Patents by Inventor Yoshikazu Saijo

Yoshikazu Saijo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10927463
    Abstract: A novel pretreating liquid for electroless plating which is used simultaneously with reduction treatment after roughening treatment of a filler-containing insulating resin substrate. A pretreating liquid for electroless plating is used simultaneously with reduction treatment when an insulating resin substrate containing a filler is roughened and residues generated on the insulating resin substrate are reduced. The pretreating liquid comprises: a reducing agent; and at least one selected from the group consisting of ethylene-based glycol ether represented by CmH(2m+1)-(OC2H4)n-OH (m=an integer of 1 to 4, n=an integer of 1 to 4) and propylene-based glycol ether represented by CxH(2x+1)-(OC3H6)y-OH (x=an integer of 1 to 4, y= an integer of 1 to 3).
    Type: Grant
    Filed: June 19, 2017
    Date of Patent: February 23, 2021
    Assignee: C. UYEMURA & CO., LTD.
    Inventors: Yoshikazu Saijo, Hisamitsu Yamamoto, Nobuhiko Naka
  • Publication number: 20210047734
    Abstract: A novel pretreating liquid for electroless plating which is used simultaneously with reduction treatment after roughening treatment of a filler-containing insulating resin substrate. A pretreating liquid for electroless plating is used simultaneously with reduction treatment when an insulating resin substrate containing a filler is roughened and residues generated on the insulating resin substrate are reduced. The pretreating liquid contains a reducing agent; and at least one selected from the group consisting of ethylene-based glycol ether represented by CmH(2m+1)-(OC2H4)n-OH (m=an integer of 1 to 4, n=an integer of 1 to 4) and propylene-based glycol ether represented by CxH(2x+1)-(OC3H6)y-OH (x=an integer of 1 to 4, y=an integer of 1 to 3).
    Type: Application
    Filed: November 4, 2020
    Publication date: February 18, 2021
    Applicant: C. Uyemura & Co., Ltd.
    Inventors: Yoshikazu SAIJO, Hisamitsu YAMAMOTO, Nobuhiko NAKA
  • Publication number: 20200378008
    Abstract: A present invention provides a method for manufacturing a printed wiring board having excellent plating adhesion to a resin substrate having low surface roughness such as having surface roughness Ra of 0.2 ?m or less, having excellent treating solution stability, and having high penetrability into the resin substrate. The method for manufacturing a resin substrate includes a step 1A or a step 1B; and a step 2 after the step 1A or the step 1B; and the steps are conducted before conducting electroless plating.
    Type: Application
    Filed: May 22, 2020
    Publication date: December 3, 2020
    Applicant: C. Uyemura & Co., Ltd.
    Inventors: Yoshikazu SAIJO, Hisamitsu YAMAMOTO, Nobuhiko NAKA
  • Patent number: 10773280
    Abstract: An ultrasonic treatment apparatus including: an ultrasonic bath for performing an ultrasonic treatment on a treatment target object; a first ultrasonic vibrator provided on the front surface side of the treatment target object; and a second ultrasonic vibrator provided on the back surface side of the treatment target object; wherein the first ultrasonic vibrator does not face the second ultrasonic vibrator.
    Type: Grant
    Filed: November 1, 2017
    Date of Patent: September 15, 2020
    Assignee: C. UYEMURA & CO., LTD.
    Inventors: Hisamitsu Yamamoto, Masayuki Utsumi, Yoshikazu Saijo, Tomoji Okuda, Yutaka Nishinaka, Yoshinori Nakanishi
  • Publication number: 20190264329
    Abstract: A novel pretreating liquid for electroless plating which is used simultaneously with reduction treatment after roughening treatment of a filler-containing insulating resin substrate. A pretreating liquid for electroless plating is used simultaneously with reduction treatment when an insulating resin substrate containing a filler is roughened and residues generated on the insulating resin substrate are reduced. The pretreating liquid comprises: a reducing agent; and at least one selected from the group consisting of ethylene-based glycol ether represented by CmH(2m+1)-(OC2H4)n-OH (m=an integer of 1 to 4, n=an integer of 1 to 4) and propylene-based glycol ether represented by CxH(2x+1)-(OC3H6)y-OH (x=an integer of 1 to 4, y=an integer of 1 to 3).
    Type: Application
    Filed: June 19, 2017
    Publication date: August 29, 2019
    Applicant: C. Uyemura & Co., Ltd.
    Inventors: Yoshikazu SAIJO, Hisamitsu YAMAMOTO, Nobuhiko NAKA
  • Patent number: 10138558
    Abstract: The ampholytic surfactants show the nature of anionic surfactants in an alkaline region and the nature of cationic surfactants in an acidic region. As described below, the pretreatment solution of the present invention may preferably indicate alkalinity of pH 8.5 or higher, and therefore, it exhibits the nature of cationic surfactants by the use of ampholytic surfactants. As the ampholytic surfactants, those disclosed in JP 2011-228517 A can be used.
