Patents by Inventor Yoshimasa Watanabe

Yoshimasa Watanabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200244201
    Abstract: To provide a controller for an AC rotary machine capable of performing on/off control of the switching device of the set which does not fail, by considering the state of the AC rotary machine related to the windings of the failed set. A controller for an AC rotary machine, about a set in which the switching device failed, stops dq-axis current control, and turns on, in the case of the short circuit failure, and turns off, in the case of the open circuit failure, at least the respective phase switching devices of the positive electrode side or the negative electrode side which is the same side as the failed switching device; and about a set which does not fail, continues dq-axis current control and changes the current component of the d-axis according to the state of the AC rotary machine related to the windings of the failed set.
    Type: Application
    Filed: December 7, 2015
    Publication date: July 30, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventors: Yoshimasa NISHIJIMA, Keiichi ENOKI, Masutaka WATANABE, Yasukazu MURATA, Shingo HARADA
  • Publication number: 20200171652
    Abstract: A hand mechanism grips an object more favorably, regardless of the attitude and surrounding conditions of the object. When an object is to be gripped by a hand mechanism having three or more finger portions, at least one finger portion among the three or more finger portions functions as a state-altering finger portion for altering the attitude or the position of the object while contacting the object, and at least two finger portions among the finger portions other than the finger portion functioning as the state-altering finger portion function as gripping finger portions for gripping the object in a state where the attitude or the position has been altered by the state-altering finger portion.
    Type: Application
    Filed: May 15, 2018
    Publication date: June 4, 2020
    Applicant: THK CO., LTD.
    Inventors: Shinji Kawabata, Yoshimasa Endo, Fumiya Koizumi, Yoshikazu Matsuo, Yuki Nomura, Toshiya Watanabe, Kenji Hidaka
  • Publication number: 20200161135
    Abstract: A method of filling a recess according to one embodiment of the present disclosure comprises heating an amorphous semiconductor film without crystallizing the amorphous semiconductor film by radiating laser light to the amorphous semiconductor film embedded in the recess.
    Type: Application
    Filed: November 21, 2019
    Publication date: May 21, 2020
    Inventors: Satoshi TAKAGI, Yoshimasa WATANABE
  • Publication number: 20200144948
    Abstract: In order to reduce deviation of correction amount when calculating a magnetic pole position correction amount of a permanent magnet type rotating electrical machine, and perform magnetic pole position correction with high accuracy, in state where the permanent magnet type rotating electrical machine is rotated, a d-axis current command value and a q-axis current command value in dg vector control are kept substantially zero, an actual d-axis voltage and an actual q-axis voltage are calculated from a midpoint potential detected from a midpoint potential detection unit, a magnetic pole position correction amount is calculated based on a predetermined arithmetic expression from the actual d-axis voltage and the actual q-axis voltage, and magnetic pole position origin correction is performed based on the magnetic pole position correction amount.
    Type: Application
    Filed: June 6, 2017
    Publication date: May 7, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventors: Yoshimasa NISHIJIMA, Keiichi ENOKI, Masutaka WATANABE, Yasukazu MURATA, Shingo HARADA, Kazuhiko OTSUKA
  • Patent number: 10608569
    Abstract: A control device of an AC rotating electrical machine includes: a midpoint potential detection unit 12 that detects, for respective phases, midpoint potentials 43, 44, 45 of upper switching elements 41 and lower switching elements 42 of an inverter circuit 20; a phase current detection unit 23 that detects a phase current of each phase of an AC rotating electrical machine 3; and a CPU 11 that calculates a current estimated value Idc of DC current that is input from a DC power supply 2 to the inverter circuit 20, on the basis of the detected midpoint potential of each phase and the phase current of each phase.
