Abstract: A semiconductor module includes: a first substrate having a main surface; a second substrate having flexibility and including a connection portion connected to the first substrate and an interstice formation portion overlapping with the first substrate in a plan view of the main surface seen in a direction perpendicular to the main surface and forming an interstice between the second substrate and the first substrate; a first semiconductor chip provided in the interstice at least partially; and a second semiconductor chip provided at an opposite side of the second substrate from an interstice side, the second substrate has a first conductive layer supplied with a reference potential, and in the plan view, at least part of the first conductive layer overlaps with the first semiconductor chip and the second semiconductor chip.

Abstract: A curable resin composition includes 10 wt % to 70 wt % of at least one moisture curable resin, 10 wt % to 50 wt % of a plasticizer having a Brookfield viscosity of less than 25 cP at 23° C., and 0.1 wt % to 5 wt % of a non-tin catalyst. A method for producing a curable resin composition includes mixing 10 wt % to 70 wt % of at least one moisture curable resin, 10 wt % to 50 wt % of a plasticizer, and 0.1 wt % to 5 wt % of a non-tin catalyst.

Abstract: Provided is a curable composition excellent in curability and mechanical properties as well as a cured product thereof. Specially provided is a curable composition containing a vinyl-based polymer (I) having one or more crosslinkable functional groups at a terminus on average and a nucleophilic agent (II) and a cured product obtained by curing the curable composition. Preferably, the curable composition of the invention further contains an epoxy resin (III).

Abstract: An object of the present invention is to provide an active-energy-curable composition having an appropriate adhesive property onto a substrate and an excellent curability, and a cured product thereof. The object is solved by a curable composition comprising: (a) a vinyl polymer having, in any single molecule thereof, at least one group represented by the following general formula (1) at a molecular terminal thereof: —OC(O)C(R)?CH2 ??(1) wherein R represents hydrogen or an organic group having 1 to 20 carbon atoms; and (b) a vinyl monomer having a phosphate group.

Abstract: Provided is a curable composition excellent in curability and mechanical properties as well as a cured product thereof. Specially provided is a curable composition containing a vinyl-based polymer (I) having one or more crosslinkable functional groups at a terminus on average and a nucleophilic agent (II) and a cured product obtained by curing the curable composition. Preferably, the curable composition of the invention further contains an epoxy resin (III).

Abstract: Disclosed is a curable composition having low viscosity, which is capable of forming a cured product that is excellent in heat resistance, weather resistance, oil resistance and the like, while having rubber elasticity. Specifically disclosed is a curable composition for both thermal radical curing and latent thermal curing with epoxy essentially containing the following components (A) and (B). (A) a vinyl-based polymer having two or more groups represented by the general formula (1): —OC(O)C(Ra)?CH2??(1) wherein Ra represents a hydrogen atom or an organic group having 1 to 20 carbon atoms, per molecule, and having one or more groups represented by the above general formula (1) at a molecular terminal; (B) an epoxy compound.

Abstract: Disclosed is a curable composition having excellent curability, which is capable of forming a cured product that is excellent in heat resistance, weather resistance, oil resistance and the like, while having rubber elasticity and high mechanical strength. Specifically disclosed is a curable composition for both photoradical and thermal radical curing essentially containing the following components (A), (B), and (C). (A) a vinyl-based polymer having two or more groups represented by the general formula (1): —OC(O)C(Ra)?CH2??(1) wherein Ra represents a hydrogen atom or an organic group having 1 to 20 carbon atoms, per molecule, and having one or more groups represented by the above general formula (1) at a molecular terminal; (B) a photoradical initiator; and (C) a thermal radical initiator, as essential components.

Abstract: [Problems] Thermoplastic resins have various problems such as enhancement in strength and improvement in toughness and heat resistance and copolymerization with monomers or oligomers and grafting have been carried out to solve the problems. Although graft polymerization with macromonomers has been carried out as a method for solving the problems, it is still expected to develop a modification technique for attaining better performance and resins produced by the technique. [Means for Solving Problems] A thermoplastic resin obtained by addition polymerization of an addition-polymerizable monomer, characterized by being modified by copolymerization with a vinyl polymer (I) which bears at least one group having a polymerizable carbon-carbon double bond at each of at least two molecular ends and which has a weight-average molecular weight (Mw)/number-average molecular weight (Mn) ratio of less than 1.8.

Abstract: The present invention provides: a process for preparing a vinyl polymer containing a halogen in an amount of 1,000 mg or less per kilogram, in which a vinyl polymer containing the halogen produced by atom transfer radical polymerization of a vinyl monomer is heated at a temperature in the range of 140 to 250° C. to dehalogenate the vinyl polymer; a vinyl polymer obtained by the process; and a hydrosilylation-reactive curable composition containing the vinyl polymer.

Abstract: A curable composition having a low viscosity and providing a satisfactory rubber cured article is provided. A composition curable by radical photo curing and cationic photo curing in combination, comprising the under-mentioned components (A), (B), (C) and (D) as essential components: (A) a vinyl polymer having two or more acryloyl group or the like per molecule, the acryloyl groups or the like being present at one or more molecular ends; (B) an epoxy compound and/or an oxetane compound; (C) a radical photopolymerization initiator; and (D) a cationic photopolymerization initiator.

