Patents by Inventor Yoshinori Yoshida

Yoshinori Yoshida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080109659
    Abstract: The present invention provides a logistic PKI service system that improves reliability and security of its distribution portion. An article displayed on a shop terminal is purchased from a user's mobile terminal via a network. Then, a shop terminal receives distribution label data from a PKI. The user's mobile terminal receives authentication information transmitted by the PKI. The shop terminal generates a distribution label on the basis of the distribution label data from the PKI. Then, the shop terminal attaches the distribution label to the article and then requests a distributor to deliver the article. After the distributor delivers the article to a user, the user's mobile terminal reads information from the distribution label attached to the article. The user's mobile terminal then carries out information on the basis of the information from the distribution label and the authentication information from the PKI.
    Type: Application
    Filed: December 31, 2007
    Publication date: May 8, 2008
    Applicant: NEC CORPORATION
    Inventors: Toru Katayama, Yoshinori Yoshida
  • Publication number: 20080099788
    Abstract: The external base electrode has a two-layered structure where a p-type polysilicon film doped with a medium concentration of boron is laminated on a p-type polysilicon film doped with a high concentration of boron. Therefore, since the p-type polysilicon film doped with a high concentration of boron is in contact with an intrinsic base layer at a junction portion between the external base electrode and the intrinsic base layer, the resistance of the junction portion can be reduced. In addition, since the resistance of the external base electrode becomes a parallel resistance of the two layers of the p-type polysilicon films, the resistance of the p-type polysilicon film whose boron concentration is relatively lower is dominant.
    Type: Application
    Filed: October 31, 2007
    Publication date: May 1, 2008
    Inventors: Yoshinori Yoshida, Tatsuya Tominari, Toshio Ando
  • Publication number: 20070071969
    Abstract: To provide a pressure-sensitive adhesive that is used in processing an article such as a semiconductor wafer that causes neither contamination nor breakage of the semiconductor wafer during the processing, the pressure-sensitive adhesive sheet has a base, an intermediate layer, and a pressure-sensitive adhesive layer in order. The intermediate layer includes a composite film that contains an acrylic-based polymer and a vinyl-based polymer as active ingredients. The urethane polymer contains a component having a weight-average molecular weight of 10,000 or less in a differential molecular weight curve in a content of less than 10%.
    Type: Application
    Filed: September 20, 2006
    Publication date: March 29, 2007
    Applicant: NITTO DENKO CORPORATION
    Inventors: Tomohiro Kontani, Kouji Akazawa, Kohei Yano, Yoshinori Yoshida
  • Publication number: 20070059903
    Abstract: To provide a pressure-sensitive adhesive that is used in processing an article such as a semiconductor wafer, the pressure-sensitive adhesive sheet is one that has a base, an intermediate layer and a pressure-sensitive adhesive layer in order, wherein the intermediate layer has an elastic modulus at elongation at 23° C. of 1 MPa or more and 100 MPa or less, the intermediate layer includes an acrylic polymer obtained by polymerization of a (meth) acrylic monomer mixture containing 1% by weight or more and 20% by weight or less of a nitrogen-containing acrylic monomer, the acrylic polymer containing 20% by weight or less of a polymer component having a molecular weight of 100,000 or less, and the base includes at least one film having an elastic modulus at in tension at 23° C. of 0.6 GPa or more.
    Type: Application
    Filed: September 1, 2006
    Publication date: March 15, 2007
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kohei Yano, Kouji Akazawa, Yoshinori Yoshida, Tomohiro Kontani
  • Publication number: 20070054469
    Abstract: To provide a pressure-sensitive adhesive sheet, which is used in processing an article such as a semiconductor wafer, the pressure-sensitive adhesive sheet has a base, an intermediate layer and a pressure-sensitive adhesive layer in this order, wherein the intermediate layer has an elastic modulus in tension at 23° C. of 10 MPa or more and 100 Mpa or less, the intermediate layer includes an acrylic-based polymer obtained by polymerization of a mixture containing 70 to 99 parts by weight of a (meth)acrylate monomer and 1 to 30 parts by weight of an unsaturated carboxylic acid based on 100 parts by weight of total monomers, and the base includes at least one film having an elastic modulus in tension at 23° C. of 0.6 GPa or more.
