Patents by Inventor Yoshikazu Ohara

Yoshikazu Ohara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190339478
    Abstract: The present invention is intended to realize an optical device in which an optical member and a sensor are directly bonded to each other while overflow of an adhesive onto light receiving elements is suppressed.
    Type: Application
    Filed: May 12, 2017
    Publication date: November 7, 2019
    Applicant: Sharp Kabushiki Kaisha
    Inventors: SHOHGO HIROOKA, YOSHIHITO ISHIZUE, YOSHIKAZU OHARA, HIDEYUKI KURIMOTO
  • Publication number: 20190258019
    Abstract: [Object] To enable an LOC to have both a reduced size and high design flexibility. [Solution] A substrate (1) in which an opening (4) is formed, a sensor (2), and a lens (3) are included. The lens (3) has a wiring pattern (5) for electrically connecting the substrate (1) and the sensor (2) to each other.
    Type: Application
    Filed: May 17, 2017
    Publication date: August 22, 2019
    Inventors: YOSHIKAZU OHARA, SHOHGO HIROOKA
  • Publication number: 20190212519
    Abstract: [Object] To enable mounting of a lens onto a light-receiving element with high accuracy while achieving a reduction in the profile of an optical device. [Solution] An optical device (101) includes an adhesive (6) that joins a sensor (2) and a lens (3) to each other.
    Type: Application
    Filed: October 5, 2017
    Publication date: July 11, 2019
    Inventors: SHOHGO HIROOKA, YOSHIHITO ISHIZUE, YOSHIKAZU OHARA
  • Patent number: 9998640
    Abstract: Provided is a camera module capable of securing air permeability in an imaging portion of the camera module and reducing failure (speck failure) of an image sensor, which is caused by adhesion of a foreign matter. In a camera module in which an internal space is formed by a wiring substrate, a cover body (36), and a transparent plate (38), a ventilation groove (45) which extends from the internal space to an outside of the internal space and a recess part (46) which is formed so as to branch off from the ventilation groove (45) are formed on a surface of the cover body (36), which adheres to the transparent plate (38).
    Type: Grant
    Filed: March 27, 2015
    Date of Patent: June 12, 2018
    Assignee: Sharp Kabushiki Kaisha
    Inventor: Yoshikazu Ohara
  • Patent number: 9980372
    Abstract: A camera module (1) has an internal space (28) that abuts a wiring substrate (21) and is occluded, at least a part of a base material of the wiring substrate (21) is a porous portion (41) that is configured of porous ceramic, porous metal, organic fabric, or inorganic fabric and has interconnected air holes, and the internal space (28) is connected to the outside of the camera module (1) through the interconnected air holes.
    Type: Grant
    Filed: June 2, 2015
    Date of Patent: May 22, 2018
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Yoshikazu Ohara, Yoshihiro Sekimoto, Tetsuya Fujimoto, Yoshinori Tanida
  • Publication number: 20170280558
    Abstract: A camera module (1) has an internal space (28) that abuts a wiring substrate (21) and is occluded, at least a part of a base material of the wiring substrate (21) is a porous portion (41) that is configured of porous ceramic, porous metal, organic fabric, or inorganic fabric and has interconnected air holes, and the internal space (28) is connected to the outside of the camera module (1) through the interconnected air holes.
    Type: Application
    Filed: June 2, 2015
    Publication date: September 28, 2017
    Applicant: Sharp Kabushiki Kaisha
    Inventors: Yoshikazu OHARA, Yoshihiro SEKIMOTO, Tetsuya FUJIMOTO, Yoshinori TANIDA
  • Publication number: 20170041515
    Abstract: Provided is a camera module capable of securing air permeability in an imaging portion of the camera module and reducing failure (speck failure) of an image sensor, which is caused by adhesion of a foreign matter. In a camera module in which an internal space is formed by a wiring substrate, a cover body (36), and a transparent plate (38), a ventilation groove (45) which extends from the internal space to an outside of the internal space and a recess part (46) which is formed so as to branch off from the ventilation groove (45) are formed on a surface of the cover body (36), which adheres to the transparent plate (38).
    Type: Application
    Filed: March 27, 2015
    Publication date: February 9, 2017
    Inventor: Yoshikazu OHARA
  • Patent number: 8559696
    Abstract: Scattered waves from the defect of burst ultrasonic waves radiated from an ultrasonic transmitter to a structure in two different arrangements of the ultrasonic transmitter and an array receiver are received by the array receiver so as to obtain a reception signal. The reception signal is subjected to a band-pass filter that passes a specific frequency component, shifted by different time according to the position of each reception sensor element of the array receiver and then, added so as to obtain a processing signal. On the basis of the processing signal, an image of the defect is obtained, respectively. A common portion of the obtained two images is extracted.
    Type: Grant
    Filed: May 19, 2009
    Date of Patent: October 15, 2013
    Assignee: Tohoku University
    Inventors: Kazushi Yamanaka, Yoshikazu Ohara, Yohei Shintaku
  • Publication number: 20110123119
    Abstract: Scattered waves from the defect of burst ultrasonic waves radiated from an ultrasonic transmitter to a structure in two different arrangements of the ultrasonic transmitter and an array receiver are received by the array receiver so as to obtain a reception signal. The reception signal is subjected to a band-pass filter that passes a specific frequency component, shifted by different time according to the position of each reception sensor element of the array receiver and then, added so as to obtain a processing signal. On the basis of the processing signal, an image of the defect is obtained, respectively. A common portion of the obtained two images is extracted.
