Patents by Inventor Yoshikazu Suzuki
Yoshikazu Suzuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12213788Abstract: Provided are a seat system and a computer program product by which an occupant seated on a seat can grasp his/her own reflexes or the like. The seat system includes a seat which includes a seat body, and a sensor configured to acquire information for use in detecting motion of an occupant seated on the seat body, and a terminal configured to acquire the information from the sensor. The terminal outputs an instruction to prompt the occupant to make a predetermined motion, makes a determination based on the information acquired from the sensor as to whether or not the occupant has made the predetermined motion, and notifies the occupant of a response time elapsed between outputting the instruction and making the predetermined motion, and/or a performance level evaluated based on the response time.Type: GrantFiled: January 14, 2020Date of Patent: February 4, 2025Assignee: TS TECH CO., LTD.Inventors: Hiroyuki Kaku, Takako Miyoshi, Ryosuke Sato, Yoshikazu Ito, Satoshi Suzuki, Munetaka Kowa
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Publication number: 20250025986Abstract: A grinding method of a wafer having a circular disc shape includes a first grinding step of forming a ring-shaped reinforcing part by lowering a grinding wheel relative to a chuck table to bring the grinding wheel close to the wafer and grinding the wafer, a second grinding step of grinding the inner circumferential side surface of the ring-shaped reinforcing part by moving the grinding wheel relative to the wafer toward the outside of the wafer in the radial direction, a first separation step of separating the grinding wheel from the inner circumferential side surface of the ring-shaped reinforcing part by moving the grinding wheel relative to the wafer toward the inside of the wafer in the radial direction and a second separation step of separating the grinding wheel from the top surface of a thin plate part by raising the grinding wheel relative to the chuck table.Type: ApplicationFiled: July 2, 2024Publication date: January 23, 2025Inventor: Yoshikazu SUZUKI
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Patent number: 12103999Abstract: The present invention relates to provision of a photosensitive resin composition containing (A) a photopolymerizable compound having an ethylenically unsaturated group and an acidic substituent, and (B) a photopolymerization initiator, wherein at least one of the components contained in the photosensitive resin composition is a component including a dicyclopentadiene structure; a photosensitive resin film using the foregoing photosensitive resin composition; a printed wiring board and a method for producing the same; and a semiconductor package.Type: GrantFiled: May 25, 2020Date of Patent: October 1, 2024Assignee: RESONAC CORPORATIONInventors: Akihiro Nakamura, Yuji Takase, Hayato Sawamoto, Yoshikazu Suzuki, Shuji Nomoto, Shota Okade
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Publication number: 20240300371Abstract: A method of charging an electrified vehicle using charging equipment that is configured to automatically charge an electrified vehicle includes user authentication to be performed through communication between the charging equipment and a user terminal linked to the electrified vehicle, and when the user authentication is successful and the charging equipment becomes capable of charging the electrified vehicle, notifying the user terminal that the electrified vehicle can be charged.Type: ApplicationFiled: December 20, 2023Publication date: September 12, 2024Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Keiji KAITA, Yoshikazu Suzuki, Hirotaka Omisha, Takahiko Hirasawa
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Patent number: 12064847Abstract: There is provided a processing method of grinding a workpiece. The processing method includes a holding step of holding the workpiece on a side of its front surface on a chuck table, a coarse grinding step of grinding the workpiece on a side of its back surface with first grinding stones until the workpiece has a predetermined thickness, an auxiliary grinding step of grinding the workpiece on the side of its back surface with the first grinding stones such that an unground region remains at an outer peripheral portion of the workpiece, an unground region grinding step of grinding the unground region with second grinding stones having an average abrasive grain size smaller than that of the first grinding stones, and a finish grinding step of grinding the workpiece on the side of its back surface with the second grinding stones until the workpiece has a predetermined finish thickness.Type: GrantFiled: March 24, 2022Date of Patent: August 20, 2024Assignee: DISCO CORPORATIONInventor: Yoshikazu Suzuki