    Type: Grant
    Filed: January 25, 2016
    Date of Patent: November 27, 2018
    Assignee: C. UYEMURA & CO., LTD.
    Inventors: Yoshikazu Saijo, Hisamitsu Yamamoto, Tetsuji Ishida, Takuya Komeda, Masayuki Utsumi
  • Publication number: 20180133760
    Abstract: An ultrasonic treatment apparatus including: an ultrasonic bath for performing an ultrasonic treatment on a treatment target object; a first ultrasonic vibrator provided on the front surface side of the treatment target object; and a second ultrasonic vibrator provided on the back surface side of the treatment target object; wherein the first ultrasonic vibrator does not face the second ultrasonic vibrator.
    Type: Application
    Filed: November 1, 2017
    Publication date: May 17, 2018
    Inventors: Hisamitsu YAMAMOTO, Masayuki UTSUMI, Yoshikazu SAIJO, Tomoji OKUDA, Yutaka NISHINAKA, Yoshinori NAKANISHI
  • Publication number: 20180023197
    Abstract: The ampholytic surfactants show the nature of anionic surfactants in an alkaline region and the nature of cationic surfactants in an acidic region. As described below, the pretreatment solution of the present invention may preferably indicate alkalinity of pH 8.5 or higher, and therefore, it exhibits the nature of cationic surfactants by the use of ampholytic surfactants. As the ampholytic surfactants, those disclosed in JP 2011-228517 A can be used.
    Type: Application
    Filed: January 25, 2016
    Publication date: January 25, 2018
    Applicant: C. Uyemura & Co., Ltd.
    Inventors: Yoshikazu SAIJO, Hisamitsu YAMAMOTO, Tetsuji ISHIDA, Takuya KOMEDA, Masayuki UTSUMI
  • Patent number: 9374913
    Abstract: A pretreatment agent for electroless plating is provided, which includes: a fluorine compound; a surfactant; and at least one solvent selected from ethylene-based glycol butyl ethers of formula: C4H9—(OC2H4)m—OH where m is an integer of 1 to 4, and propylene-based glycol butyl ethers of formula: C4H9—(OC3H6)n—OH where n is an integer of 1 to 4. Also provided are a method for pretreating a substrate to be used for a printed wiring board, and a process for producing a printed wiring board, both of which include using a pretreatment agent for electroless plating as described above.
    Type: Grant
    Filed: September 5, 2014
    Date of Patent: June 21, 2016
    Assignee: C. UYEMURA & CO., LTD.
    Inventors: Yoshikazu Saijo, Hisamitsu Yamamoto, Masayuki Utsumi, Takuya Okamachi, Takuya Komeda
  • Patent number: 9045836
    Abstract: The regeneration unit includes a tubular portion having the inner circumferential surface functioning as an anode, and a cathode provided inside the tubular portion and extending along the extension direction of the tubular portion in a state of separation from the inner circumferential surface. The treatment liquid used for desmearing treatment is fed through a gap between the inner circumferential surface of the tubular portion and the cathode. A feed-side conduit is connected by a downstream end portion thereof to the tubular portion and guides the treatment liquid discharged from a desmearing treatment tank into a regeneration unit. A return-side conduit is connected by an upstream end portion thereof to the tubular portion and guides the treatment liquid discharged from the regeneration unit into the desmearing treatment tank.
    Type: Grant
    Filed: August 26, 2011
    Date of Patent: June 2, 2015
    Assignee: C. Uyemura & Co., Ltd.
    Inventors: Yoshikazu Saijo, Hisamitsu Yamamoto, Takahiro Ishizaki
  • Publication number: 20150072070
    Abstract: A pretreatment agent for electroless plating is provided, which includes: a fluorine compound; a surfactant; and at least one solvent selected from ethylene-based glycol butyl ethers of formula: C4H9—(OC2H4)m—OH where m is an integer of 1 to 4, and propylene-based glycol butyl ethers of formula: C4H9—(OC3H6)n—OH where n is an integer of 1 to 4. Also provided are a method for pretreating a substrate to be used for a printed wiring board, and a process for producing a printed wiring board, both of which include using a pretreatment agent for electroless plating as described above.
