type: GrantFiled: April 30, 2014Date of Patent: June 9, 2015Assignee: THE YOKOHAMA RUBBER CO., LTD.Inventors: Yoshihito Takei, Kazunori Ishikawa, Takeaki Saiki
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Publication number: 20140256539Abstract: A silanol condensation catalyst including at least the zirconium metal salt expressed by Formula (I) below (wherein n is an integer from 1 to 3; each R1 is a hydrocarbon group having from 1 to 16 carbons; and each R2 is a hydrocarbon group having from 1 to 18 carbons. A heat-curable silicone resin composition for sealing optical semiconductors includes 100 parts by mass of a polysiloxane containing two or more silanol groups in the molecule; from 0.1 to 2,000 parts by mass of a silane compound containing two or more alkoxy groups that are bonded to a silicon atom in the molecule; and a zirconium metal salt expressed by Formula (I). A sealed optical semiconductor is formed by sealing a LED chip by applying the heat-curable silicone resin composition to the LED chip, heating the LED chip, and curing the heat-curable silicone resin composition.Type: ApplicationFiled: April 30, 2014Publication date: September 11, 2014Applicant: The Yokohama Rubber Co., Ltd.Inventors: Yoshihito TAKEI, Kazunori ISHIKAWA, Takeaki SAIKI
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Patent number: 8772431Abstract: A silanol condensation catalyst including at least the zirconium metal salt expressed by Formula (I) below (wherein n is an integer from 1 to 3; each R1 is a hydrocarbon group having from 1 to 16 carbons; and each R2 is a hydrocarbon group having from 1 to 18 carbons.) A heat-curable silicone resin composition for sealing optical semiconductors includes 100 parts by mass of a polysiloxane containing two or more silanol groups in the molecule; from 0.1 to 2,000 parts by mass of a silane compound containing two or more alkoxy groups that are bonded to a silicon atom in the molecule; and a zirconium metal salt expressed by Formula (I). A sealed optical semiconductor is formed by sealing a LED chip by applying the heat-curable silicone resin composition to the LED chip, heating the LED chip, and curing the heat-curable silicone resin composition.Type: GrantFiled: December 8, 2009Date of Patent: July 8, 2014Assignee: The Yokohama Rubber Co., Ltd.Inventors: Yoshihito Takei, Kazunori Ishikawa, Takeaki Saiki
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Patent number: 8669583Abstract: A heat-curable silicone resin composition for sealing optical semiconductors including: component (A): 100 parts by mass of a silicon compound expressed by Formula (1) below; and component (B): from 0.001 to 10 parts by mass of a condensation catalyst. (R1SiO3/2)a((R2)2SiO2/2)b((R3)3SiO1/2)c(SiO4/2)d(XO1/2)e??(1) In this formula, R1, R2, and R3 are identical or differing monovalent organic groups, “X” is a hydrogen atom or a monovalent organic group, “a” is a positive number, “b” is 0 or a positive number, “c” is 0 or a positive number, “d” is 0 or a positive number, and “e” is 0 or a positive number; however “a” to “e” satisfy the following conditions: b/a is a number from 0 to 10, c/a is a number from 0 to 0.5, d/(a+b+c+d) is a number from 0 to 0.3, and e/(a+b+c+d) is a number from 0.01 to 1.5.Type: GrantFiled: February 22, 2012Date of Patent: March 11, 2014Assignee: The Yokohama Rubber Co., Ltd.Inventors: Takeaki Saiki, Yoshihito Takei
