Patents by Inventor Yoshikatsu INAGAKI

Yoshikatsu INAGAKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210318072
    Abstract: A cooling device includes a heat-radiating fin group having a plurality of heat-radiating fins that are arranged parallel to each other in a first direction; first heat pipes, one end of each first heat pipe being configured to be thermally connected to a first heat-generating element, another end of each first heat pipe being thermally connected to the heat-radiating fin group; and second heat pipes, one end of each second heat pipe being configured to be thermally connected to a second heat-generating element, another end of each second heat pipe being thermally connected to the heat-radiating fin group, wherein respective inserted another ends of the first and second heat pipes are disposed on a plane parallel to the first direction and defined in the heat-radiating fin group and have portions parallel to the first direction.
    Type: Application
    Filed: June 23, 2021
    Publication date: October 14, 2021
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Shinichi ITO, Masahiro MEGURO, Kenya KAWABATA, Yoshikatsu INAGAKI
  • Publication number: 20210321538
    Abstract: A cooling device including a container to which at least one heating element is thermally connected, a primary refrigerant, and a condensation tube through which a secondary refrigerant flows, wherein a container inner surface area increasing portion is formed on an inner surface of the container to which the heating element is thermally connected, and a plate-shaped member is provided, that includes a shielding portion that is located above the container inner surface area increasing portion in a direction of gravity and below the condensation tube in the direction of gravity, with at least a part of the shielding portion not immersed in the primary refrigerant in a liquid phase, and the plate-shaped member includes a support portion extending from the shielding portion, in a part of a periphery along an orthogonal direction to the direction of gravity, of the container inner surface area increasing portion.
    Type: Application
    Filed: June 24, 2021
    Publication date: October 14, 2021
    Applicant: Furukawa Electric Co., Ltd.
    Inventors: Hirofumi AOKI, Yoshikatsu INAGAKI, Kenya KAWABATA, Yoshinori NAKAMURA
  • Patent number: 11137215
    Abstract: There is provided a flat heat pipe that is not easily deformed in spite of a reduction in thickness and can maintain high heat transport capacity. A flat heat pipe 100 includes a container 130 in which a cavity 130S is formed by plates 110 (110a, 110b) made of metal and disposed substantially in parallel with each other, working fluid that is enclosed in the cavity 130S, and a wick structure 150 that is inserted into the container. The wick structure 150 includes a first sheet-like member 140, and hollow protruding portions 170 protruding in a height direction of the container 130 are formed on the first sheet-like member 140.
    Type: Grant
    Filed: September 18, 2019
    Date of Patent: October 5, 2021
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Tomoaki Toratani, Yoshinori Nakamura, Yoshikatsu Inagaki, Hirofumi Aoki
  • Patent number: 11112186
    Abstract: A heatsink including: a heat transport member having a heat receiving portion thermally connected to a heating element; and a heat radiating fin group which is connected to a heat radiating portion of the heat transport member and in which a plurality of heat radiating fins is arranged, wherein the heat transport member has an integral internal space that communicates from the heat receiving portion to the heat radiating portion and that is filled with a working fluid, a heat receiving portion inner surface area increasing portion and a supporting member are provided in an internal space of the heat receiving portion, and the supporting member is in surface contact with the heat receiving portion inner surface area increasing portion.
    Type: Grant
    Filed: September 2, 2020
    Date of Patent: September 7, 2021
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yosuke Watanabe, Kenya Kawabata, Yoshikatsu Inagaki, Tatsuro Miura, Kazuaki Aotani, Toshiaki Nakamura
  • Patent number: 11085703
    Abstract: The present disclosure is to provide a heatsink that can improve heat radiation performance of a heat radiating fin while preventing dry-out of a heat receiving portion and that can equalize a heat input in the heat receiving portion in an environment in which an installation space of the heatsink is limited even when a forbidden region exists in the installation space.
    Type: Grant
    Filed: September 2, 2020
    Date of Patent: August 10, 2021
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yosuke Watanabe, Kenya Kawabata, Yoshikatsu Inagaki, Tatsuro Miura, Kazuaki Aotani, Toshiaki Nakamura
  • Patent number: 11079183
    Abstract: A vapor chamber excellent in productivity, reduction of a number of components, and capable of preventing reduction in area of a cavity section while reducing a space of an outer periphery of the cavity section in which a working fluid is sealed is provided. An example vapor chamber has a container in which a cavity section is formed by stacked plate-shaped members, a working fluid that is sealed in the cavity section, and a wick structure accommodated in the cavity section.