    Type: Application
    Filed: September 5, 2014
    Publication date: March 12, 2015
    Inventors: Yoshikazu SAIJO, Hisamitsu YAMAMOTO, Masayuki UTSUMI, Takuya OKAMACHI, Takuya KOMEDA
  • Publication number: 20140339463
    Abstract: The present invention provides a desmear solution and a desmear method using said desmear solution, the desmear solution being capable of certainly removing a smear inside a non-through hole formed in a resin substrate and also capable of forming a plating film excellent in adhesion without excessive roughening of a surface of the resin substrate. The present invention uses the desmear solution containing a permanganate having a concentration of 0.2 to 0.4 mol/L and an alkali metal hydroxide and having a molar concentration ratio of said permanganate to said alkali metal hydroxide of 1:5 to 1:20.
    Type: Application
    Filed: September 11, 2012
    Publication date: November 20, 2014
    Applicant: C. UYEMURA & CO., LTD.
    Inventors: Yoshikazu Saijo, Hisamitsu Yamamoto, Masayuki Utsumi
  • Patent number: 8877020
    Abstract: An anode pipe includes a main pipe portion and a secondary pipe portion. The anode pipe has an inner circumferential surface that functions as an anode. The main pipe portion has a first connection end portion and a second connection end portion. The main pipe portion forms a flow channel for a treatment liquid that continues from the first connection end portion to the second connection end portion. The secondary pipe portion extends in a tubular fashion from the intermediate section of the main pipe portion. The interior of the secondary pipe portion communicates with the flow channel inside the main pipe portion. The cathode is disposed at a distance from the inner circumferential surface of the anode pipe. The cathode extends from a cathode attachment end portion toward the main pipe portion inside the secondary pipe portion.
    Type: Grant
    Filed: May 23, 2012
    Date of Patent: November 4, 2014
    Assignee: C. Uyemura & Co., Ltd.
    Inventors: Hisamitsu Yamamoto, Masayuki Utsumi, Yoshikazu Saijo, Tomoji Okuda, Hiroki Omura
  • Publication number: 20120298505
    Abstract: An anode pipe includes a main pipe portion and a secondary pipe portion. The anode pipe has an inner circumferential surface that functions as an anode. The main pipe portion has a first connection end portion and a second connection end portion. The main pipe portion forms a flow channel for a treatment liquid that continues from the first connection end portion to the second connection end portion. The secondary pipe portion extends in a tubular fashion from the intermediate section of the main pipe portion. The interior of the secondary pipe portion communicates with the flow channel inside the main pipe portion. The cathode is disposed at a distance from the inner circumferential surface of the anode pipe. The cathode extends from a cathode attachment end portion toward the main pipe portion inside the secondary pipe portion.
    Type: Application
    Filed: May 23, 2012
    Publication date: November 29, 2012
    Applicant: C. UYEMURA & CO., LTD.
    Inventors: Hisamitsu YAMAMOTO, Masayuki UTSUMI, Yoshikazu SAIJO, Tomoji OKUDA, Hiroki OMURA
  • Publication number: 20120167916
    Abstract: Disclosed is a neutralizing/reducing agent for neutralizing/reducing an oxidizing agent component that is adsorbed and remains on an object to be coated after the object is subjected to a desmear treatment with the oxidizing agent, which comprises a thioamide compound and a non-aromatic thiol compound. The neutralizing/reducing agent does not generate any gas during a neutralization/reduction treatment, and therefore the occurrence of defects caused by the neutralization/reduction on the surface of a through hole or a blind via hole can be prevented. Further, the neutralizing/reducing agent hardly dissolves copper, and therefore the occurrence of haloing can be prevented, and the blistering caused by the etching between an inner layer copper and a resin with the neutralizing/reducing agent can also be prevented.
    Type: Application
    Filed: September 24, 2010
    Publication date: July 5, 2012
    Applicant: C. UYEMURA & CO., LTD.
    Inventors: Yoshikazu Saijo, Hisamitsu Yamamoto, Masayuki Utsumi
  • Publication number: 20120048728
    Abstract: The regeneration unit includes a tubular portion having the inner circumferential surface functioning as an anode, and a cathode provided inside the tubular portion and extending along the extension direction of the tubular portion in a state of separation from the inner circumferential surface. The treatment liquid used for desmearing treatment is fed through a gap between the inner circumferential surface of the tubular portion and the cathode. A feed-side conduit is connected by a downstream end portion thereof to the tubular portion and guides the treatment liquid discharged from a desmearing treatment tank into a regeneration unit. A return-side conduit is connected by an upstream end portion thereof to the tubular portion and guides the treatment liquid discharged from the regeneration unit into the desmearing treatment tank.
    Type: Application
    Filed: August 26, 2011
    Publication date: March 1, 2012
    Applicant: C. UYEMURA & CO., LTD.