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Patent number: 8304489Abstract: A curable silicone resin composition has excellent closed-system curability, adhesiveness, heat-resistant coloration stability, and balance between transparency and adhesive strength. The curable silicone resin composition is a curable silicone resin composition comprising 100 parts by mass of a silicone A, the weight-average molecular weight of which is 20,000 to 200,000, and which has 2 or more (meth)acryloyl groups per molecule; 10 parts by mass or more of a silicone B, the weight-average molecular weight of which is 1,000 or greater but less than 20,000, and which has 2 or more (meth)acryloyl groups per molecule; 2 parts by mass or more of a silicone C, the weight-average molecular weight of which is 300 or more but less than 1,000, the (meth)acrylic equivalent of which is less than 450 g/mol, and which has 2 or more (meth)acryloyl groups per molecule; and a radical initiator.Type: GrantFiled: June 8, 2010Date of Patent: November 6, 2012Assignee: The Yokohama Rubber Co., Ltd.Inventors: Yoshihito Takei, Kazunori Ishikawa, Takeaki Saiki
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Publication number: 20120211797Abstract: A heat-curable silicone resin composition for sealing optical semiconductors including: component (A): 100 parts by mass of a silicon compound expressed by Formula (1) below; and component (B): from 0.001 to 10 parts by mass of a condensation catalyst. (R1SiO3/2)a((R2)2SiO2/2)b((R3)3SiO1/2)c(SiO4/2)d(XO1/2)e??(1) In this formula, R1, R2, and R3 are identical or differing monovalent organic groups, “X” is a hydrogen atom or a monovalent organic group, “a” is a positive number, “b” is 0 or a positive number, “c” is 0 or a positive number, “d” is 0 or a positive number, and “e” is 0 or a positive number; however “a” to “e” satisfy the following conditions: b/a is a number from 0 to 10, c/a is a number from 0 to 0.5, d/(a+b+c+d) is a number from 0 to 0.3, and e/(a+b+c+d) is a number from 0.01 to 1.5.Type: ApplicationFiled: February 22, 2012Publication date: August 23, 2012Applicant: The Yokohama Rubber Co., LTD.Inventors: Takeaki Saiki, Yoshihito Takei
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Publication number: 20120071604Abstract: A curable silicone resin composition has excellent closed-system curability, adhesiveness, heat-resistant coloration stability, and balance between transparency and adhesive strength. The curable silicone resin composition is a curable silicone resin composition comprising 100 parts by mass of a silicone A, the weight-average molecular weight of which is 20,000 to 200,000, and which has 2 or more (meth)acryloyl groups per molecule; 10 parts by mass or more of a silicone B, the weight-average molecular weight of which is 1,000 or greater but less than 20,000, and which has 2 or more (meth)acryloyl groups per molecule; 2 parts by mass or more of a silicone C, the weight-average molecular weight of which is 300 or more but less than 1,000, the (meth)acrylic equivalent of which is less than 450 g/mol, and which has 2 or more (meth)acryloyl groups per molecule; and a radical initiator.Type: ApplicationFiled: June 8, 2010Publication date: March 22, 2012Applicant: THE YOKOHAMA RUBBER CO., LTD.Inventors: Yoshihito Takei, Kazunori Ishikawa, Takeaki Saiki
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Publication number: 20110248314Abstract: A silanol condensation catalyst including at least the zirconium metal salt expressed by Formula (I) below (wherein n is an integer from 1 to 3; each R1 is a hydrocarbon group having from 1 to 16 carbons; and each R2 is a hydrocarbon group having from 1 to 18 carbons.) A heat-curable silicone resin composition for sealing optical semiconductors includes 100 parts by mass of a polysiloxane containing two or more silanol groups in the molecule; from 0.1 to 2,000 parts by mass of a silane compound containing two or more alkoxy groups that are bonded to a silicon atom in the molecule; and a zirconium metal salt expressed by Formula (I). A sealed optical semiconductor is formed by sealing a LED chip by applying the heat-curable silicone resin composition to the LED chip, heating the LED chip, and curing the heat-curable silicone resin composition.Type: ApplicationFiled: December 8, 2009Publication date: October 13, 2011Applicant: THE YOKOHAMA RUBBER CO., LTD.Inventors: Yoshihito Takei, Kazunori Ishikawa, Takeaki Saiki