Patents by Inventor Yoshinori Ejiri

Yoshinori Ejiri has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210229222
    Abstract: A method for producing solder particles, which includes: a preparation step wherein a base material that has a plurality of recesses and solder fine particles are prepared; an accommodation step wherein at least some of the solder fine particles are accommodated in the recesses; and a fusing step wherein the solder fine particles accommodated in the recesses are fused, thereby forming solder particles within the recesses. With respect to this method for producing solder particles, the average particle diameter of the solder particles is from 1 ?m to 30 ?m; and the C.V. value of the solder particles is 20% or less.
    Type: Application
    Filed: June 26, 2019
    Publication date: July 29, 2021
    Applicant: Showa Denko Materials Co., Ltd.
    Inventors: Kunihiko AKAI, Yoshinori EJIRI, Yuuhei OKADA, Toshimitsu MORIYA, Shinichirou SUKATA, Masayuki MIYAJI
  • Patent number: 11040416
    Abstract: Provided is copper paste for joining including metal particles, and a dispersion medium. The metal particles include sub-micro copper particles having a volume-average particle size of 0.12 ?m to 0.8 ?m, and flake-shaped micro copper particles having a maximum particle size of 1 ?m to 20 ?m, and an aspect ratio of 4 or greater, and the amount of the micro copper particles contained, which are included in the metal particles and have a maximum particle size of 1 ?m to 20 ?m and an aspect ratio of less than 2, is 50% by mass or less on the basis of a total amount of the flake-shaped micro copper particles.
    Type: Grant
    Filed: September 7, 2016
    Date of Patent: June 22, 2021
    Assignee: Showa Denko Materials Co., Ltd.
    Inventors: Dai Ishikawa, Yuki Kawana, Chie Sugama, Hideo Nakako, Yoshinori Ejiri, Kazuhiko Kurafuchi
  • Publication number: 20210143121
    Abstract: A copper paste for pressureless bonding is a copper paste for pressureless bonding, containing: metal particles; and a dispersion medium, in which the metal particles include sub-micro copper particles having a volume average particle diameter of greater than or equal to 0.01 ?m and less than or equal to 0.8 ?m, and micro copper particles having a volume average particle diameter of greater than or equal to 2.0 ?m and less than or equal to 50 ?m, and the dispersion medium contains a solvent having a boiling point of higher than or equal to 300° C., and a content of the solvent having a boiling point of higher than or equal to 300° C. is greater than or equal to 2 mass % on the basis of a total mass of the copper paste for pressureless bonding.
    Type: Application
    Filed: January 21, 2021
    Publication date: May 13, 2021
    Inventors: Hideo NAKAKO, Kazuhiko KURAFUCHI, Yoshinori EJIRI, Dai ISHIKAWA, Chie SUGAMA, Yuki KAWANA
  • Publication number: 20210114145
    Abstract: The present invention relates to solder particles, each of which partially has a flat portion in the surface. By using these solder particles, electrodes facing each other are able to be appropriately connected, thereby achieving an anisotropic conductive material that exhibits excellent conduction reliability and excellent insulation reliability.
    Type: Application
    Filed: June 26, 2019
    Publication date: April 22, 2021
    Applicant: Showa Denko Materials Co., Ltd.
    Inventors: Kunihiko AKAI, Yoshinori EJIRI, Yuuhei OKADA, Toshimitsu MORIYA, Shinichirou SUKATA, Masayuki MIYAJI
  • Publication number: 20210114147
    Abstract: A method for producing an anisotropic conductive film, which includes: a preparation step wherein a base material that has a plurality of recesses and solder fine particles are prepared; an accommodation step wherein at least some of the solder fine particles are accommodated in the recesses; a fusing step wherein the solder fine particles accommodated in the recesses are fused, thereby forming solder particles within the recesses; a transfer step wherein an insulating resin material is brought into contact with the recess opening side of the base material that includes the solder particles in the recesses, thereby obtaining a first resin layer on which the solder particles have been transferred; and a layering step wherein a second resin layer that is configured from an insulating resin material is formed on the surface of the first resin layer, on which the solder particles have been transferred, thereby obtaining an anisotropic conductive film.
    Type: Application
    Filed: June 26, 2019
    Publication date: April 22, 2021
    Applicant: Showa Denko Materials Co., Ltd.
