Abstract: A transfer apparatus includes the first plate-like member in which the micro structures are detachably held via the temporary adhesion layer, the second plate-like member having a sticky layer which faces the first plate-like member and is elastically deformable in a thickness direction, a pressure part which presses one of the first plate-like member and the second plate-like member toward another one of the first plate-like member and the second plate-like member in the thickness direction such that the temporary adhesion layer and the sticky layer become parallel to each other at least locally, a denaturing/peeling part which changes properties of the temporary adhesion layer such that an adhesive force of the temporary adhesion layer is reduced, and a controlling part which controls operations of the pressure part and the denaturing/peeling part.

Abstract: A workpiece separating device for irradiating a laminated body including a workpiece having a circuit substrate bonded with a supporting body via a separating layer with a light, thereby denaturing the separating layer, and peeling the supporting body from the workpiece, the workpiece separating device comprising: a holding member for detachably holding any one of the workpiece side or the supporting body of the laminated body; a light irradiation part for irradiating the light toward the separating layer through the other of the supporting body or the workpiece side of the laminated body held by the holding member; an isolation member for, with respect to any one of the workpiece side or the supporting body of the laminated body, isolating and moving the other in the thickness direction; and a controlling part for operation controlling the light irradiation part and the isolation member.

Abstract: A workpiece-separating device includes: a holding member that detachably holds a workpiece of a laminated body in which the workpiece that includes a circuit board and a supporting body through which laser beams pass are laminated with each other via a separating layer that peelably alters due to at least absorption of the laser beams; a light irradiation part that irradiates the laser beams toward the separating layer through the supporting body of the laminated body held by the holding member; a driving part that relatively moves a light irradiation position of irradiation from the light irradiation part with respect to the supporting body and the separating layer of the laminated body held by the holding member in at least a direction crossing a light irradiation direction of irradiation from the light irradiation part; and a controlling part that operates and controls the light irradiation part and the driving part.

Abstract: A workpiece-separating device includes: a holding member which detachably holds one of the workpiece and the supporting body; a laser irradiation part which irradiates the separating layer with the laser beam through the other of the supporting body and the workpiece of the laminated body being held by the holding member; and a controlling part which controls an operation of the laser irradiation part, wherein the laser irradiation part has a laser scanner which moves the spot like laser beam along the laminated body, an entire irradiated face of the separating layer in an area of the laser beam irradiated from the laser scanner toward the laminated body is divided into a plurality of irradiation areas each having a band shape that is elongated in one of two directions intersecting a light irradiation direction from the laser irradiation part.

Abstract: A workpiece-separating device includes: a holding member which detachably holds one of the workpiece and the supporting body; a laser irradiation part which irradiates the separating layer with the laser beam through the other of the supporting body and the workpiece of the laminated body being held by the holding member; and a controlling part which controls an operation of the laser irradiation part, wherein the laser irradiation part has a laser scanner which moves the spot like laser beam along the laminated body, an entire irradiated face of the separating layer in an area of the laser beam irradiated from the laser scanner toward the laminated body is divided into a plurality of irradiation areas each having a band shape that is elongated in one of two directions intersecting a light irradiation direction from the laser irradiation part.

Abstract: According to one embodiment, a substrate processing apparatus and a substrate processing method that can improve the quality of substrates are provided.

Abstract: A workpiece-separating device includes a holding member configured to detachably hold one of a workpiece or a supporting body of a laminated body and a light irradiation part configured to perform light irradiation on a separating layer, the holding member including: a stage facing one of the workpiece or the supporting body, a fixed supporting part projecting from the stage toward the laminated body and including a still suction pad immovable in a projection direction, and a movable supporting part projecting from the stage toward the laminated body and including a response suction pad that is movable in a projection direction and elastically deformable, a plurality of the fixed supporting parts and a plurality of the movable supporting parts disposed in a dispersed manner, and the plurality of response suction pads project toward the laminated body further than the plurality of still suction pads.