    Type: Grant
    Filed: August 29, 2017
    Date of Patent: March 31, 2020
    Assignee: Mitsubishi Electric Corporation
    Inventors: Daisuke Matsumuro, Keiichi Enoki, Yoshimasa Nishijima, Masutaka Watanabe, Shingo Harada, Yasukazu Murata
  • Patent number: 10594062
    Abstract: It is aimed to provide a press-fit terminal connection structure in which a board connecting portion of a press-fit terminal is press-fit into a through hole provided in a printed circuit board and which can combine the suppression of scraping of a surface layer and a reduction of a necessary load when the press-fit terminal is inserted into and withdrawn from the through hole and an improvement of a holding force for keeping the press-fit terminal inserted in the through hole. In the press-fit terminal connection structure, the press-fit terminal includes, at least on a surface of the contact point portion, an alloy containing layer mainly containing tin and palladium, and the through hole includes a tin layer on an outermost surface of an inner peripheral surface including at least the contact point portion.
    Type: Grant
    Filed: May 11, 2017
    Date of Patent: March 17, 2020
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Yoshimasa Shirai, Yasushi Saitoh, Kingo Furukawa, Tetsuhiko Kawasaki, Masayuki Ookubo, Hajime Watanabe, Yoshiyasu Tsuchiya, Akihiro Kato
  • Publication number: 20200067443
    Abstract: When the connection between a DC power source and a multigroup-multiphase electric-power conversion apparatus is cut off, a control apparatus controls switching devices so that the respective states of the two or more groups of electric-power conversion apparatuses included in the multigroup-multiphase electric-power conversion apparatus are each switched stepwise from a phase short-circuiting state to an all-phase cutoff state at different timings.
    Type: Application
    Filed: May 17, 2017
    Publication date: February 27, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventors: Masutaka WATANABE, Keiichi ENOKI, Yoshimasa NISHIJIMA, Shingo HARADA
  • Patent number: 10469015
    Abstract: A motor control device having a motor temperature sensor for detecting a magnet temperature of the motor, a magnet magnetic flux calculation section that calculates a magnet magnetic flux of the motor corresponding to the magnet temperature of the motor, a current combination candidate calculating section that calculates a d-q axis current combination candidate that minimizes the input current of the inverter within a voltage limit ellipse determined by a value that can be output by a voltage of a power supply of the motor, and a d-q axis current search section that searches the d-q axis current that minimizes the input current of the inverter within the range of the combination candidate of the d-q axis currents when the d-q axis current of the motor moves on a voltage limiting ellipse by automatic weakening flux control.
    Type: Grant
    Filed: June 22, 2015
    Date of Patent: November 5, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Shingo Harada, Keiichi Enoki, Yasukazu Murata, Masutaka Watanabe, Yoshimasa Nishijima
  • Publication number: 20190301019
    Abstract: There is provided a boron-based film forming method for forming a boron-based film mainly containing boron on a substrate. The method includes steps of loading a substrate into a chamber of a film forming apparatus for forming the boron-based film by plasma CVD using capacitively-coupled plasma, supplying a processing gas containing a boron-containing gas into the chamber, applying a high frequency power for generating the capacitively-coupled plasma and forming the boron-based film on the substrate by generating a plasma of the processing gas by the high frequency power. A film stress of the boron-based film is adjusted by the high frequency power in the applying step.
    Type: Application
    Filed: March 25, 2019
    Publication date: October 3, 2019
    Inventors: Yoshimasa WATANABE, Masahiro OKA, Jinwang LI, Yuuki YAMAMOTO, Hirokazu UEDA
  • Patent number: 10399817
    Abstract: In an elevator car position detection device, a magnetic field generator generates an eddy current magnetic field on an identification member, and a magnetic field detector detects the eddy current magnetic field generated on the identification member. The identification member includes a plurality of conductors which are continuously arranged along an ascending and descending direction of a car, and are relatively different in a plate thickness with respect to a skin depth of an eddy current generated by the magnetic field generator on the identification member. A shape of at least a part of a boundary between the adjacent conductors is a straight line or a curve tilted with respect to a direction orthogonal to the ascending and descending direction of the car.