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Publication number: 20240227109Abstract: A workpiece grinding method includes a first grinding step of grinding a part of a back surface corresponding to a device region of a workpiece using a first grinding wheel to form a first circular recess and an annular projecting part in the back surface, and a second grinding step of grinding at least a bottom surface of the first circular recess using a second grinding wheel including a grindstone having a particle diameter smaller than that of the first grinding wheel. In the first grinding step, the bottom surface of the first circular recess is ground into a concentrical shape differing in thickness in a radial direction from a center to a circumference of the first circular recess. In the second grinding step, the bottom surface of the first circular recess is ground to have a uniform thickness, thereby forming a second circular recess.Type: ApplicationFiled: December 18, 2023Publication date: July 11, 2024Inventor: Yoshikazu SUZUKI
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Patent number: 12030157Abstract: A workpiece surface is polished by a polishing pad surface by keeping a point on an outer circumferential edge of the workpiece surface at predetermined coordinates, i.e., first coordinates, in a plane parallel to the workpiece surface but out of contact with the polishing pad surface, and keeping a point on the outer circumferential edge of the polishing pad surface at other coordinates, i.e., third coordinates, in the coordinate plane in contact with an outer circumferential edge of the workpiece surface. In this manner, the workpiece surface is polished in its entirety, and a region of the polishing pad surface in the vicinity of the outer circumferential edge thereof can be worn to the same degree as a region that is located inwardly of the above region. The polishing pad surface is thus prevented from developing a stepped profile due to the polishing of the workpiece surface.Type: GrantFiled: April 5, 2022Date of Patent: July 9, 2024Assignee: DISCO CORPORATIONInventor: Yoshikazu Suzuki
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Patent number: 11980993Abstract: A method of grinding a workpiece includes a first grinding step of adjusting the relative tilt of a chuck table and a grinding wheel to a first state and bringing grindstones into abrasive contact with the workpiece to grind the workpiece, and a second grinding step of adjusting the relative tilt of the chuck table and the grinding wheel to a second state that is different from the first state and bringing the grindstones into abrasive contact with the workpiece to grind the workpiece. In the second grinding step, the workpiece is ground under a condition for causing the workpiece to have a smaller surface roughness than that in the first grinding step.Type: GrantFiled: March 24, 2022Date of Patent: May 14, 2024Assignee: DISCO CORPORATIONInventor: Yoshikazu Suzuki
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Patent number: 11958101Abstract: A method for manufacturing a forged article, capable of improving the durability of a die for forging is provided. The method, includes forging a steel material, by using a die, by spraying or applying a water-soluble polymer lubricant containing 0.01 to 0.98 mass % of a water-soluble sulfate onto a working surface of the die, the die being made of a raw material having a constituent composition of by mass %, of 0.4 to 0.7% of C, 1.0% or less of Si, 1.0% or less of Mn, 4.0 to 6.0% of Cr, 2.0 to 4.0% of (Mo+½W), 0.5 to 2.5% of (V+Nb), 0 to 1.0% of Ni, 0 to 5.0% of Co, 0.02% or less of N, and a remnant composed of Fe and impurities, and having hardness of 55 to 60 HRC, and the die including a nitrided layer or a nitrosulfidized layer on the working surface thereof.Type: GrantFiled: May 16, 2019Date of Patent: April 16, 2024Assignees: PROTERIAL, LTD., TOYOTA JIDOSHA KABUSHIKI KAISHA, DAIDO CHEMICAL CO., LTD., UMETOKU CO., LTDInventors: Tatsuya Shouji, Shuho Koseki, Kenichi Inoue, Katsuhiro Obata, Satoshi Murakami, Naoki Hayashi, Yoshikazu Suzuki, Toshifumi Miyamoto, Toru Otomo, Nobuhiro Ikeda, Kousuke Uda, Takashi Ogisu
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Publication number: 20240042575Abstract: A workpiece grinding method includes a rotary-shaft direction grinding step of grinding a back surface of a workpiece by relatively moving a grinding wheel and a chuck table holding a front surface of the workpiece toward each other along an axis of a rotary shaft of the chuck table, the grinding wheel including a plurality of grinding stones that have outer peripheral surfaces defining a circle of a diameter not greater than a radius of the workpiece, and a radially directed grinding step of grinding the back surface of the workpiece by relatively moving the grinding wheel and the chuck table in a radial direction of the chuck table. The radially directed grinding step includes one of or both an inwardly directed grinding step of relatively moving the grinding wheel and the chuck table, and an outwardly directed grinding step of relatively moving the grinding wheel and the chuck table.Type: ApplicationFiled: July 26, 2023Publication date: February 8, 2024Inventors: Keishi SHINTANI, Yoshikazu SUZUKI
