Abstract: A piezoelectric film of the present invention has a surface roughness value P-V of not more than 170.0 nm, which is defined by a difference between a maximum height (peak value P) and a minimum height (valley value V) on a film surface, a piezoelectric constant d31 greater than 150 pC/N and a breakdown voltage of 80 V or more, which is defined by an applied voltage that results in a current value of 1 ?A or more.

Abstract: A piezoelectric material of the invention includes a perovskite oxide (P) (which may contain inevitable impurities) represented by the formula below: Pba(Zrx,Tiy,Mb-x-y)bOc??(P) (wherein M represents one or two or more metal elements; wherein 0<x<b, 0<y<b, 0?b?x?y; and wherein a molar ratio a:b:c is 1:1:3 as a standard; however, the molar ratio may be varied from the standard molar ratio within a range where a perovskite structure is obtained). The perovskite oxide (P) has a signal intensity ratio I(Pb4+)/I(Pb2+) between Pb4+ and Pb2+ of more than 0 and less than 0.60 measured through XAFS.

Abstract: In a piezoelectric device, a first electrode, a first piezoelectric film, a second piezoelectric film, and a second electrode are formed in this order on a first electrode formed above a surface of the substrate, and an intermediate electrode is arranged between the first and second piezoelectric films. Each of the first and second piezoelectric films has a thickness of 10 micrometers or smaller, and has a first surface facing toward the substrate and a second surface opposite to the first surface. At least one of the first and second surfaces has an arithmetic average surface roughness (Ra) of 0.5 micrometers or smaller.

Abstract: A piezoelectric film of a perovskite oxide represented by a general expression (P) below and has a pyrochlore free single phase perovskite structure with a/b?1.06. Pba(Zrx,Tiy,Mb-x-y)bOc??(P) (where, M represents one or more types of metal elements, 0<x<b, 0<y<b, 0?b-x-y, and a:b:c=1:1:3 is standard, but the molar ratio may deviate from the standard within a range in which a perovskite structure can be obtained.

Abstract: Provided is a perovskite-type oxide film having a perovskite-type crystal structure and containing lead as a chief component, which, when subjected to Raman microspectroscopy at a plurality of points on a surface thereof so as to measure Raman spectra upon application of an electric field of 100 kV/cm and upon application of no electric field, has a mean of absolute values of peak shift amounts that is 2.2 cm?1 or less, with the peak shift amounts being found between Raman spectra in a range of 500 to 650 cm?1 measured upon application of an electric field of 100 kV/cm and Raman spectra in the range of 500 to 650 cm?1 measured upon application of no electric field. A production process and an evaluation method for such a film as well as a device using such a film are also provided.

Abstract: A multilayer body which includes a low-resistance metal layer having a low electrical resistance, excellent thermal resistance and low surface irregularity is provided. The multilayer body includes a substrate, and a low-resistance metal layer which is formed on the substrate and has a single-layer structure or a multilayer structure of two or more sublayers. The low-resistance metal layer includes a gold-containing layer or sublayer composed of gold and another metal.

Abstract: A piezoelectric device comprises a piezoelectric body and electrodes for applying an electric field in a predetermined direction across the piezoelectric body. The piezoelectric body contains an inorganic compound polycrystal, which contains first ferroelectric substance crystals having orientational characteristics at the time free from electric field application and has characteristics such that, with application of at least a predetermined electric field E1, at least part of the first crystals undergoes phase transition to second ferroelectric substance crystals of a crystal system different from the crystal system of the first crystals. The piezoelectric device is actuated under conditions such that a minimum applied electric field Emin and a maximum applied electric field Emax satisfy Emin<E1<Emax.

Abstract: The piezoelectric device includes a substrate, a first electrode deposited on the substrate, a piezoelectric film deposited on top of at least a part of the first electrode by vapor phase deposition, a second electrode deposited on the piezoelectric film and having a water vapor transmission rate of not more than 1 g/m2/day, and at least one protective film that covers at least peripheries of the second electrode and the piezoelectric film and which has an opening in a position corresponding to the piezoelectric film except the periphery thereof. The piezoelectric device has satisfactory moisture resistance and is capable of effectively preventing the ingress of moisture into the piezoelectric film.

Abstract: The piezoelectric device includes a substrate, a first electrode formed on the substrate, a piezoelectric film formed on the first electrode and a second electrode formed on a second side of the piezoelectric film which is away from a first side where the first electrode is formed. The first electrode is composed of a first layer in contact with the substrate and a second layer in contact with the piezoelectric film. The first layer is formed of a material that is wet etched at a different rate than the substrate. The in %-jet head includes the piezoelectric device, a liquid droplet storing/ejecting member for ejecting ink droplets through a ink spout and provided on the piezoelectric device and a diaphragm for vibrating in response to expansion or contraction of the piezoelectric device and provided between the piezoelectric device and the liquid droplet storing/ejecting member.

Abstract: In a piezoelectric device, a first electrode, a first piezoelectric film, a second piezoelectric film, and a second electrode are formed in this order on a first electrode formed above a surface of the substrate, and an intermediate electrode is arranged between the first and second piezoelectric films. Each of the first and second piezoelectric films has a thickness of 10 micrometers or smaller, and has a first surface facing toward the substrate and a second surface opposite to the first surface. At least one of the first and second surfaces has an arithmetic average surface roughness (Ra) of 0.5 micrometers or smaller.

Abstract: A piezoelectric device includes a substrate; and a laminated film formed above the substrate. The laminated film includes a lower electrode layer, a piezoelectric layer, and an upper electrode layer formed in this order, and the lower electrode layer is a metal electrode layer containing as one or more main components one or more nonnoble metals and/or one or more nonnoble alloys. Preferably, the one or more main components are one or more of the metals Cr, W, Ti, Al, Fe, Mo, In, Sn, Ni, Cu, Co, and Ta, and alloys of the metals.

Abstract: A method of forming a pattern of an inorganic material film, which method is more versatile, easy, and practical. The method includes the steps of: (a) forming a sacrifice layer having a pattern on a substrate by employing a material having a different thermal expansion coefficient from that of an inorganic material of the inorganic material film; (b) forming an inorganic material layer on the substrate, on which the sacrifice layer has been formed, at a predetermined deposition temperature by employing the inorganic material; (c) lowering a temperature of at least the inorganic material layer to produce cracks in the inorganic material layer formed on the sacrifice layer; and (d) removing the sacrifice layer and the inorganic material layer formed thereon.

Abstract: The liquid ejection head has a liquid ejection device which ejects liquid and is partially formed of a directionally solidified silicon substrate.

Abstract: The functional structural element includes: a substrate member which has a surface made of directionally solidified silicon; and a functional structural body which is made of a functional material and is formed on the surface of the substrate member.