Patents by Inventor Yoshikazu Fujishiro

Yoshikazu Fujishiro has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190315047
    Abstract: A biaxially oriented polypropylene film containing a polypropylene resin, the film having a thickness of 1.0 to 3.0 ?m, and a molecular orientation coefficient ?Nx of 0.013 to 0.016, as calculated according to ?Nx=(?Nxy+?Nxz)/2 on the basis of a birefringence value ?Nxy in the slow axis direction with respect to the fast axis direction and a birefringence value ?Nxz in the slow axis direction with respect to the thickness direction, as measured via optical birefringence measurement.
    Type: Application
    Filed: December 28, 2017
    Publication date: October 17, 2019
    Inventors: Takeshi TOMINAGA, Michiko SUEYOSHI, Yoshimune OKUYAMA, Yoshikazu FUJISHIRO, Masahiro NAKATA, Tadakazu ISHIWATA
  • Publication number: 20180082791
    Abstract: The present invention relates to a biaxially stretched polypropylene film for capacitor. The biaxially stretched polypropylene film for capacitor of the present invention can suppress an increase in tan ? and a decrease in the electrostatic capacitance even when the capacitor is used at a high voltage and an elevated temperature for a long duration.
    Type: Application
    Filed: March 31, 2016
    Publication date: March 22, 2018
    Applicant: OJI HOLDINGS CORPORATION
    Inventors: Yoshimune OKUYAMA, Yoshikazu FUJISHIRO, Masahiro NAKATA, Tadakazu ISHIWATA, Akihiro KAKEHI
  • Patent number: 6703909
    Abstract: The covering sheet includes at least one magnetic material layer made of a resin compound having an oxide magnetic material or a metal magnetic material mixed therein, a ground conductor layer laminated on one surface of the magnetic material layer, and a plurality of via holes for passing conducting unit for grounding the ground conductor layer, or includes a laminate consisting of at least one magnetic material layer made of a resin compound having an oxide magnetic material or a metal magnetic material mixed therein and at least one dielectric layer having a permittivity lower than that of the magnetic material layer, and a ground conductor layer laminated on one surface of the laminate.
    Type: Grant
    Filed: November 26, 2001
    Date of Patent: March 9, 2004
    Assignee: TDK Corporation
    Inventors: Taro Miura, Yoshikazu Fujishiro
  • Publication number: 20020127924
    Abstract: The covering sheet includes at least one magnetic material layer made of a resin compound having an oxide magnetic material or a metal magnetic material mixed therein, a ground conductor layer laminated on one surface of the magnetic material layer, and a plurality of via holes for passing conducting unit for grounding the ground conductor layer, or includes a laminate consisting of at least one magnetic material layer made of a resin compound having an oxide magnetic material or a metal magnetic material mixed therein and at least one dielectric layer having a permittivity lower than that of the magnetic material layer, and a ground conductor layer laminated on one surface of the laminate.
    Type: Application
    Filed: November 26, 2001
    Publication date: September 12, 2002
    Applicant: TDK Corporation
    Inventors: Taro Miura, Yoshikazu Fujishiro
  • Patent number: 5590016
    Abstract: The invention decreases crosstalk due to capacitive coupling between through type capacitor elements in a multilayer through type capacitor array. On dielectric sheets between electrodes, which constitute a multi capacitor array, through-holes filled with conductive materials are formed, where a central conductor is not present. By electrically connecting conductive materials filled in the through-holes, electrostatic shielding is provided between the through type capacitor elements. Electrical connection is achieved through conductive layers formed outside or inside the through type capacitor elements.
    Type: Grant
    Filed: December 14, 1994
    Date of Patent: December 31, 1996
    Assignee: TDK Corporation
    Inventors: Yoshikazu Fujishiro, Takaya Ishigaki, Hiraku Harada