    Inventors: Kunihiko AKAI, Yoshinori EJIRI, Yuuhei OKADA, Toshimitsu MORIYA, Shinichirou SUKATA, Masayuki MIYAJI
  • Patent number: 10930612
    Abstract: A copper paste for pressureless bonding is a copper paste for pressureless bonding, containing: metal particles; and a dispersion medium, in which the metal particles include sub-micro copper particles having a volume average particle diameter of greater than or equal to 0.01 ?m and less than or equal to 0.8 ?m, and micro copper particles having a volume average particle diameter of greater than or equal to 2.0 ?m and less than or equal to 50 ?m, and the dispersion medium contains a solvent having a boiling point of higher than or equal to 300° C., and a content of the solvent having a boiling point of higher than or equal to 300° C. is greater than or equal to 2 mass % on the basis of a total mass of the copper paste for pressureless bonding.
    Type: Grant
    Filed: January 11, 2017
    Date of Patent: February 23, 2021
    Assignee: Showa Denko Materials Co., Ltd.
    Inventors: Hideo Nakako, Kazuhiko Kurafuchi, Yoshinori Ejiri, Dai Ishikawa, Chie Sugama, Yuki Kawana
  • Publication number: 20200399493
    Abstract: Disclosed is a composition containing copper particles and organic solvents, in which the organic solvents include a first organic solvent having a vapor pressure at 20° C. of 200 Pa or more and 20 kPa or less, and a second organic solvent having a vapor pressure at 20° C. of 0.5 Pa or more and less than 200 Pa.
    Type: Application
    Filed: November 13, 2018
    Publication date: December 24, 2020
    Inventors: Kohsuke URASHIMA, Yoshinori EJIRI, Takaaki NOHDOH, Motoki YONEKURA, Ryuji AKEBI
  • Publication number: 20200365501
    Abstract: An organic interposer includes: a first organic insulating layer including a groove; a first metal wire located in the groove; a barrier metal material covering the first metal wire; and a second metal wire located above the first metal wire, wherein the barrier metal material includes: a first barrier metal film interposed between the first metal wire and an inner surface of the groove; and a second barrier metal film located on the first metal wire, and wherein the second metal wire is in contact with both of the first barrier metal film and the second barrier metal film.
    Type: Application
    Filed: August 3, 2020
    Publication date: November 19, 2020
    Inventors: Kazuyuki MITSUKURA, Masaya TOBA, Yoshinori EJIRI, Kazuhiko KURAFUCHI
  • Publication number: 20200344893
    Abstract: Provided is a method for producing a joined body, the method including a first step of preparing a laminated body which includes a first member having a metal pillar provided on a surface thereof, a second member having an electrode pad provided on a surface thereof, and a joining material provided between the metal pillar and the electrode pad and containing metal particles and an organic compound, and a second step of heating the laminated body to sinter the joining material at a predetermined sintering temperature, in which the joining material satisfies the condition of the following Formula (I): (M1?M2)/M1×100?1.0??(I) [in Formula (I), M1 represents a mass of the joining material when a temperature of the joining material reaches the sintering temperature in the second step, and M2 represents a non-volatile content in the joining material.
    Type: Application
    Filed: November 8, 2018
    Publication date: October 29, 2020
    Inventors: Hideo NAKAKO, Yoshinori EJIRI, Dai ISHIKAWA, Chie SUGAMA, Yuki KAWANA, Motohiro NEGISHI, Yuichi YANAKA
  • Publication number: 20200295248
    Abstract: A method for manufacturing a thermoelectric conversion module of the present invention is a method for manufacturing a thermoelectric conversion module including a thermoelectric semiconductor part in which a plurality of p-type semiconductors and a plurality of n-type semiconductors are alternately arranged, and a high temperature side electrode bound to a binding surface of the p-type semiconductor and the n-type semiconductor on a high temperature heat source side and a low temperature side electrode bound to a binding surface of the p-type semiconductor and the n-type semiconductor on a low temperature heat source side, which electrically connect the p-type semiconductor and the n-type semiconductor adjacent to each other in series, and includes a binding step of binding at least one of the high temperature side electrode and the low temperature side electrode, and the p-type semiconductor and the n-type semiconductor together, by sintering a binding layer containing metal particles, which is provided bet
    Type: Application
    Filed: October 24, 2018
    Publication date: September 17, 2020
    Inventors: Motohiro NEGISHI, Yuki KAWANA, Dai ISHIKAWA, Chie SUGAMA, Hideo NAKAKO, Yoshinori EJIRI
  • Patent number: 10756008
    Abstract: There are provided an organic interposer capable of improving insulation reliability and a method for manufacturing the organic interposer. An organic interposer 10 is provided with: an organic insulating laminate 12 comprising a plurality of organic insulating layers; and a plurality of wires 13 arranged in the organic insulating laminate 12, and each of the wires 13 and each of the organic insulating layers are separated by a barrier metal film 14. The organic insulating laminate 12 may include: a first organic insulating layer 21 having a plurality of grooves 21a each having each of the wires 13 disposed therein; and a second organic insulating layer 22 laminated to the first organic insulating layer 21 in such a way as to embed the wires 13.