    Type: Grant
    Filed: March 1, 2013
    Date of Patent: September 3, 2019
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Jin Inoue, Emiko Kurata, Yoshimasa Watanabe, Akihide Shiratsuki, Hiroshi Nishizawa, Hajime Nakajima, Masahiro Ishikawa
  • Patent number: 10404200
    Abstract: An AC-rotating-electric-machine control apparatus includes two or more electric-power conversion circuits that control respective voltages to be applied to the two or more groups of multi-phase armature windings, for each of the two or more groups of multi-phase armature windings; each of the two or more electric-power conversion circuits has two or more switching devices for opening or closing the corresponding group of multi-phase armature windings, for each of the phases; the two or more switching devices are switching-controlled in such a way that opening operation or duty control can be applied to the corresponding group of multi-phase armature windings.
    Type: Grant
    Filed: May 11, 2015
    Date of Patent: September 3, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Masutaka Watanabe, Keiichi Enoki, Yasukazu Murata, Yoshimasa Nishijima, Shingo Harada
  • Patent number: 10388524
    Abstract: There is provided a method of forming a boron film on a substrate on which a semiconductor device is formed, by plasmarizing a reaction gas containing a boron-containing gas under a process atmosphere regulated to a pressure which falls within a range of 0.67 to 33.3 Pa (5 to 250 mTorr). The boron film is formed on a substrate on which a semiconductor device is formed, by plasmarizing a reaction gas containing a boron-containing gas under a process atmosphere regulated to a pressure which falls within a range of 0.67 to 33.3 Pa (5 to 250 mTorr).
    Type: Grant
    Filed: December 6, 2017
    Date of Patent: August 20, 2019
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Hirokazu Ueda, Masahiro Oka, Hiraku Ishikawa, Yoshimasa Watanabe, Syuhei Yonezawa
  • Publication number: 20190244838
    Abstract: A method of forming a boron-based film includes forming the boron-based film mainly containing boron on a substrate by plasma CVD using plasma of a processing gas including a boron-containing gas; and controlling film stress of the formed boron-based film by adjusting a process parameter.
    Type: Application
    Filed: January 31, 2019
    Publication date: August 8, 2019
    Inventors: Yoshimasa WATANABE, Masahiro OKA, Hirokazu UEDA, Yuuki YAMAMOTO
  • Patent number: 10338104
    Abstract: This current detection device is configured from: an annular magnetic material core that forms a closed magnetic path around a pair of conducting wires in which conduction currents flow; an excitation coil wound on the magnetic material core; an oscillation circuit unit that applies a rectangular wave output voltage to the excitation coil; a power supply unit that supplies power to an operation amplifier that generates the rectangular wave output voltage in the oscillation circuit unit; and a difference current calculation unit, which detects a power supply current flowing from the power supply unit to the operation amplifier, and which calculates a difference current between the conduction currents flowing in the pair of conducting wires. Consequently, excellent noise resistance is achieved, and the configuration of the current detection device is simplified.
    Type: Grant
    Filed: April 10, 2015
    Date of Patent: July 2, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Mitsugi Mori, Kota Kashiwamoto, Keita Hamano, Yoshimasa Watanabe
  • Patent number: 10302680
    Abstract: This current detection device is configured from: an annular magnetic material core that forms a closed magnetic path around a pair of conducting wires in which conduction currents flow; an excitation coil wound on the magnetic material core; an oscillation circuit unit that applies a rectangular wave output voltage to the excitation coil; a power supply unit that supplies power to an operation amplifier that generates the rectangular wave output voltage in the oscillation circuit unit; and a difference current calculation unit, which detects a power supply current flowing from the power supply unit to the operation amplifier, and which calculates a difference current between the conduction currents flowing in the pair of conducting wires. Consequently, excellent noise resistance is achieved, and the configuration of the current detection device is simplified.
