Patents by Inventor Yoshikazu Akashi

Yoshikazu Akashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7523548
    Abstract: A process for producing a printed wiring board comprises the steps of depositing a base metal on at least one surface of an insulating film to form a base metal layer and further depositing copper or a copper alloy to form a conductive metal layer, then removing a surface metal layer, which is formed through the above step, by etching to form a wiring pattern, and then treating the base metal layer with a treating liquid capable of dissolving and/or passivating the metal that forms the base metal layer. The printed wiring board so provided comprises an insulating film and a wiring pattern formed on at least one surface of the insulating film, the wiring pattern including a base metal layer deposited on the insulating film surface and a conductive metal layer, the base metal layer for forming the wiring pattern protrudes in a widthwise direction more than the conductive metal layer for forming the wiring pattern.
    Type: Grant
    Filed: December 2, 2004
    Date of Patent: April 28, 2009
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Tatsuo Kataoka, Yoshikazu Akashi, Yutaka Iguchi
  • Patent number: 7495177
    Abstract: A printed wiring board manufacturing process comprises forming a conductive metal layer on at least one surface of an insulating film with a sputtered metal layer in between, selectively etching the conductive metal layer and the sputtered metal layer to produce a wiring pattern, treating the laminated film with a first treatment liquid capable of dissolving nickel of the sputtered metal layer, and treating with a second treatment liquid capable of dissolving chrome of the sputtered metal layer and also capable of eliminating the sputtered metal layer in the insulating film to remove a superficial surface of the insulating film exposed from the wiring pattern together with the residual sputtered metals in the superficial surface. A printed wiring board comprises an insulating film and a wiring pattern, wherein the insulating film in an area exposed from the wiring pattern has a thickness smaller by 1 to 100 nm than that of an area under the wiring pattern.
    Type: Grant
    Filed: December 2, 2004
    Date of Patent: February 24, 2009
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Tatsuo Kataoka, Yoshikazu Akashi, Yutaka Iguchi
  • Publication number: 20080236872
    Abstract: The printed wiring board of the present invention is a printed wiring board produced by selectively etching a base film having a base metal layer and a conductive metal layer, which are formed on an insulating film, through plural etching steps comprising a conductive metal etching step and a base metal etching step to form a wiring pattern and then bringing the base film having the thus formed wiring pattern into contact with a reducing aqueous solution containing a reducing substance, wherein the amount of a residual metal derived from the etching solution on the printed wiring board is not more than 0.05 ?g/cm2. According to the present invention, the metal derived from the etching solution is removed by the use of a reducing substance-containing solution. Therefore, the water rinsing step in the production process can be shortened, occurrence of migration attributable to the residual metal can be prevented, and a printed wiring board having high reliability can be efficiently produced.
    Type: Application
    Filed: June 3, 2005
    Publication date: October 2, 2008
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Tatsuo Kataoka, Yoshikazu Akashi, Yutaka Iguchi, Hiroaki Kurihara, Naoya Yasui
  • Publication number: 20070145584
    Abstract: The printed wiring board comprises, on at least one surface of an insulating film, a base metal layer and a conductive metal layer formed on the base metal layer, and is characterized in that in a section of the wiring board the bottom width of the conductive metal layer is smaller than the top width of the base metal layer. The circuit device comprises the printed wiring board and an electronic part mounted thereon. The process for producing a printed wiring board comprises bringing a base metal layer and a conductive metal layer into contact with an etching solution capable of dissolving the conductive metal to form a wiring pattern and then sequentially bringing the resultant into contact with a first treating solution capable of dissolving the metal for forming the base metal layer, a microetching solution capable of selectively dissolving the conductive metal and a second treating solution having a different chemical composition from the first treating solution in this order.