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Patent number: 11717927Abstract: A workpiece has a device area and a peripheral area surrounding the device area on a front surface side thereof. A workpiece grinding method includes a groove forming step of performing grinding feed of a grinding unit while a spindle is rotated, and grinding a predetermined area on a back surface side of the workpiece, the predetermined area corresponding to the device area, in a state in which a chuck table holding the workpiece is not rotated, thereby forming a groove on the back surface side, a groove removing step of starting rotation of the chuck table while the spindle is kept rotating, thereby grinding side walls of the groove and removing the groove, and a recess forming step of performing grinding feed of the grinding unit while the spindle and the chuck table are rotated, thereby grinding the predetermined area and forming a recess and a ring-shaped reinforcement part.Type: GrantFiled: April 14, 2022Date of Patent: August 8, 2023Assignee: DISCO CORPORATIONInventor: Yoshikazu Suzuki
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Publication number: 20230234179Abstract: There is provided a grinding method that is applied when a workpiece having a first surface and a second surface is to be ground from the second surface. The grinding method includes a first grinding step of causing first grindstones to come into contact with the workpiece to grind the workpiece and thereby form on the workpiece a circular plate-shaped first thin plate portion and an annular first thick plate portion surrounding the first thin plate portion, and a second grinding step of causing second grindstones to come into contact with the first thick plate portion and the first thin plate portion to grind the workpiece and thereby form on the workpiece a thin circular plate-shaped second thin plate portion that has a larger diameter than the first thin plate portion and an annular second thick plate portion surrounding the second thin plate portion.Type: ApplicationFiled: January 10, 2023Publication date: July 27, 2023Inventors: Yoshikazu SUZUKI, Daisuke TANEMURA
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Patent number: 11649520Abstract: A continuous hot-dip galvanizing apparatus has a vertical annealing furnace, one or more hearth rolls, a hot-dip galvanizing apparatus, an alloying line, and humidified gas supply ports. When the steel sheet having a Si content of 0.2 mass % or more is conveyed inside the annealing furnace, the humidified gas supply ports positioned in a latter part of the soaking zone supply the humidified gas to the soaking zone and the at least one dry gas supply port supplies the dry gas to the soaking zone. When the steel sheet having a Si content of less than 0.2 mass % is conveyed inside the annealing furnace, the plurality of the humidified gas supply ports do not supply the humidified gas to the soaking zone and the at least one dry gas supply port supplies the dry gas to the soaking zone.Type: GrantFiled: August 23, 2022Date of Patent: May 16, 2023Assignee: JFE STEEL CORPORATIONInventors: Gentaro Takeda, Yoichi Makimizu, Yoshikazu Suzuki, Yoshimasa Himei, Hideyuki Takahashi
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Patent number: 11590630Abstract: A workpiece grinding method includes a groove formation step, a groove removal step, and a full surface grinding step. In the groove formation step, the workpiece is ground by performing grinding feed of a grinding unit while rotating a spindle without rotation of a chuck table, so that an arcuate groove is formed with a depth not reaching a finish thickness on a side of a back surface of the workpiece. In the groove removal step, rotation of the chuck table is started with the spindle kept rotating, so that the groove is ground at side walls thereof and is removed from the workpiece. In the full surface grinding step, grinding feed of the grinding unit is performed while the spindle and chuck table are rotated, so that the workpiece is ground in an entirety thereof on the side of the back surface until the workpiece has the finish thickness.Type: GrantFiled: June 15, 2021Date of Patent: February 28, 2023Assignee: DISCO CORPORATIONInventor: Yoshikazu Suzuki
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Publication number: 20230051072Abstract: A dressing ring includes a ring-shaped dressing member for dressing a processing stone. Preferably, the dressing member has an opening in which a workpiece is arranged when the workpiece is ground. Also preferably, the dressing ring further includes a ring-shaped support plate having an upper surface on which the dressing member is fixed. In addition, a grinding method of the workpiece includes the steps of holding the ring-shaped dressing member on a holding surface of a chuck table, holding the workpiece in the opening of the dressing member such that a back surface of the workpiece is located higher than the upper surface of the dressing member, grinding the workpiece by grinding stones of a grinding wheel, and dressing the grinding stones with the dressing member on the holding surface.Type: ApplicationFiled: August 2, 2022Publication date: February 16, 2023Inventors: Yoshikazu SUZUKI, Tomoharu KIHARA
