Patents by Inventor Yoshinori Takenaka
Yoshinori Takenaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20120306608Abstract: A wiring board includes a core structure having a first surface and a second surface on the opposite side of the first surface, a first buildup structure formed on the first surface of the core structure and including insulation layers, and a second buildup structure formed on the second surface of the core structure and including insulation layers and an inductor device. The insulation layers in the second buildup structure have the thicknesses which are thinner than the thicknesses of the insulation layers in the first buildup structure, and the inductor device in the second buildup structure is position on the second surface of the core structure and includes at least a portion of a conductive pattern formed in the core structure.Type: ApplicationFiled: March 8, 2012Publication date: December 6, 2012Applicant: IBIDEN CO., LTD.Inventor: Yoshinori TAKENAKA
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Publication number: 20120250281Abstract: A printed wiring board includes a core substrate having first and second surfaces, a first conductor formed on the first surface of the substrate, a second conductor formed on the second surface of the substrate, a first through-hole conductor formed through the substrate and connecting the first and second conductors, and a second through-hole conductor formed through the substrate and connecting the first and second conductors. The second through-hole conductor has a diameter which is greater than a diameter of the first through-hole conductor, the first through-hole conductor has a roughened inner wall forming an interior space, the second through-hole conductor has a roughened inner wall forming an interior space, and the roughened inner wall of the first through-hole conductor has an arithmetic average roughness which is set lower than an arithmetic average roughness of the roughened inner wall of the second through-hole conductor.Type: ApplicationFiled: March 20, 2012Publication date: October 4, 2012Applicant: IBIDEN CO., LTD.Inventors: Hideyuki KAWAI, Yoshinori Takenaka
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Patent number: 8263878Abstract: A printed wiring board disperses stress throughout an inner conductor layer, ensuring the flatness of a substrate. Embedding wires into the outermost insulating layer and forming the wires in a tapered shape that widens downward reduces the amount of stress applied on the edge of the inner conductor layer. This also prevents cracks from forming within the insulating layer, while maintaining favorable yield rates. Via diameters may also be reduced to increase circuit density.Type: GrantFiled: January 16, 2009Date of Patent: September 11, 2012Assignee: Ibiden Co., Ltd.Inventors: Yoshinori Takenaka, Takeshi Nakamura, Takamitsu Hattori
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Patent number: 8156647Abstract: A method for manufacturing a multilayer printed wiring board includes preparing a first resin insulative material having a first conductive circuit on or in the first resin insulative material, forming a second resin insulative material on the first resin insulative material and the first conductive circuit, forming on a surface of the second resin insulative material a first concave portion to be filled with a conductive material for formation of a second conductive circuit, forming on the surface of the second resin insulative material a pattern having a second concave portion and post portions to be filled with the conductive material for formation of a plane conductor, and filling the conductive material in the first concave portion and the second concave portion such that the second conductive circuit and the plane conductor are formed.Type: GrantFiled: November 16, 2009Date of Patent: April 17, 2012Assignee: Ibiden Co., Ltd.Inventors: Yoshinori Takenaka, Takeshi Nakamura
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Publication number: 20120073868Abstract: A method for manufacturing a multilayer printed wiring board includes preparing a first resin insulative material having a first conductive circuit on or in the first resin insulative material, forming a second resin insulative material on the first resin insulative material and the first conductive circuit, forming on a surface of the second resin insulative material a first concave portion to be filled with a conductive material for formation of a second conductive circuit, forming on the surface of the second resin insulative material a pattern having a second concave portion and post portions to be filled with the conductive material for formation of a plane conductor, and filling the conductive material in the first concave portion and the second concave portion such that the second conductive circuit and the plane conductor are formed.Type: ApplicationFiled: December 8, 2011Publication date: March 29, 2012Applicant: IBIDEN CO., LTD.Inventors: Yoshinori TAKENAKA, Takeshi NAKAMURA
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Publication number: 20100139968Abstract: A method for manufacturing a multilayer printed wiring board includes preparing a first resin insulative material having a first conductive circuit on or in the first resin insulative material, forming a second resin insulative material on the first resin insulative material and the first conductive circuit, forming on a surface of the second resin insulative material a first concave portion to be filled with a conductive material for formation of a second conductive circuit, forming on the surface of the second resin insulative material a pattern having a second concave portion and post portions to be filled with the conductive material for formation of a plane conductor, and filling the conductive material in the first concave portion and the second concave portion such that the second conductive circuit and the plane conductor are formed.Type: ApplicationFiled: November 16, 2009Publication date: June 10, 2010Applicant: IBIDEN CO., LTD.Inventors: Yoshinori TAKENAKA, Takeshi Nakamura