    Type: Grant
    Filed: July 24, 2019
    Date of Patent: August 3, 2021
    Assignee: Furukawa Electric Co., Ltd.
    Inventors: Hirofumi Aoki, Yoshikatsu Inagaki, Hiroshi Sakai
  • Patent number: 11054190
    Abstract: A heat insulating structure body comprising: a container which includes a first plate-like body, a second plate-like body facing the first plate-like body, a partition plate for dividing a space between the first plate-like body and the second plate-like body, a first cavity part formed by the first plate-like body and the partition plate, and a second cavity part formed by the second plate-like body and the partition plate, wherein a wick structure body and a working fluid are sealed in the second cavity part.
    Type: Grant
    Filed: March 22, 2019
    Date of Patent: July 6, 2021
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yoshikatsu Inagaki, Hirofumi Aoki
  • Patent number: 10996001
    Abstract: The present disclosure provides a heatsink that can increase a fin area of a heat radiating fin while securing sufficient volumes of a heat receiving portion, heat insulating portion, and heat radiating portion even in an environment in which an installation space for the heatsink, more specifically, an installation space in a height direction of the heatsink is limited.
    Type: Grant
    Filed: September 1, 2020
    Date of Patent: May 4, 2021
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yosuke Watanabe, Kenya Kawabata, Yoshikatsu Inagaki, Tatsuro Miura, Kazuaki Aotani, Toshiaki Nakamura
  • Patent number: 10976112
    Abstract: The present disclosure is related to providing a heat pipe that can exhibit excellent heat transport properties under tougher use conditions such as a situation in which an amount of heat generation by electronic components further increases.
    Type: Grant
    Filed: November 7, 2019
    Date of Patent: April 13, 2021
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Kenya Kawabata, Yoshikatsu Inagaki
  • Publication number: 20210095930
    Abstract: The vapor chamber includes a container having a hollow cavity and formed of one plate-shaped member and another plate-shaped member facing the one plate-shaped member that are layered on each other, a working fluid enclosed in the cavity, and a wick structure provided in the cavity. The wick structure includes a first wick part extending from a heat receiving part to a heat discharge part and having a first wick member using a linear member, and a second wick part provided to the heat receiving part and having a second wick member using a linear member. An average diameter the linear member of the second wick member is smaller than an average diameter of the linear member of the first wick member or an aperture dimension of the second wick member is smaller than an aperture dimension of the first wick member.
    Type: Application
    Filed: November 24, 2020
    Publication date: April 1, 2021
    Applicant: Furukawa Electric Co., Ltd.
    Inventors: Yoshikatsu Inagaki, Hirofumi Aoki, Daiki Takemura, Hiroshi Okada, Kazuaki Aotani
  • Publication number: 20210018272
    Abstract: The present disclosure is related to providing a heat sink that can exhibit an excellent cooling property for even a heating element generating a high amount of heat and being mounted to a narrowed space. The heat sink includes a plurality of heat pipes to be thermally connected to a heating element, and a heat dissipation section thermally connected to the plurality of heat pipes, in which in the plurality of heat pipes, at least evaporation sections to be thermally connected to the heating element have flattened portions whose cross sectional shape in a direction orthogonal to a heat transfer direction of the plurality of heat pipes is flattened, and surfaces in the flattened portions in a thickness direction are arranged facing the heating element.
    Type: Application
    Filed: September 30, 2020
    Publication date: January 21, 2021
    Applicant: Furukawa Electric Co., Ltd.
    Inventors: Yoshikatsu INAGAKI, Yasuhiro UCHIMURA, Shuta HIKICHI, Tatsuro MIURA, Hiroshi SAKAI
  • Publication number: 20210022265
    Abstract: The present disclosure provides a cooling device that can exhibit excellent cooling characteristics while avoiding increase in size of the device, and a cooling system using the cooling device. The cooling device including a container to which at least one heating element is thermally connected, a primary refrigerant sealed in an inside of the container, and a condensation tube through which a secondary refrigerant flows, and which penetrates through a gaseous phase portion inside of the container.
    Type: Application
    Filed: October 1, 2020
    Publication date: January 21, 2021
    Applicant: Furukawa Electric Co., Ltd.
    Inventors: Yoshikatsu INAGAKI, Hirofumi AOKI, Hiroshi OKADA, Kenya KAWABATA, Tomoaki TORATANI
  • Publication number: 20210007246
    Abstract: The present disclosure provides a heatsink that can improve heat radiation efficiency of a heat radiating fin and equalize a heat input in a heat receiving portion while securing sufficient volumes of the heat receiving portion, a heat insulating portion, and a heat radiating portion even in an environment in which an installation space for the heatsink, more specifically, an installation space in a width direction of the heatsink is limited.