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Patent number: 11535922Abstract: Provided is a method for manufacturing a high-strength galvanized steel sheet. Heating in a first half of oxidizing treatment is performed at a temperature of 400° C. to 750° C. in an atmosphere having a particular O2 concentration and a particular H2O concentration, and heating in a second half of the oxidizing treatment is performed at a temperature of 600° C. to 850° C. in an atmosphere having a particular O2 concentration and a particular H2O concentration. Subsequently, heating in a heating zone for reduction annealing is performed to a temperature of 650° C. to 900° C. at a particular heating rate in an atmosphere having a particular H2 concentration and a particular H2O concentration with the balance being N2 and inevitable impurities, and soaking in a soaking zone for the reduction annealing is performed in an atmosphere having a particular H2 concentration and a particular H2O concentration with the balance being N2 and inevitable impurities.Type: GrantFiled: September 14, 2017Date of Patent: December 27, 2022Assignee: JFE Steel CorporationInventors: Yoichi Makimizu, Gentaro Takeda, Hiroshi Hasegawa, Yoshimasa Himei, Yoshikazu Suzuki
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Publication number: 20220403480Abstract: A continuous hot-dip galvanizing apparatus has a vertical annealing furnace, one or more hearth rolls, a hot-dip galvanizing apparatus, an alloying line, and humidified gas supply ports. When the steel sheet having a Si content of 0.2 mass % or more is conveyed inside the annealing furnace, the humidified gas supply ports positioned in a latter part of the soaking zone supply the humidified gas to the soaking zone and the at least one dry gas supply port supplies the dry gas to the soaking zone. When the steel sheet having a Si content of less than 0.2 mass % is conveyed inside the annealing furnace, the plurality of the humidified gas supply ports do not supply the humidified gas to the soaking zone and the at least one dry gas supply port supplies the dry gas to the soaking zone.Type: ApplicationFiled: August 23, 2022Publication date: December 22, 2022Applicant: JFE STEEL CORPORATIONInventors: Gentaro TAKEDA, Yoichi MAKIMIZU, Yoshikazu SUZUKI, Yoshimasa HIMEI, Hideyuki TAKAHASHI
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Publication number: 20220362900Abstract: A workpiece has a device area and a peripheral area surrounding the device area on a front surface side thereof. A workpiece grinding method includes a groove forming step of performing grinding feed of a grinding unit while a spindle is rotated, and grinding a predetermined area on a back surface side of the workpiece, the predetermined area corresponding to the device area, in a state in which a chuck table holding the workpiece is not rotated, thereby forming a groove on the back surface side, a groove removing step of starting rotation of the chuck table while the spindle is kept rotating, thereby grinding side walls of the groove and removing the groove, and a recess forming step of performing grinding feed of the grinding unit while the spindle and the chuck table are rotated, thereby grinding the predetermined area and forming a recess and a ring-shaped reinforcement part.Type: ApplicationFiled: April 14, 2022Publication date: November 17, 2022Inventor: Yoshikazu SUZUKI
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Publication number: 20220344163Abstract: A grinding method of grinding a first surface side of a wafer having an oxide film on the first surface includes a first grinding step of putting a grinding unit into grinding feeding while rotating a grinding wheel, rotating a chuck table holding under suction a second surface side at a first rotating speed, thereby causing lower surfaces of grindstones to break through the oxide film, then scraping off the oxide film by side surfaces of the grindstones, and forming a step in a circumferential direction of the wafer, a grinding unit raising step of spacing the grindstones from the wafer, and a second grinding step of putting the grinding unit into grinding feeding while rotating the grinding wheel to grind the wafer, in a state in which the chuck table holding under suction a second surface is rotated at a second rotating speed higher than the first rotating speed.Type: ApplicationFiled: April 6, 2022Publication date: October 27, 2022Inventor: Yoshikazu SUZUKI
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Publication number: 20220339753Abstract: A workpiece surface is polished by a polishing pad surface by keeping a point on an outer circumferential edge of the workpiece surface at predetermined coordinates, i.e., first coordinates, in a plane parallel to the workpiece surface but out of contact with the polishing pad surface, and keeping a point on the outer circumferential edge of the polishing pad surface at other coordinates, i.e., third coordinates, in the coordinate plane in contact with an outer circumferential edge of the workpiece surface. In this manner, the workpiece surface is polished in its entirety, and a region of the polishing pad surface in the vicinity of the outer circumferential edge thereof can be worn to the same degree as a region that is located inwardly of the above region. The polishing pad surface is thus prevented from developing a stepped profile due to the polishing of the workpiece surface.Type: ApplicationFiled: April 5, 2022Publication date: October 27, 2022Inventor: Yoshikazu SUZUKI