    Type: Application
    Filed: December 10, 2004
    Publication date: June 28, 2007
    Applicant: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Tatsuo Kataoka, Yoshikazu Akashi, Yutaka Iguchi
  • Publication number: 20070111401
    Abstract: A printed wiring board manufacturing process comprises forming a conductive metal layer on at least one surface of an insulating film with a sputtered metal layer in between, selectively etching the conductive metal layer and the sputtered metal layer to produce a wiring pattern, treating the laminated film with a first treatment liquid capable of dissolving nickel of the sputtered metal layer, and treating with a second treatment liquid capable of dissolving chrome of the sputtered metal layer and also capable of eliminating the sputtered metal layer in the insulating film to remove a superficial surface of the insulating film exposed from the wiring pattern together with the residual sputtered metals in the superficial surface. A printed wiring board comprises an insulating film and a wiring pattern, wherein the insulating film in an area exposed from the wiring pattern has a thickness smaller by 1 to 100 nm than that of an area under the wiring pattern.
    Type: Application
    Filed: September 2, 2004
    Publication date: May 17, 2007
    Applicant: Mitsui Mining & Smelting Co., LTD
    Inventors: Tatsuo Kataoka, Yoshikazu Akashi, Yutaka Iguchi
  • Publication number: 20070101571
    Abstract: [Solution means] A process for producing a printed wiring board comprises the steps of depositing a base metal on at least one surface of an insulating film to form a base metal layer and further depositing copper or a copper alloy to form a conductive metal layer, then removing a surface metal layer, which is formed through the above step, by etching to form a wiring pattern, and then treating the base metal layer with a treating liquid capable of dissolving and/or passivating the metal that forms the base metal layer. The printed wiring board so provided comprises an insulating film and a wiring pattern formed on at least one surface of the insulating film, the wiring pattern including a base metal layer deposited on the insulating film surface and a conductive metal layer, the base metal layer for forming the wiring pattern protrudes in a widthwise direction more than the conductive metal layer for forming the wiring pattern.
    Type: Application
    Filed: December 2, 2004
    Publication date: May 10, 2007
    Applicant: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Tatsuo Kataoka, Yoshikazu Akashi, Yutaka Iguchi
  • Patent number: 7060364
    Abstract: A film carrier tape for mounting electronic components or devices that excels in not only migration resistance but also adhesiveness of wiring to insulating film; and a process for producing the same. The film carrier tape for mounting electronic components or devices has seed layer comprising a zinc layer superimposed on a treated surface of insulating film and a nickel base metal layer superimposed on a surface of a zinc layer, or comprising a layer of alloy containing elemental nickel and elemental zinc in specified proportion, superimposed on a treated surface of insulating film). In the film carrier tape for mounting electronic components or devices, at least part of a region extending across a width of wiring from an edge side thereof to the treated surface of the insulating film may be continuously covered with a zinc coating layer comprising elemental zinc.
    Type: Grant
    Filed: December 23, 2003
    Date of Patent: June 13, 2006
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Tatsuo Kataoka, Yoshikazu Akashi
  • Publication number: 20040219341
    Abstract: A film carrier tape for mounting electronic components or devices that excels in not only migration resistance but also adhesiveness of wiring to insulating film; and a process for producing the same. The film carrier tape for mounting electronic components or devices has seed layer comprising a zinc layer superimposed on a treated surface of insulating film and a nickel base metal layer superimposed on a surface of a zinc layer, or comprising a layer of alloy containing elemental nickel and elemental zinc in specified proportion, superimposed on a treated surface of insulating film). In the film carrier tape for mounting electronic components or devices, at least part of a region extending across a width of wiring from an edge side thereof to the treated surface of the insulating film may be continuously covered with a zinc coating layer comprising elemental zinc.
    Type: Application
    Filed: December 23, 2003
    Publication date: November 4, 2004
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Tatsuo Kataoka, Yoshikazu Akashi
  • Publication number: 20040202958
    Abstract: A plating-pretreatment solution comprising an organic sulfonic acid, thiourea, fluoroboric acid and hypophosphorous acid and a plating-pretreatment method comprising contacting a film carrier tape in which a wiring pattern is formed on a surface of an insulating film with a plating-pretreatment solution comprising an organic sulfonic acid, thiourea, fluoroboric acid and hypophosphorous acid to remove metals remaining on the insulating film. According to the plating-pretreatment solution and the plating-pretreatment method, metals remaining on the surface of the insulating film exposed by etching are removed, and the occurrence of migration is prevented.
    Type: Application
    Filed: April 8, 2004
    Publication date: October 14, 2004
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Tatsuo Kataoka, Yoshikazu Akashi