Abstract: An active energy curing type composition for an in-place shaping gasket is provided which is capable of providing an in-place shaped gasket superior in heat resistance, weather resistance, oil resistance, curability, compression set, and the like. An active energy curing type composition for an in-place shaping gasket, comprising the under-mentioned components (A) and (B) as essential components, wherein the viscosity of the composition is 400 Pa·s or less at 23° C. and the compression set of a cured article which is prescribed in JIS K 6262 is 30% or less: (A) a vinyl polymer having two or more (meth)acryloyl groups per molecule at the molecular ends, and (B) a vinyl polymer having one (meth)acryloyl group per molecule at the molecular end.

Abstract: A polymerization process comprising initiating a first polymerization of monomers using an initiator functionalized with an ATRP initiating site, wherein the first polymerization is selected from the group of cationic polymerization, anionic polymerization, conventional free radical polymerization, metathesis, ring opening polymerization, cationic ring opening polymerization, and coordination polymerization to form a macroinitiator comprising an ATRP initiating site and further initiating an ATRP polymerization of radically polymerizable monomers using the macroinitiator comprising an ATRP initiating site. Novel block copolymers may be formed by the disclosed method.

Abstract: An object of the present invention is to provide a novel method for producing a vinyl polymer (P) having a polar functional group (X) and having in its main chain a branched structure. The object can be achieved by the present invention providing a method for producing a vinyl polymer (P) having a polar functional group (X) and having in its main chain a branched structure, wherein while and/or after polymerization of a vinyl polymer (I) having a protecting group (Y) and having at its molecular terminal a group (A) containing carbon-carbon double bond, the protecting group (Y) is converted to the polar functional group (X).

Abstract: Provided is a curable composition for damping materials excellent in heat resistance, oil resistance and damping property, as well as a damping material obtained therefrom. Specially provided is a curable composition for damping materials, containing a vinyl-based polymer (I) having more than one crosslinkable functional groups on average and having at least one of the crosslinkable functional groups at the terminus thereof, and a vinyl-based polymer (II) having one or less crosslinkable functional group on average, wherein the content of the vinyl-based polymer (II) is 50 to 95 parts by weight based on 100 parts by weight of the vinyl-based polymers (I) and (II), as well as a damping material obtained by curing the curable composition.

Abstract: The present invention has its object to provide an acrylic hot-melt pressure-sensitive adhesive composition showing only small changes in melt viscosity, showing good hot-melt applicability and excellent in initial cohesive force prior to moisture curing, and showing excellent tackiness and thermostable cohesive force after moisture curing. The present invention relates to a acrylic block copolymer which comprises an acrylic polymer block (A) and an acrylic polymer block (B) differing in glass transition temperature range and having at least one crosslinkable functional group (X) at its molecular termini; and a reactive hot-melt adhesive composition which comprises the acrylic block copolymer described above.

Abstract: The present invention has for its object to provide a curable composition which, despite its low viscosity, gives a cured product with a high gel fraction, low residual tack, low modulus, high elongation and good flexibility. The present invention relates to a curable composition comprising the following two components: (A) a vinyl polymer having at least one crosslinking silyl group on the average per molecule: and (B) a photocurable substance, (C) an air oxidation-curable substance, (D) a high molecular plasticizer, (E) a reactive plasticizer or (F) a compound having one silanol group in its molecule and/or a compound capable of reacting with moisture to give a compound having one silanol group in the molecule.

Abstract: The present invention has its object to provide a crosslinkable silyl group-terminated vinyl polymer-containing curable composition which secures a sufficiently long pot life and, at the same time, can be cured rapidly on the occasion of need and can give cured products excellent in thermal stability, oil resistance, weathering resistance, mechanical properties and adhesiveness, among others. The present invention provides a curable composition containing (I) and (II) mentioned in the following: a vinyl polymer (I) having, on an average, at least one crosslinkable silyl group at its termini, and a photo acid generator (II). The vinyl polymer (I) according to the present invention is preferably a (meth)acrylic polymer.

Abstract: A first object of the present invention is to provide a vinyl polymer that has a molecular chain into which a structure containing a polar functional group is introduced, and that is useful as a precursor of a graft polymer. A second object of the present invention is to provide a process for producing the vinyl polymer. These objects can be achieved by the present invention providing a vinyl polymer having a polar functional group (X), and further having, at the position of at least one molecular terminal thereof, a group (A) containing a carbon-carbon double bond.

Abstract: The present invention has its object to provide a curable composition, although having low viscosity itself, which gives a cured product, when being cured, which has wide range of elasticity, from hard to soft, which is excellent in weather resistance and heat resistance, and the hardness and brittleness (characteristic to epoxy resins) of which have been improved to have rubber elasticity, and which has high adhesion strength and is transparent. The curable composition of the present invention comprises a vinyl polymer containing at least one crosslinkable silyl group on average and an epoxy resin. When being used for adhering or sealing a transparent material such as glass, polycarbonates, and acrylic resins, the curable composition of the invention is usable for treatment with sufficiently retaining the transparency, which is an aesthetic characteristic.

Abstract: It is an object of the present invention to provide an active energy ray-curable composition excellent in curability, in particular in depth curability, and capable of providing cured products excellent in thermal stability, weather resistance, oil resistance and permanent compression set, among others, as well as a cured product derived therefrom. The present invention relates to an active energy ray-curable composition which comprises the following components (A) and (B) as essential components: (A) A vinyl polymer having at least one terminal group represented by the general formula (1): —OC(O)C(Ra)?CH2??(1) per molecule; (B) At least one acylphosphine oxide photopolymerization initiator represented by the general formula (2): R1R2P(?O)C(?O)R3,??(2) and cured products derived therefrom.