Abstract: A workpiece-separating device includes a holding member configured to detachably hold one of a workpiece or a supporting body of a laminated body and a light irradiation part configured to perform light irradiation on a separating layer, the holding member including: a stage facing one of the workpiece or the supporting body, a fixed supporting part projecting from the stage toward the laminated body and including a still suction pad immovable in a projection direction, and a movable supporting part projecting from the stage toward the laminated body and including a response suction pad that is movable in a projection direction and elastically deformable, a plurality of the fixed supporting parts and a plurality of the movable supporting parts disposed in a dispersed manner, and the plurality of response suction pads project toward the laminated body further than the plurality of still suction pads.

Abstract: A workpiece-separating device includes: a holding member that detachably holds a workpiece of a laminated body in which the workpiece that includes a circuit board and a supporting body through which laser beams pass are laminated with each other via a separating layer that peelably alters due to at least absorption of the laser beams; a light irradiation part that irradiates the laser beams toward the separating layer through the supporting body of the laminated body held by the holding member; a driving part that relatively moves a light irradiation position of irradiation from the light irradiation part with respect to the supporting body and the separating layer of the laminated body held by the holding member in at least a direction crossing a light irradiation direction of irradiation from the light irradiation part; and a controlling part that operates and controls the light irradiation part and the driving part.

Abstract: According to one embodiment, a substrate processing apparatus and a substrate processing method that can improve the quality of substrates are provided.

Abstract: A workpiece-separating device includes: a holding member that detachably holds a workpiece among a layered body in which the workpiece that includes a circuit board and a supporting body that allows laser beams to pass therethrough are layered with each other via a separating layer that peelably alters with absorption of the laser beams; a laser irradiation part that performs irradiation of Gaussian beams pulse-oscillated as the laser beams toward the separating layer through the supporting body of the layered body held by the holding member; and a controlling part that controls an operation of the laser irradiation part, wherein the controlling part controls a distance between centers of the adjacent Gaussian beams of the laser beams pulse-oscillated from the laser irradiation part to be less than three times of a standard deviation when a relationship between a beam diameter and irradiation intensity is assumed as a normal distribution.

Abstract: A workpiece-separating device includes: a holding member that detachably holds a workpiece among a layered body in which the workpiece that includes a circuit board and a supporting body that allows laser beams to pass therethrough are layered with each other via a separating layer that peelably alters with absorption of the laser beams; a laser irradiation part that performs irradiation of Gaussian beams pulse-oscillated as the laser beams toward the separating layer through the supporting body of the layered body held by the holding member; and a controlling part that controls an operation of the laser irradiation part, wherein the controlling part controls a distance between centers of the adjacent Gaussian beams of the laser beams pulse-oscillated from the laser irradiation part to be less than three times of a standard deviation when a relationship between a beam diameter and irradiation intensity is assumed as a normal distribution.

Abstract: Provided is a resin-sealing device having: a first molding die that has a holding surface for a workpiece on which a semiconductor element is mounted; a second molding die that opposes a mounting surface of the workpiece on which the semiconductor element is mounted, and has a cavity to which an uncured resin is fed, the workpiece being held on the holding surface of the first molding die; a decompression chamber that is formed between the first molding die and the second molding die and configured to be openable and closeable; a driving part that forms the decompression chamber by bringing one or both of the first molding die and the second molding die close to the other or to each other relatively in an opposing direction of the first molding die and the second molding die; and a pressure regulating part.

Abstract: There is disclosed an electrostatic holding apparatus in which a voltage is applied to an conductive electrode covered with an insulating dielectric layer in order to cause the insulating dielectric layer to electrostatically attract an object. The main component of the insulating dielectric layer is ceramic containing 0.1-30 wt. % of an atomic metal, and the volume resistivity of the metal-containing ceramic at 20° C. is 108-1013 &OHgr;·cm. The metallic element is Mo or W. In the electrostatic holding apparatus, since the volume resistivity of an insulating dielectric layer of an electrostatic attraction portion is decreased, a strong electrostatic force can be generated. Also, there can be maintained the capability of allowing removal of an object at the time of stopping application of voltage. Further, since neither fine cracks nor pores remain in the insulating dielectric layer after sintering, the withstand voltage is high.