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Publication number: 20100006334Abstract: A printed wiring board including an insulative material, a first conductive circuit formed on the insulative material, a resin insulation layer including a first insulation layer formed on the insulative material and on the first conductive circuit and which insulates between lines of the first conductive circuit, the first insulation layer including inorganic particles having a first average diameter, and a second insulation layer formed on the first insulation layer and including a recessed portion and an opening portion, the second insulation layer including inorganic particles having a second average diameter smaller than the first average diameter, a second conductive circuit formed in the recessed portion, and a via conductor formed in the opening portion and which connects the first conductive circuit to the second conductive circuit.Type: ApplicationFiled: June 2, 2009Publication date: January 14, 2010Applicant: IBIDEN CO., LTDInventors: Yoshinori TAKENAKA, Takeshi NAKAMURA, Takamitsu HATTORI
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Publication number: 20090242261Abstract: A printed wiring board disperses stress throughout an inner conductor layer, ensuring the flatness of a substrate. Embedding wires into the outermost insulating layer and forming the wires in a tapered shape that widens downward reduces the amount of stress applied on the edge of the inner conductor layer. This also prevents cracks from forming within the insulating layer, while maintaining favorable yield rates. Via diameters may also be reduced to increase circuit density.Type: ApplicationFiled: January 16, 2009Publication date: October 1, 2009Applicant: IBIDEN CO., LTDInventors: Yoshinori Takenaka, Takeshi Nakamura, Takamitsu Hattori
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Patent number: 5997496Abstract: An extracorporeal blood circulation system for treating inflammatory diseases includes a blood collection device for collecting blood from a patient suffering from an inflammatory disease, an anticoagulant mixing device for mixing an anticoagulant into the collected blood, blood transportation device for transporting the anticoagulant-containing blood at a flow rate in the range of from 20 to 200 ml/minute, a blood treating device having a blood inlet and a blood outlet and containing a platelet activating device, and a blood returning device for returning the treated blood to the patient, each being liquid-tightly connected in this order through a tubing so that when extracorporeal blood circulation is conducted using the system with respect to blood from the patient, the system is capable of providing treated blood satisfying at least one requirement selected from requirement (1) of having a .beta.Type: GrantFiled: December 30, 1997Date of Patent: December 7, 1999Assignee: Asahi Medical Co., Ltd.Inventors: Mitsuyo Sekiguchi, Yoshinori Takenaka
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Patent number: 4898573Abstract: There is disclosed a blood components collector unit comprising a cannula, a blood collection bag and a membrane type blood components separator which are connected in this order through tubes, and also comprising a plasma collection reservoir and a blood cell collection reservoir, both of which are connected to the blood components separator through tubes, wherein each connection through each tube is in a fixed fashion, thereby providing a unified connection, and wherein the blood collector unit is packed in a container in a sterile state. By the use of the unit of the present invention, whole blood can be collected and separated into blood components easily at a shortened period of time without any cumbersome preparatory operations. In addition, since the unit of the present invention is compact and light in weight and can be used without any other auxiliary apparatus, the unit can be conveyed to and used in any places, such as in automobiles and outdoors.Type: GrantFiled: October 29, 1987Date of Patent: February 6, 1990Assignee: Asahi Medical Co., Ltd.Inventors: Yoshinori Takenaka, Hirokazu Fukumi, Sadayoshi Sekiguchi
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Patent number: 4416777Abstract: Leukocytes are separated from a leukocyte-containing suspension by bringing the leukocyte-containing suspension into contact with a leukocyte-separating material, whereby a substantial part of the leukocytes are entrapped in the leukocyte-separating material, and then, collecting the entrapped leukocytes. The leukocyte-separating material used comprises a fibrous material having a surface layer composed of a substance which is capable of being dissolved in water by degrees. Lymphocytes can also be separated in a manner similar to that mentioned above, from a lymphocyte-containing suspension having reduced contents of granulocytes and monocytes.Type: GrantFiled: October 3, 1980Date of Patent: November 22, 1983Assignee: Asahi Kasei Kogyo Kabushiki KaishaInventors: Toru Kuroda, Yoshinori Takenaka, Nobuaki Tsuda
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Patent number: 4330410Abstract: Leukocytes are advantageously separated from blood or other leukocyte-containing suspensions by causing the leukocyte-containing suspensions to flow through a filter unit comprising a container provided with inlet and outlet conduit means and with a mass of fibers packed therein. The mass of fibers is characterized as possessing a bulk density of from 0.02 to 0.40 gram/cubic centimeter, and each of the fibers is characterized as having an average diameter of from 3 to 10 microns. The fibers to be used are selected from synthetic fibers, semi-synthetic fibers, regenerated fibers and natural proteinaceous fibers.Type: GrantFiled: July 21, 1980Date of Patent: May 18, 1982Assignee: Asahi Kasei Kogyo Kabushiki KaishaInventors: Yoshinori Takenaka, Nobuaki Tsuda, Toru Kuroda
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Patent number: 4246107Abstract: Lymphocytes are advantageously separated from blood or other lymphocyte-containing suspensions by a method wherein the lymphocyte-containing suspension is flowed through a second filter having a mass of fibers exhibiting an average fiber diameter of greater than 10 microns but not greater than 60 microns, thereby to entrap a substantial part of granulocytes and monocytes in the mass of fibers and to obtain a granulocyte-poor and monocyte-poor lymphocyte-containing suspension; and then, the obtained suspension is flowed through a first filter having a mass of fibers exhibiting a bulk density of 0.04 to 0.40 g/cm.sup.3 and an average fiber diameter of 5 to 20 microns, said average fiber diameter being less than that of the second filter, thereby to entrap a substantial part of lymphocytes in the mass of fibers; and finally, the lymphocytes entrapped in the mass of fibers of the first filter is collected.Type: GrantFiled: March 1, 1979Date of Patent: January 20, 1981Assignee: Asahi Kasei Kogyo Kabushiki KaishaInventors: Yoshinori Takenaka, Nobuaki Tsuda, Toru Kuroda