    Type: Grant
    Filed: February 23, 2017
    Date of Patent: August 25, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Kazuyuki Mitsukura, Masaya Toba, Yoshinori Ejiri, Kazuhiko Kurafuchi
  • Patent number: 10748865
    Abstract: Provided is a copper paste for joining including copper particles, second particles including a metal element other than copper, and a dispersion medium, in which the copper particles include submicro copper particles having a volume-average particle diameter of 0.12 ?m or more and 0.8 ?m or less and micro copper particles having a volume-average particle diameter of 2 ?m or more and 50 ?m or less, a sum of a content of the submicro copper particles and a content of the micro copper particles is 80% by mass or more of a sum of masses of the copper particles and the second particles, the content of the submicro copper particles is 30% by mass or more and 90% by mass or less of a sum of a mass of the submicro copper particles and a mass of the micro copper particles, and a content of the second particles is 0.01% by mass or more and 10% by mass or less of the sum of the masses of the copper particles and the second particles.
    Type: Grant
    Filed: April 20, 2017
    Date of Patent: August 18, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Yuki Kawana, Hideo Nakako, Dai Ishikawa, Chie Sugama, Kazuhiko Kurafuchi, Yoshinori Ejiri
  • Publication number: 20200176411
    Abstract: Provided is a copper paste for joining including copper particles, second particles including a metal element other than copper, and a dispersion medium, in which the copper particles include submicro copper particles having a volume-average particle diameter of 0.12 ?m or more and 0.8 ?m or less and micro copper particles having a volume-average particle diameter of 2 ?m or more and 50 ?m or less, a sum of a content of the submicro copper particles and a content of the micro copper particles is 80% by mass or more of a sum of masses of the copper particles and the second particles, the content of the submicro copper particles is 30% by mass or more and 90% by mass or less of a sum of a mass of the submicro copper particles and a mass of the micro copper particles, and a content of the second particles is 0.01% by mass or more and 10% by mass or less of the sum of the masses of the copper particles and the second particles.
    Type: Application
    Filed: April 20, 2017
    Publication date: June 4, 2020
    Inventors: Yuki KAWANA, Hideo NAKAKO, Dai ISHIKAWA, Chie SUGAMA, Kazuhiko KURAFUCHI, Yoshinori EJIRI
  • Publication number: 20200130109
    Abstract: Provided is A metal paste for joints, containing: metal particles; and monovalent carboxylic acid having 1 to 9 carbon atoms, in which the metal particles include sub-micro copper particles having a volume average particle diameter of 0.12 ?m to 0.8 ?m, and a content of the monovalent carboxylic acid having 1 to 9 carbon atoms is 0.015 part by mass to 0.2 part by mass with respect to 100 parts by mass of the metal particles.
    Type: Application
    Filed: January 18, 2018
    Publication date: April 30, 2020
    Inventors: Yuki KAWANA, Hideo NAKAKO, Motohiro NEGISHI, Dai ISHIKAWA, Chie SUGAMA, Yoshinori EJIRI
  • Publication number: 20200108471
    Abstract: Provided is copper paste for joining including metal particles, and a dispersion medium. The metal particles include sub-micro copper particles having a volume-average particle size of 0.12 ?m to 0.8 ?m, and flake-shaped micro copper particles having a maximum particle size of 1 ?m to 20 ?m, and an aspect ratio of 4 or greater, and the amount of the micro copper particles contained, which are included in the metal particles and have a maximum particle size of 1 ?m to 20 ?m and an aspect ratio of less than 2, is 50% by mass or less on the basis of a total amount of the flake-shaped micro copper particles.