    Type: Application
    Filed: September 1, 2006
    Publication date: March 8, 2007
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kohei Yano, Kouji Akazawa, Yoshinori Yoshida, Tomohiro Kontani
  • Publication number: 20070036930
    Abstract: To provide a pressure-sensitive adhesive sheet for use in processing wafers and the like articles, that produces less cutting sludge of the pressure-sensitive adhesive sheet and that can follow up unevenness of a wafer even when a difference in height of the unevenness is large, the pressure-sensitive adhesive sheet includes a base having on one surface thereof an intermediate layer and a pressure-sensitive adhesive layer in order, wherein the intermediate layer has an initial elastic modulus of 0.5 N/mm2 or less, a loss tangent (tan?) at 20° C. to 70° C. of 0.
    Type: Application
    Filed: August 7, 2006
    Publication date: February 15, 2007
    Applicant: NITTO DENKO CORPORATION
    Inventors: Tomohiro Kontani, Yoshinori Yoshida, Toshio Shintani, Kouji Akazawa
  • Publication number: 20060188725
    Abstract: To provide a pressure-sensitive adhesive sheet used during processing articles such as semiconductor wafers and laminate sheet used for such a pressure-sensitive adhesive sheet, which does not contaminate or break the semiconductor wafers during the processing and can minimize the curl of the articles due to residual stress of the pressure-sensitive adhesive sheet, a multi-layer sheet includes a composite film containing a urethane polymer and a vinyl-based polymer as effective components and a first film made of a material different from that of the composite film, wherein the urethane polymer is formed from a polyolefin diol and a polyisocyanate. A pressure-sensitive adhesive sheet is obtained by providing a pressure-sensitive adhesive layer on at least one side of the multi-layer sheet.
    Type: Application
    Filed: February 21, 2006
    Publication date: August 24, 2006
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yoshinori Yoshida, Kouji Akazawa, Tomohiro Kontani, Kohei Yano
  • Publication number: 20060062582
    Abstract: A visible light information providing device, a visible light information reader, a visible light information providing system, a visible light information providing method, a program thereof, and a computer-readable information storage medium for storing the program, enabling a user to recognize the area to which information is provided in a contactless manner. A visible light information providing device comprises a memory, an LED (Light Emitting Diode) for emitting visible light, a modulator circuit for modulating visible light emitted from the LED to transmit information stored in the memory, and a CPU (Central Processing Unit) for controlling the modulator circuit according to the type of information stored in the memory so that the LED emits a prescribed visible light pattern.
    Type: Application
    Filed: September 16, 2005
    Publication date: March 23, 2006
    Inventors: Shuuji Suzuki, Yoshinori Yoshida
  • Publication number: 20050153129
    Abstract: Disclosed is a pressure-sensitive adhesive sheet for use in processing a product such a semiconductor wafer. To provide a pressure-sensitive adhesive sheet that provides a minimized number of broken semiconductor wafers during the process of polishing them and that produces a less curl of the wafer due to the residual stress of the pressure-sensitive adhesive sheet, the pressure-sensitive adhesive sheet includes a composite film formed from a composition containing a urethane polymer and a vinyl polymer as effective components, a first film comprising a material different from that of the composite film, and a pressure-sensitive adhesive layer. It is preferable that the pressure-sensitive adhesive sheet has a modulus of 9 N/mm2 or more and 250 N/mm2 or less when an oblong piece of the pressure-sensitive adhesive sheet with a width of 20 mm is bent at a radius of curvature of 3.0 mm.
    Type: Application
    Filed: January 21, 2005
    Publication date: July 14, 2005
    Inventors: Yoshinori Yoshida, Yohei Maeno, Kouji Akazawa, Takeshi Matsumura, Tomokazu Takahashi
  • Publication number: 20040182418
    Abstract: To provide a cleaning sheet that can remove foreign matter adhering on a probe needle without wearing the probe needle and that does not allow the foreign matter to re-adhere on the probe needle, the cleaning sheet has a cleaning layer on at least one surface thereof, the cleaning layer containing a urethane polymer and a vinyl monomer.
