Abstract: A threading device for a sewing machine lower looper is disclosed that can thread a lower looper safely and reliably by reliably preventing a main shaft from rotating when an operation of threading the lower looper is carried out.

Abstract: A power module configured to arrange a first electrode on a surface of which a first switching device is bonded, a second electrode on a surface of which a second switching device is bonded, and a third electrode by stacking the first electrode, the first switching device, the second electrode, the second switching device, and the third electrode in this order from the bottom in a stacking direction, characterized by first through third electrode pieces each connected to the first through third electrodes, first and second signal lines each connected to the first and second switching devices, wherein the first through third electrode pieces and the first and second signal lines are provided extending outward in the same plane as the second electrode.

Abstract: A brazing sheet for flux-free brazing, comprising a core material, a brazing material disposed on at least one surface of the core material, and a thin skin material disposed on the brazing material, wherein the core material is made of an aluminum alloy having a higher melting point than that of the brazing material; the brazing material is made of an Al—Si—Mg based alloy and has a thickness of 25 to 250 ?m; the thin skin material is made of an aluminum alloy having a higher melting initiation temperature than the brazing material and containing substantially no Mg, and has a thickness of 5 to 30 ?m; and a content of an oxide existing at an interface between the brazing material and the thin skin material is 0.1 ppm or less in weight ratio with respect to the entire clad material. The present invention provides a brazing sheet for flux-free brazing, which has a thin skin material, with uniform brazing characteristics, and enables stable joining.

Abstract: A semiconductor module which includes a semiconductor device; a wiring member that is connected to the semiconductor device; a cooling plate that includes a first surface on a side of the semiconductor device and a second surface on a side opposite to the first surface and has a fastening portion at an end thereof in a first direction; and a molded portion that is formed by molding a resin on the semiconductor device, the wiring member and the cooling plate, wherein the fastening portion is exposed out of the molded portion, and a terminal portion of the wiring member is exposed out of the molded portion such that the terminal portion of the wiring member extends in a second direction which is substantially perpendicular to the first direction.

Abstract: A power module configured to arrange a first electrode on a surface of which a first switching device is bonded, a second electrode on a surface of which a second switching device is bonded, and a third electrode by stacking the first electrode, the first switching device, the second electrode, the second switching device, and the third electrode in this order from the bottom in a stacking direction, characterized by first through third electrode pieces each connected to the first through third electrodes, first and second signal lines each connected to the first and second switching devices, wherein the first through third electrode pieces and the first and second signal lines are provided extending outward in the same plane as the second electrode.

Abstract: [Problem] In a system for transmitting content data from a content reproducing apparatus to a content output apparatus, no complicated signal processing is required, setting change operations can be simplified, and the degradation of sound quality and the degradation of picture quality of video data are prevented.

Abstract: A semiconductor module having an integrated structure is manufactured by mounting a semiconductor chip on the side of a surface of a cooling plate via an insulating material, and by molding the semiconductor chip and the cooling plate by a resin-molded member. This method includes the steps of: (a) forming a sprayed insulating film as the insulating material on a surface of the cooling plate; (b) forming a sprayed conductive film on a face of the sprayed insulating film opposite to a face where the cooling plate is provided; (c) checking whether the sprayed conductive film is insulated from the cooling plate by using the sprayed conductive film and the cooling plate as electrodes and applying voltage therebetween; and (d) mounting the semiconductor chip on the upper side of the sprayed conductive film when the sprayed conductive film is insulated, and then resin-molding the semiconductor chip and the cooling plate.

Abstract: A threading device for a sewing machine lower looper is disclosed that can thread a lower looper safely and reliably by reliably preventing a main shaft from rotating when an operation of threading the lower looper is carried out

Abstract: A semiconductor module which includes a semiconductor device; a wiring member that is connected to the semiconductor device; a cooling plate that includes a first surface on a side of the semiconductor device and a second surface on a side opposite to the first surface and has a fastening portion at an end thereof in a first direction; and a molded portion that is formed by molding a resin on the semiconductor device, the wiring member and the cooling plate, wherein the fastening portion is exposed out of the molded portion, and a terminal portion of the wiring member is exposed out of the molded portion such that the terminal portion of the wiring member extends in a second direction which is substantially perpendicular to the first direction.

Abstract: A semiconductor module includes a semiconductor device; a metal plate portion that includes a first surface on a side of the semiconductor device and has a fastening portion at an end thereof; a molded portion that is formed by molding a resin on the semiconductor device and the metal plate portion, a cooling plate portion that is a separate member from the metal plate portion, is provided on a side opposite to the first surface on the side of the semiconductor device, and includes fins on a side opposite to the side of the metal plate portion; wherein the fastening portion of the metal plate portion is exposed out of the molded portion, and the cooling plate portion includes a fastening portion at a position that corresponds to a position of the fastening portion of the metal plate portion.

Abstract: A power module is disclosed that includes a semiconductor element, a first cooling member and a second cooling member configured to sandwich the semiconductor element therebetween, a frame member configured to support the semiconductor element between the first cooling member and the second cooling member and molded resin disposed between the first cooling member and the second cooling member, wherein the frame member includes an adjusting member which adjusts a distance between the first cooling member and the second cooling member.

Abstract: An aluminum alloy sheet for a lithographic printing plate which has excellent ink stain resistance, with a local defect in a photosensitive layer after long-term storage being hard to occur, and excellent the pit uniformity after a roughening and a manufacturing method thereof are provided. An aluminum alloy sheet for a lithographic printing plate containing a predetermined content of Fe, Si, Cu and Ti as well as one type or more selected from B and C, and composed of remaining Al and inevitable impurities, in which a concentration of an aluminum carbide present in the aluminum alloy sheet is not more than 8 ppm, an area occupancy of aggregation substances present on the aluminum alloy sheet surface after the roughening treatment with respect to an arbitrary circle with a radius 5 ?m in the aluminum alloy sheet surface is less than 10%. In a case where the area occupancy is not less than 10%, the aggregation substances are present at a rate of 1 to 2 pieces/50 cm2.