    Type: Application
    Filed: September 21, 2020
    Publication date: January 7, 2021
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yosuke WATANABE, Kenya KAWABATA, Yoshikatsu INAGAKI, Tatsuro MIURA, Kazuaki AOTANI, Toshiaki NAKAMURA
  • Publication number: 20200400381
    Abstract: The present disclosure provides a heatsink that includes a lightweight heat transport member having good pressure resistance against atmospheric pressure without impairing flowability of a gas-phase working fluid, and that can equalize a heat input in a heat receiving portion of the heat transport member.
    Type: Application
    Filed: September 2, 2020
    Publication date: December 24, 2020
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yosuke WATANABE, Kenya KAWABATA, Yoshikatsu INAGAKI, Tatsuro MIURA, Kazuaki AOTANI, Toshiaki NAKAMURA
  • Publication number: 20200400379
    Abstract: The present disclosure is to provide a heatsink that can improve heat radiation performance of a heat radiating fin while preventing dry-out of a heat receiving portion and that can equalize a heat input in the heat receiving portion in an environment in which an installation space of the heatsink is limited even when a forbidden region exists in the installation space.
    Type: Application
    Filed: September 2, 2020
    Publication date: December 24, 2020
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yosuke WATANABE, Kenya KAWABATA, Yoshikatsu INAGAKI, Tatsuro MIURA, Kazuaki AOTANI, Toshiaki NAKAMURA
  • Publication number: 20200393201
    Abstract: The present disclosure provides a heatsink that can increase a fin area of a heat radiating fin while securing sufficient volumes of a heat receiving portion, heat insulating portion, and heat radiating portion even in an environment in which an installation space for the heatsink, more specifically, an installation space in a height direction of the heatsink is limited.
    Type: Application
    Filed: September 1, 2020
    Publication date: December 17, 2020
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yosuke WATANABE, Kenya KAWABATA, Yoshikatsu INAGAKI, Tatsuro MIURA, Kazuaki AOTANI, Toshiaki NAKAMURA
  • Publication number: 20200390003
    Abstract: Example embodiments may provide a heat sink that cools a heating element. The heat sink may include a heat receiving unit thermally connected to a heating element, a plurality of heat pipes thermally connected to the heat receiving unit at a predetermined part, and a heat dissipation unit thermally connected to another part different from the predetermined part of the plurality of heat pipes.
    Type: Application
    Filed: August 25, 2020
    Publication date: December 10, 2020
    Applicant: Furukawa Electric Co., Ltd.
    Inventors: Kenya KAWABATA, Yoshikatsu INAGAKI
  • Patent number: 10816276
    Abstract: To provide a heat pipe where the heat pipe has an excellent capacity for absorbing a non-condensable gas such as a hydrogen gas thus exhibiting excellent heat transfer characteristics. The heat pipe includes: a container having a cavity portion inside the container; a wick structure disposed in the cavity portion; a working fluid sealed in the cavity portion; and a metal which absorbs hydrogen at 350° C. or below and releases no hydrogen at 350° C. or below, the metal being disposed in the cavity portion.
    Type: Grant
    Filed: February 24, 2017
    Date of Patent: October 27, 2020
    Assignee: Furukawa Electric Co., Ltd.
    Inventors: Hirofumi Aoki, Hiroshi Sakai, Yoshikatsu Inagaki
  • Patent number: 10760855
    Abstract: The present disclosure is to provide a heat sink capable of improving cooling efficiency of a heat radiation fin and exhibiting excellent cooling performance with respect to a cooling target regardless of an installation posture of the heat sink, and capable of being installed even in a narrow space.
    Type: Grant
    Filed: January 31, 2020
    Date of Patent: September 1, 2020
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yosuke Watanabe, Tatsuro Miura, Toshiaki Nakamura, Kenya Kawabata, Yoshikatsu Inagaki
  • Patent number: 10718572
    Abstract: The present disclosure is to provide a heat sink capable of improving cooling efficiency of a heat radiation fin and exhibiting excellent cooling performance with respect to a cooling target regardless of an installation posture of the heat sink, and capable of being installed even in a narrow space.
    Type: Grant
    Filed: January 31, 2020
    Date of Patent: July 21, 2020
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yosuke Watanabe, Tatsuro Miura, Toshiaki Nakamura, Kenya Kawabata, Yoshikatsu Inagaki