    Type: Grant
    Filed: April 10, 2015
    Date of Patent: May 28, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Mitsugi Mori, Kota Kashiwamoto, Keita Hamano, Yoshimasa Watanabe
  • Publication number: 20190140376
    Abstract: It is aimed to provide a press-fit terminal connection structure in which a board connecting portion of a press-fit terminal is press-fit into a through hole provided in a printed circuit board and which can combine the suppression of scraping of a surface layer and a reduction of a necessary load when the press-fit terminal is inserted into and withdrawn from the through hole and an improvement of a holding force for keeping the press-fit terminal inserted in the through hole. In the press-fit terminal connection structure, the press-fit terminal includes, at least on a surface of the contact point portion, an alloy containing layer mainly containing tin and palladium, and the through hole includes a tin layer on an outermost surface of an inner peripheral surface including at least the contact point portion.
    Type: Application
    Filed: May 11, 2017
    Publication date: May 9, 2019
    Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Yoshimasa SHIRAI, Yasushi SAITOH, Kingo FURUKAWA, Tetsuhiko KAWASAKI, Masayuki OOKUBO, Hajime WATANABE, Yoshiyasu TSUCHIYA, Akihiro KATO
  • Patent number: 10224682
    Abstract: A coaxial cable includes a coaxial wire in which an inner insulator, an outer conductor and a sheath are sequentially and coaxially provided around a center conductor, and a substrate having a surface on which a first contact pad and a second contact pad are arranged. The sheath is removed at one end portion of the coaxial wire by a predetermined length, so that the inner insulator and the outer conductor are exposed, and a tip end of the inner insulator is removed by a predetermined length, so that the center conductor is exposed. The exposed portion of the center conductor is soldered to the first contact pad with the exposed portion of the inner insulator being bent relative to the sheath, and the exposed portion of the outer conductor is soldered to the second contact pad with being bent in a direction different from the bending direction of the inner insulator. A part of the coaxial wire covered by the sheath is standing at an angle of 30° or greater relative to the surface of the substrate.
    Type: Grant
    Filed: June 16, 2017
    Date of Patent: March 5, 2019
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Yoshimasa Watanabe, Kazuhiro Sato, Hitomi Yoshida
  • Publication number: 20180350598
    Abstract: In a method for removing a boron film formed on a substrate by CVD, heat treatment is performed on a part or all boron film in an oxidizing atmosphere and oxidizing a heat-treated portion. Then, an oxidized portion of the boron film is removed by water or aqueous solution containing electrolyte ions.
    Type: Application
    Filed: June 4, 2018
    Publication date: December 6, 2018
    Inventors: Yoshimasa WATANABE, Masahiro OKA, Hirokazu UEDA
  • Patent number: 10134504
    Abstract: The flat cable is structured such that a plurality of insulated wires with their conductors covered with insulating resin are arranged in parallel and the outer surfaces of the plurality of insulated wires are integrated. The insulating resin between two insulated wires is removed by laser beam in a soldering portion, and, among the plurality of insulated wires, only two mutually adjoining insulated wires are electrically connected to each other by soldering in the soldering portions in which the insulating resin are removed and the conductors are exposed. Such flat cable can positively solder bridge the mutually adjoining conductors.
    Type: Grant
    Filed: March 1, 2016
    Date of Patent: November 20, 2018
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Yuya Namiki, Yoshimasa Watanabe
  • Publication number: 20180174838
    Abstract: There is provided a method of forming a boron film on a substrate on which a semiconductor device is formed, by plasmarizing a reaction gas containing a boron-containing gas under a process atmosphere regulated to a pressure which falls within a range of 0.67 to 33.3 Pa (5 to 250 mTorr). The boron film is formed on a substrate on which a semiconductor device is formed, by plasmarizing a reaction gas containing a boron-containing gas under a process atmosphere regulated to a pressure which falls within a range of 0.67 to 33.3 Pa (5 to 250 mTorr).
    Type: Application
    Filed: December 6, 2017
    Publication date: June 21, 2018
    Inventors: Hirokazu UEDA, Masahiro OKA, Hiraku ISHIKAWA, Yoshimasa WATANABE, Syuhei YONEZAWA