    Type: Application
    Filed: September 7, 2016
    Publication date: April 9, 2020
    Inventors: Dai ISHIKAWA, Yuki KAWANA, Chie SUGAMA, Hideo NAKAKO, Yoshinori EJIRI, Kazuhiko KURAFUCHI
  • Publication number: 20200075528
    Abstract: Provided is a metal paste for joints, containing: metal particles; and linear or branched monovalent aliphatic alcohol having 1 to 20 carbon atoms, in which the metal particles include sub-micro copper particles having a volume average particle diameter of 0.12 ?m to 0.8 ?M.
    Type: Application
    Filed: January 18, 2018
    Publication date: March 5, 2020
    Inventors: Yuki KAWANA, Hideo NAKAKO, Motohiro NEGISHI, Dai ISHIKAWA, Chie SUGAMA, Yoshinori EJIRI
  • Patent number: 10566304
    Abstract: Provided is a joined body including: a first member; a second member; and a sintered metal layer that joins the first member and the second member. The sintered metal layer includes a structure that is derived from flake-shaped copper particles which are oriented in approximately parallel to an interface between the first member or the second member, and the sintered metal layer, and the amount of copper contained in the sintered metal layer is 65% by volume or greater on the basis of a volume of the sintered metal layer.
    Type: Grant
    Filed: September 7, 2016
    Date of Patent: February 18, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Hideo Nakako, Kazuhiko Kurafuchi, Yoshinori Ejiri, Dai Ishikawa, Chie Sugama, Yuki Kawana
  • Publication number: 20190355690
    Abstract: A copper paste for pressureless bonding is a copper paste for pressureless bonding, containing: metal particles; and a dispersion medium, in which the metal particles include sub-micro copper particles having a volume average particle diameter of greater than or equal to 0.01 ?m and less than or equal to 0.8 ?m, and micro copper particles having a volume average particle diameter of greater than or equal to 2.0 ?m and less than or equal to 50 ?m, and the dispersion medium contains a solvent having a boiling point of higher than or equal to 300° C., and a content of the solvent having a boiling point of higher than or equal to 300° C. is greater than or equal to 2 mass % on the basis of a total mass of the copper paste for pressureless bonding.
    Type: Application
    Filed: January 11, 2017
    Publication date: November 21, 2019
    Inventors: Hideo NAKAKO, Kazuhiko KURAFUCHI, Yoshinori EJIRI, Dai ISHIKAWA, Chie SUGAMA, Yuki KAWANA
  • Patent number: 10363608
    Abstract: Provided is copper paste for joining including metal particles, and a dispersion medium. The metal particles include sub-micro copper particles having a volume-average particle size of 0.12 ?m to 0.8 ?m, and micro copper particles having a volume-average particle size of 2 ?m to 50 ?m, a sum of the amount of the sub-micro copper particles contained and the amount of the micro copper particles contained is 80% by mass or greater on the basis of a total mass of the metal particles, and the amount of the sub-micro copper particles contained is 30% by mass to 90% by mass on the basis of a sum of a mass of the sub-micro copper particles and a mass of the micro copper particles.
    Type: Grant
    Filed: September 7, 2016
    Date of Patent: July 30, 2019
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Yuki Kawana, Kazuhiko Kurafuchi, Yoshinori Ejiri, Hideo Nakako, Chie Sugama, Dai Ishikawa
  • Publication number: 20190109082
    Abstract: There are provided an organic interposer capable of improving insulation reliability and a method for manufacturing the organic interposer. An organic interposer 10 is provided with: an organic insulating laminate 12 comprising a plurality of organic insulating layers; and a plurality of wires 13 arranged in the organic insulating laminate 12, and each of the wires 13 and each of the organic insulating layers are separated by a barrier metal film 14. The organic insulating laminate 12 may include: a first organic insulating layer 21 having a plurality of grooves 21a each having each of the wires 13 disposed therein; and a second organic insulating layer 22 laminated to the first organic insulating layer 21 in such a way as to embed the wires 13.
    Type: Application
    Filed: February 23, 2017
    Publication date: April 11, 2019
    Inventors: Kazuyuki MITSUKURA, Masaya TOBA, Yoshinori EJIRI, Kazuhiko KURAFUCHI