Abstract: The present invention provides a threader of a sewing machine in which the entire head portion can be made compact and the operator can perform threading work with one hand. The threader comprises: a threading shaft approaching a needle bar for moving a supporting sewing needle vertically; a threading hook for moving a hook portion in and out of a needle hole; a positioning member for regulating a lowermost position of the threading shaft to a position where the height of the hook portion matches that of the needle hole; a first rotary mechanism for rotating by a predetermined angle near the lowermost point of the threading shaft so that the hook portion is inserted into the needle hole of the sewing needle; and a thread-guiding member for guiding the top thread to the hook portion at a near lowermost point of the threading shaft.

Abstract: A semiconductor module having an integrated structure is manufactured by mounting a semiconductor chip on the side of a surface of a cooling plate via an insulating material, and by molding the semiconductor chip and the cooling plate by a resin-molded member. This method includes the steps of: (a) forming a sprayed insulating film as the insulating material on a surface of the cooling plate; (b) forming a sprayed conductive film on a face of the sprayed insulating film opposite to a face where the cooling plate is provided; (c) checking whether the sprayed conductive film is insulated from the cooling plate by using the sprayed conductive film and the cooling plate as electrodes and applying voltage therebetween; and (d) mounting the semiconductor chip on the upper side of the sprayed conductive film when the sprayed conductive film is insulated, and then resin-molding the semiconductor chip and the cooling plate.

Abstract: In a method for producing a molded article having a resin part, the resin part is injection-molded to an opening of a main body part and the molded article has an excellent air-tightness between the resin part and the main body part. A foam sealant is attached to a peripheral portion around the opening of the main body part. Attached to the main body part is a retainer made of the same kind of resin as injected resin and adapted to keep the foam sealant compressed in its thickness direction. The main body part is placed within a mold so that the retainer is exposed inside a cavity of the mold. A molten resin is injected into the cavity of the mold. The injected resin and the retainer are integrated into the resin part.

Abstract: A case with a connector integrally formed with a resin connector, and can be manufactured with a small number of processes is provided. The connector case includes a housing, a resin connector, and a ground terminal extending along an outer periphery of the connector. A terminal-side fixing portion extending backward from the ground terminal is crimped to or pressed over a housing-side fixing portion. When molds are closed after the housing and the ground terminal are placed in the molds for injection molding of the resin connector, a pressing portion formed on the mold presses the terminal-side fixing portion against the housing-side fixing portion to crimp or press the terminal-side fixing portion to or over the housing-side fixing portion. As a result, in the process for the injection molding of the connector, the ground terminal is fixed to the housing at the same time. The connector case with the ground terminal fixed to the housing can be manufactured in a small number of processes.

Abstract: To measure a receptor-mediated increase in intracellular calcium concentration, use is made of a calcium-responding luminescent protein localized in the cytoplasm or mitochondria and a reporter gene having a promoter responding to the second messenger in cells and Renilla-origin luciferase attached to the downstream thereof. By using a coelenterazine derivative, which can exist in the cells in a stable state over a long time, as the substrate of these proteins, a transient increase in the intracellular calcium concentration observed within several seconds is measured by using the calcium-responding luminescent protein. Subsequently, the cells are allowed to survive and cultured for several hours as such without adding a fresh substrate. During this period, an increase/decrease in the gene expression is continuously monitored by the reporter assay method and it is measured and evaluated, if necessary, whether or not the inhibition of the activity is caused by cytotoxicity.

Abstract: The present invention provides a bobbin thread feeder of sewing machine of simple structure in which a lower thread can be reliably fed at an appropriate tension. A lower thread bobbin 21 can be removably contained through an opening for containing a lower thread bobbin 17 in a rotary hook 20 of a horizontal rotary hook 30 provided in a sewing machine frame. A thread tension plate and a thread tension spring are attached while overlapping along the inner circumference of the rotary hook 20, and function as a tension generating portion 22 for imparting resistance to pulling out a lower thread being guided through the gap between the thread tension plate and the thread tension spring. A needle plate 16 with an opening for taking the lower thread bobbin 21 in and out is provided above the rotary hook 20. The needle plate 16 comprises a guiding slit 27 that guides the lower thread formed thereon.

Abstract: The present invention provides a threader of a sewing machine in which the entire head portion can be made compact and the operator can perform threading work with one hand. The threader comprises: a threading shaft approaching a needle bar for moving a supporting sewing needle vertically; a threading hook for moving a hook portion in and out of a needle hole; a positioning member for regulating a lowermost position of the threading shaft to a position where the height of the hook portion matches that of the needle hole; a first rotary mechanism for rotating by a predetermined angle near the lowermost point of the threading shaft so that the hook portion is inserted into the needle hole of the sewing needle; and a thread-guiding member for guiding the top thread to the hook portion at a near lowermost point of the threading shaft.

Abstract: The invention provides a method for producing a hot-dip plated metal strip comprising the steps of: annealing a metal strip; imparting plastic strain to the metal strip; drawing the metal strip into a molten metal bath for plating; drawing up the metal strip out of the molten metal bath without contacting the molten metal with a roll in the molten metal bath after turning around the metal strip upward with adhering the molten metal on the metal strip; and controlling the coating weight of the molten metal adhered on the metal strip with a wiper. According to the method of the invention, a hot-dip plated metal strip can be produced, in which buckling does not occur, lateral evenness of coating weight is excellent, and dross defects are few.