    Type: Application
    Filed: March 18, 2004
    Publication date: September 23, 2004
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yoshinori Yoshida, Yohei Maeno, Jirou Nukaga
  • Publication number: 20040126575
    Abstract: Disclosed is a pressure-sensitive adhesive sheet for use in processing a product such a semiconductor wafer. To provide a pressure-sensitive adhesive sheet that provides a minimized number of broken semiconductor wafers during the process of polishing them and that produces a less curl of the wafer due to the residual stress of the pressure-sensitive adhesive sheet, the pressure-sensitive adhesive sheet includes a composite film formed from a composition containing a urethane polymer and a vinyl polymer as effective components, a first film comprising a material different from that of the composite film, and a pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive sheet has a modulus of 9 N/mm2 or more and 250 N/mm2 or less when an oblong piece of the pressure-sensitive adhesive sheet with a width of 20 mm is bent at a radius of curvature of 3.0 mm.
    Type: Application
    Filed: July 24, 2003
    Publication date: July 1, 2004
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yoshinori Yoshida, Yohei Maeno, Kouji Akazawa, Takeshi Matsumura, Tomokazu Takahashi
  • Publication number: 20030144968
    Abstract: The present invention provides a logistic PKI service system that improves reliability and security of its distribution portion. An article displayed on a shop terminal is purchased from a user's mobile terminal via a network. Then, a shop terminal receives distribution label data from a PKI. The user's mobile terminal receives authentication information transmitted by the PKI. The shop terminal generates a distribution label on the basis of the distribution label data from the PKI. Then, the shop terminal attaches the distribution label to the article and then requests a distributor to deliver the article. After the distributor delivers the article to a user, the user's mobile terminal reads information from the distribution label attached to the article. The user's mobile terminal then carries out information on the basis of the information from the distribution label and the authentication information from the PKI.
    Type: Application
    Filed: January 23, 2003
    Publication date: July 31, 2003
    Applicant: NEC CORPORATION
    Inventors: Toru Katayama, Yoshinori Yoshida
  • Patent number: 6338670
    Abstract: A manufacturing system of semiconductor devices, which comprises a dispersing equipment for dispersing inorganic oxide with water, a filtrating equipment provided behind the dispersing equipment for filtrating the slurry sent from the dispersing equipment, a supplying equipment provided behind the filtrating equipment for supplying the slurry sent from the filtrating equipment to a CMP polishing equipment, and the CMP polishing equipment provided behind the supplying equipment for polishing semiconductor devices by using the slurry supplied from the supplying equipment. According to the present invention, it is possible to supply slurry to the CMP polishing equipment at the right time in the right quantity. Accordingly, it is possible to eliminate the cost incurred by performing the strict quality control of the slurry during the storage.
    Type: Grant
    Filed: March 17, 2000
    Date of Patent: January 15, 2002
    Assignees: Kabushiki Kaisha Toshiba, JSR Corporation
    Inventors: Katsuya Okumura, Yoshinori Yoshida
  • Patent number: 6276994
    Abstract: A method of the production of a plastic lens substrate is provided which comprises the steps of retaining a starting plastic block material on a processing material retainer, holding a processing tool on a tool holder, the processing tool having a processing end portion dimensioned to be smaller than the dimension of the block material, manipulating the processing tool and/or the block material to thereby subject both of the same to relative movement, and repeating the steps mentioned upon exchange of the processing tool for one for use in subsequent processing. The method leads, in automated manner with improved production efficiency and increased cost saving, to a plastic lens substrate having a lens surface such as a spherical surface, a toric surface, an aspherical surface, a progressive surface, a combination of aspherical and toric surfaces or a combination of progressive and toric surfaces. Also disclosed is an apparatus for producing the lens substrate.
