Patents by Inventor Yoshikazu Fujishiro

Yoshikazu Fujishiro has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11961683
    Abstract: A biaxially stretched polypropylene film which has a thickness of from 1.0 ?m to 3.5 ?m, a tensile fracture stress at 135° C. of 70 MPa or more in a first direction, and a difference between the tensile fracture stress at 125° C. in the first direction and the tensile fracture stress at 135° C. in the first direction of from 0 MPa to 15 MPa (inclusive).
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: April 16, 2024
    Assignee: Oji Holdings Corporation
    Inventors: Yoshimune Okuyama, Takeshi Tominaga, Yoshikazu Fujishiro, Tadakazu Ishiwata
  • Patent number: 11817272
    Abstract: In a metallized film 1, n electrode portions 20, which are metal deposition portions, are formed in parallel on one surface of a dielectric film 2 having a film width corresponding to n capacitor elements, n being an even number of 2 or more. Each electrode portion 20 is provided with a plurality of inclined margins 31 and 32, which are metal non-deposition portions extending at an angle with respect to a film width direction, at a regular interval in a film length direction. Across a center line Lc virtually extending in the film length direction at the center in the film width direction, the inclined margins 31 of the electrode portion 20 located on one side in the film width direction, and the inclined margins 32 of the electrode portion 20 located on the other side in the film width direction are inclined in opposite directions so as to be line-symmetric with respect to the center line Lc.
    Type: Grant
    Filed: August 14, 2018
    Date of Patent: November 14, 2023
    Assignee: OJI HOLDINGS CORPORATION
    Inventors: Kazuyuki Hiate, Akihiro Kakehi, Katsuyuki Moritaka, Yoshikazu Fujishiro, Masahiro Nakata
  • Publication number: 20210291427
    Abstract: A biaxially stretched polypropylene film which has a thickness of from 1.0 ?m to 3.5 ?m, a tensile fracture stress at 135° C. of 70 MPa or more in a first direction, and a difference between the tensile fracture stress at 125° C. in the first direction and the tensile fracture stress at 135° C. in the first direction of from 0 MPa to 15 MPa (inclusive).
    Type: Application
    Filed: August 28, 2019
    Publication date: September 23, 2021
    Inventors: Yoshimune OKUYAMA, Takeshi TOMINAGA, Yoshikazu FUJISHIRO, Tadakazu ISHIWATA
  • Publication number: 20210134531
    Abstract: In a metallized film 1, n electrode portions 20, which are metal deposition portions, are formed in parallel on one surface of a dielectric film 2 having a film width corresponding to n capacitor elements, n being an even number of 2 or more. Each electrode portion 20 is provided with a plurality of inclined margins 31 and 32, which are non-metal deposition portions extending at an angle with respect to a film width direction, at a regular interval in a film length direction. Across a center line Lc virtually extending in the film length direction at the center in the film width direction, the inclined margins 31 of the electrode portion 20 located on one side in the film width direction, and the inclined margins 32 of the electrode portion 20 located on the other side in the film width direction are inclined in opposite directions so as to be line-symmetric with respect to the center line Lc.
    Type: Application
    Filed: August 14, 2018
    Publication date: May 6, 2021
    Applicant: OJI HOLDINGS CORPORATION
    Inventors: Kazuyuki HIATE, Akihiro KAKEHI, Katsuyuki MORITAKA, Yoshikazu FUJISHIRO, Masahiro NAKATA
  • Patent number: 10910164
    Abstract: The present invention relates to a biaxially stretched polypropylene film for capacitor. The biaxially stretched polypropylene film for capacitor of the present invention can suppress an increase in tan ? and a decrease in the electrostatic capacitance even when the capacitor is used at a high voltage and an elevated temperature for a long duration.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: February 2, 2021
    Assignee: OJI HOLDINGS CORPORATION
    Inventors: Yoshimune Okuyama, Yoshikazu Fujishiro, Masahiro Nakata, Tadakazu Ishiwata, Akihiro Kakehi
  • Publication number: 20190315047
    Abstract: A biaxially oriented polypropylene film containing a polypropylene resin, the film having a thickness of 1.0 to 3.0 ?m, and a molecular orientation coefficient ?Nx of 0.013 to 0.016, as calculated according to ?Nx=(?Nxy+?Nxz)/2 on the basis of a birefringence value ?Nxy in the slow axis direction with respect to the fast axis direction and a birefringence value ?Nxz in the slow axis direction with respect to the thickness direction, as measured via optical birefringence measurement.
    Type: Application
    Filed: December 28, 2017
    Publication date: October 17, 2019
    Inventors: Takeshi TOMINAGA, Michiko SUEYOSHI, Yoshimune OKUYAMA, Yoshikazu FUJISHIRO, Masahiro NAKATA, Tadakazu ISHIWATA
  • Publication number: 20180082791
    Abstract: The present invention relates to a biaxially stretched polypropylene film for capacitor. The biaxially stretched polypropylene film for capacitor of the present invention can suppress an increase in tan ? and a decrease in the electrostatic capacitance even when the capacitor is used at a high voltage and an elevated temperature for a long duration.
    Type: Application
    Filed: March 31, 2016
    Publication date: March 22, 2018
    Applicant: OJI HOLDINGS CORPORATION
    Inventors: Yoshimune OKUYAMA, Yoshikazu FUJISHIRO, Masahiro NAKATA, Tadakazu ISHIWATA, Akihiro KAKEHI
  • Patent number: 6703909
    Abstract: The covering sheet includes at least one magnetic material layer made of a resin compound having an oxide magnetic material or a metal magnetic material mixed therein, a ground conductor layer laminated on one surface of the magnetic material layer, and a plurality of via holes for passing conducting unit for grounding the ground conductor layer, or includes a laminate consisting of at least one magnetic material layer made of a resin compound having an oxide magnetic material or a metal magnetic material mixed therein and at least one dielectric layer having a permittivity lower than that of the magnetic material layer, and a ground conductor layer laminated on one surface of the laminate.
    Type: Grant
    Filed: November 26, 2001
    Date of Patent: March 9, 2004
    Assignee: TDK Corporation
    Inventors: Taro Miura, Yoshikazu Fujishiro
  • Publication number: 20020127924
    Abstract: The covering sheet includes at least one magnetic material layer made of a resin compound having an oxide magnetic material or a metal magnetic material mixed therein, a ground conductor layer laminated on one surface of the magnetic material layer, and a plurality of via holes for passing conducting unit for grounding the ground conductor layer, or includes a laminate consisting of at least one magnetic material layer made of a resin compound having an oxide magnetic material or a metal magnetic material mixed therein and at least one dielectric layer having a permittivity lower than that of the magnetic material layer, and a ground conductor layer laminated on one surface of the laminate.
    Type: Application
    Filed: November 26, 2001
    Publication date: September 12, 2002
    Applicant: TDK Corporation
    Inventors: Taro Miura, Yoshikazu Fujishiro
  • Patent number: 5590016
    Abstract: The invention decreases crosstalk due to capacitive coupling between through type capacitor elements in a multilayer through type capacitor array. On dielectric sheets between electrodes, which constitute a multi capacitor array, through-holes filled with conductive materials are formed, where a central conductor is not present. By electrically connecting conductive materials filled in the through-holes, electrostatic shielding is provided between the through type capacitor elements. Electrical connection is achieved through conductive layers formed outside or inside the through type capacitor elements.
    Type: Grant
    Filed: December 14, 1994
    Date of Patent: December 31, 1996
    Assignee: TDK Corporation
    Inventors: Yoshikazu Fujishiro, Takaya Ishigaki, Hiraku Harada