    Type: Application
    Filed: May 19, 2009
    Publication date: May 26, 2011
    Applicant: TOHOKU UNIVERSITY
    Inventors: Kazushi Yamanaka, Yoshikazu Ohara, Yohei Shintaku
  • Patent number: 7626774
    Abstract: A camera module of the present invention includes a plurality of projections 61b on a bottom base of a driving section 61 of an AF/Zoom module. The projections 61b are radially extended from an aperture 63 formed on an optical path. By this, adhesive can be spread over the projections 61b when bonding a lens holder and the AF/Zoom module together. Furthermore, even if the adhesive is excessively applied, excessive adhesive can be retained between the projections 61b. As a result, it is possible to realize a solid-state imaging device which makes it possible to improve adhesive strength between the lens holder and the AF/Zoom module and easily bond the lens holder and the AF/Zoom module.
    Type: Grant
    Filed: March 27, 2008
    Date of Patent: December 1, 2009
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Kazuo Kinoshita, Yoshikazu Ohara
  • Publication number: 20080266447
    Abstract: A camera module 100 according to the present invention includes a lens unit 1 including a lens 11, and an imaging unit 2 where a solid-state imaging element is mounted on a wiring board 21, the lens unit 1 and the imaging unit 2 being engaged with each other by inserting a projection 23 into a cutout part 13, the projection 23 being provided on the imaging unit 2, and the cutout part 13 being provided on the lens unit 1. The cutout part 13 has a cross-sectional shape that is in parallel with an opening surface 13a and that becomes smaller inwardly of the lens unit 1. Thus, when detaching each unit, breaking of the projection can be prevented and each unit can be easily detached. With this arrangement it is possible to realize a camera module in which a disengagement of an optical unit and an imaging unit can be performed easily, while effectively preventing the breaking of the projection when detaching the optical unit and the imaging unit.
    Type: Application
    Filed: April 2, 2008
    Publication date: October 30, 2008
    Applicant: Sharp Kabushiki Kaisha
    Inventors: Yoshikazu Ohara, Kazuo Kinoshita
  • Publication number: 20080239522
    Abstract: A camera module of the present invention includes a plurality of projections 61b on a bottom base of a driving section 61 of an AF/Zoom module. The projections 61b are radially extended from an aperture 63 formed on an optical path. By this, adhesive can be spread over the projections 61b when bonding a lens holder and the AF/Zoom module together. Furthermore, even if the adhesive is excessively applied, excessive adhesive can be retained between the projections 61b. As a result, it is possible to realize a solid-state imaging device which makes it possible to improve adhesive strength between the lens holder and the AF/Zoom module and easily bond the lens holder and the AF/Zoom module.
    Type: Application
    Filed: March 27, 2008
    Publication date: October 2, 2008
    Applicant: Sharp Kabushiki Kaisha
    Inventors: Kazuo Kinoshita, Yoshikazu Ohara
  • Patent number: 7112872
    Abstract: To provide a semiconductor device capable of corresponding to an applied bending stress by flexibly changing its shape, and to provide a semiconductor device module, a manufacturing method of the semiconductor device, and a manufacturing method of the semiconductor device module. In a silicon substrate whose front surface is provided with an element forming layer having an element forming region where a semiconductor element is formed, a groove is formed in a portion of the rear surface of the silicon substrate corresponding to a region of the element forming layer where a semiconductor element is not formed.
    Type: Grant
    Filed: October 9, 2003
    Date of Patent: September 26, 2006
    Assignee: Sharp Kabushiki Kaisha
    Inventor: Yoshikazu Ohara
  • Publication number: 20040070053
    Abstract: To provide a semiconductor device capable of corresponding to an applied bending stress by flexibly changing its shape, and to provide a semiconductor device module, a manufacturing method of the semiconductor device, and a manufacturing method of the semiconductor device module. In a silicon substrate whose front surface is provided with an element forming layer having an element forming region where a semiconductor element is formed, a groove is formed in a portion of the rear surface of the silicon substrate corresponding to a region of the element forming layer where a semiconductor element is not formed.
    Type: Application
    Filed: October 9, 2003
    Publication date: April 15, 2004
    Applicant: SHARP KABUSHIKI KAISHA
    Inventor: Yoshikazu Ohara
  • Patent number: 6065839
    Abstract: A material exhibiting apparatus displays an image of a material and a character such as an arrow on a display screen in an overlapped state. A location of a display area is set in synchronization with horizontal and vertical synchronizing signals. The set location of the display area is changed by varying a generation timing of either one or both of the horizontal and vertical synchronizing signals. A display location of the character is changed by changing the set location of the display area. Since the display location of the character is quickly changed on the basis of frequencies of the horizontal and vertical synchronizing signals, the movement of the character can continuously be displayed on the display screen.
    Type: Grant
    Filed: October 8, 1998
    Date of Patent: May 23, 2000
    Assignee: Elmo Co., Ltd.
    Inventors: Masami Miyata, Yoshikazu Ohara
  • Patent number: 5796495
    Abstract: An image input equipment including a stage having a diffusion board provided on an upper surface thereof on which an object is to be placed, an image input head for inputting an image of the object and photoelectrically converting the image into an electric signal, a supporting pillar for supporting the image input head and positioning the image input head over the stage, exterior illumination lamps for illuminating the object placed on the stage from above the stage, interior illumination lamps for illuminating the object placed on the diffusion board from inside the diffusion board. The image input equipment is further provided with lighting circuits and a changeover device. The lighting circuits are used to activate both the exterior illumination lamps and the interior illumination lamps. The changeover device connects the lighting circuits to only either the exterior illumination lamps or the interior illumination lamps selectively.
    Type: Grant
    Filed: August 29, 1994
    Date of Patent: August 18, 1998
    Assignee: Elmo Co., Ltd.
    Inventors: Masami Miyata, Yoshikazu Ohara