    Inventors: Yoshikazu SAIJO, Hisamitsu YAMAMOTO, Takahiro ISHIZAKI
  • Patent number: 7988773
    Abstract: An electroless gold plating bath includes a water-soluble gold compound, a complexing agent, an aldehyde compound, and an amine compound represented by R1—NH—C2H4—NH—R2 or (CH2—NH—C2H4—NH—CH2)n—R4 (wherein R1 to R4 represent —OH, —CH3, —CH2OH, —C2H4OH, —CH2N(CH3)2, —CH2NH(CH2OH), —CH2NH(C2H4OH), —C2H4NH(CH2OH), —C2H4NH(C2H4OH), —CH2N(CH2OH)2, —CH2N(C2H4OH)2, —C2H4N(CH2OH)2 or —C2H4N(C2H4OH)2, and n is an integer of 1 to 4). The electroless gold plating can be carried out without corrosion of an underlying metal to be plated at a stable deposition rate. Because of the high deposition rate and the immersion and reduction types, thickening of a plated coating is possible in one solution and the color of the coating is not degraded to provide a good appearance while keeping a lemon yellow color inherent to gold.
    Type: Grant
    Filed: December 5, 2007
    Date of Patent: August 2, 2011
    Assignee: C. Uyemura & Co., Ltd.
    Inventors: Masayuki Kiso, Yoshikazu Saijo, Tohru Kamitamari
  • Patent number: 7985285
    Abstract: An electroless gold plating bath includes a water-soluble gold compound, a complexing agent, a formaldehyde metabisulfite adduct, and an amine compound represented by R1—NH—C2H4—NH—R2 or (CH2—NH—C2H4—NH—CH2)n—R4 (wherein R1 to R4 represent —OH, —CH3, —CH2OH, —C2H4OH, —CH2N(CH3)2, —CH2NH(CH2OH), —CH2NH(C2H4OH), —C2H4NH(CH2OH), —C2H4NH(C2H4OH), —CH2N(CH2OH)2, —CH2N(C2H4OH)2, —C2H4N(CH2OH)2 or —C2H4N(C2H4OH)2, and n is an integer of 1 to 4). A gold plated coating of a good appearance can be formed without causing a failure in appearance owing to the progress of intergranular corrosion in a nickel surface.
    Type: Grant
    Filed: December 5, 2007
    Date of Patent: July 26, 2011
    Assignee: C. Uyemura & Co., Ltd.
    Inventors: Masayuki Kiso, Yukinori Oda, Seigo Kurosaka, Tohru Kamitamari, Yoshikazu Saijo, Katsuhisa Tanabe
  • Publication number: 20080138506
    Abstract: An electroless gold plating bath includes a water-soluble gold compound, a complexing agent, a formaldehyde metabisulfite adduct, and an amine compound represented by R1—NH—C2H4—NH—R2 or (CH2—NH—C2H4—NH—CH2)n—R4 (wherein R1 to R4 represent —OH, —CH3, —CH2OH, —C2H4OH, —CH2N(CH3)2, —CH2NH(CH2OH), —CH2NH(C2H4OH), —C2H4NH(CH2OH), —C2H4NH(C2H4OH), —CH2N(CH2OH)2, —CH2N(C2H4OH)2, —C2H4N(CH2OH)2 or —C2H4N(C2H4OH)2, and n is an integer of 1 to 4). A gold plated coating of a good appearance can be formed without causing a failure in appearance owing to the progress of intergranular corrosion in a nickel surface.
    Type: Application
    Filed: December 5, 2007
    Publication date: June 12, 2008
    Inventors: Masayuki Kiso, Yukinori Oda, Seigo Kurosaka, Tohru Kamitamari, Yoshikazu Saijo, Katsuhisa Tanabe
  • Publication number: 20080138507
    Abstract: An electroless gold plating bath includes a water-soluble gold compound, a completing agent, an aldehyde compound, and an amine compound represented by R1—NH—C2H4—NH—R2 or (CH2—NH—C2H4—NH—CH2)n—R4 (wherein R1 to R4 represent —OH, —CH3, —CH2OH, —C2H4OH, —CH2N(CH3)2, —CH2NH(CH2OH), CH2NH(C2H4OH), —C2H4NH(CH2OH), —C2H4NH(C2H4OH), —CH2N(CH2OH)2, —CH2N(C2H4OH)2, —C2H4N(CH2OH)2 or —C2H4N(C2H4OH)2, and n is an integer of 1 to 4). The electroless gold plating can be carried out without corrosion of an underlying metal to be plated at a stable deposition rate. Because of the high deposition rate and the immersion and reduction types, thickening of a plated coating is possible in one solution and the color of the coating is not degraded to provide a good appearance while keeping a lemon yellow color inherent to gold.
    Type: Application
    Filed: December 5, 2007
    Publication date: June 12, 2008
    Inventors: Masayuki Kiso, Yoshikazu Saijo, Tohru Kamitamari