    Type: Grant
    Filed: October 8, 1997
    Date of Patent: August 21, 2001
    Assignee: Nikon Corporation
    Inventors: Yoshinori Yoshida, Toshiya Tanaka, Masaharu Ohshima
  • Patent number: 5775119
    Abstract: An outdoor unit for use in a separate type air conditioner which includes an outdoor unit and an indoor unit each having at least a compressor, a heat exchanger, and a expansion device, with one unit connected with the other by refrigerant-tubes so that they altogether form an air conditioning system. The outdoor unit comprises: a baseplate, a housing having a first air intake window (side air intake window) in one of its side walls, a second air intake window (rear air intake window) formed in the rear wall extending upright from the baseplate, and an air outlet window (front air outlet window) formed in the front wall; a partition board extending upright from the baseplate and portioning for the internal space of the housing into a fan compartment for accommodating the heat exchanger and a fan for supplying air to the heat exchanger; and a machinery compartment for accommodating the compressor.
    Type: Grant
    Filed: November 28, 1995
    Date of Patent: July 7, 1998
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Wazo Yamada, Hideo Maeda, Yoshinori Yoshida, Yoshimi Okamoto, Koichiro Seki, Keiko Ohno, Masato Inuzuka, Hideyuki Takayama
  • Patent number: 5381176
    Abstract: In a miniature or small-sized video camera, a front block assembly including an image pick-up element and a rear block assembly are respectively secured within opposed open ends of a tubular outer casing, and a base plate assembly is disposed within the casing between the front and rear block assemblies and includes a plurality of elongated base plates arranged in longitudinally overlapped folded relation and having electronic elements or components mounted thereon and included in an electrical circuit through flexible flat cable elements which connect the base plates end-to-end to each other and to the image pick-up element and to a connector in the rear block assembly for outputting a video signal.
    Type: Grant
    Filed: November 4, 1992
    Date of Patent: January 10, 1995
    Assignee: Sony Corporation
    Inventors: Ikuo Tanabe, Yoshinori Yoshida, Kiyoshi Seitoh, Masanobu Morioka
  • Patent number: 5254512
    Abstract: A method for continuously treating a gas using an apparatus with a catalyst bed housed therein comprises the steps of passing a subject gas through the catalyst bed to adsorb the adsorbable substances in the subject gas thereto; and passing a regenerating gas through the catalyst bed adsorbed by the adsorbable substances in the subject gas to react and decompose them and simultaneously regenerate the catalyst bed. A particular apparatus is used with this method.By carrying out this method of the present invention using the gas treating apparatus, it is possible to continuously, efficiently and economically advantageously treat a gas containing a malodorous component, harmful component, organic solvent, hydrocarbon vapor or the like.
    Type: Grant
    Filed: November 22, 1991
    Date of Patent: October 19, 1993
    Assignee: Sumitomo Seika Chemicals Co., Ltd.
    Inventors: Kanji Ueda, Yoshinori Takata, Tadaichi Shibahara, Yoshinori Yoshida
  • Patent number: 5229350
    Abstract: A reversible heat-sensitive recording material, a method of recording and erasing information using the recording material, and a magnetic card using the recording material, the recording material comprising a reversible heat-sensitive recording material comprising a heat-sensitive layer containing a resin matrix and an organic low molecular weight material, said organic low molecular weight material containing at least one higher fatty acid having 16 or more carbon atoms and a sulfide represented by the formulaHOOC(CH.sub.2).sub.m --S--(CH.sub.2).sub.n COOH [I]wherein m and n each independently means an integer of 1 to 5, the ratio of the amount of said at least one higher fatty acid to that of said sulfide being from 90:10 to 10:90 by weight.
    Type: Grant
    Filed: July 18, 1991
    Date of Patent: July 20, 1993
    Assignee: Nitto Denko Corporation
    Inventors: Takae Shinagawa, Yoshihiro Hieda, Megumi Ashida, Yoshinori Yoshida, Yasushi Inoue
  • Patent number: 5110399
    Abstract: The invention provides a heat-bonding blade and a heat-bonding apparatus capable of heat-bonding thermoplastic resin sheets, in particular non-woven cloth sheets of thermoplastic resin, with or without heat-cutting these sheets. A first-type heat-bonding blade intended for heat-cutting/bonding has pressing members provided on both sides of the blade. The distance between the lower end of each pressing member and the edge of the blade is determined such that the pressing members lightly press the sheets of the thermoplastic resins when the edge of the blade has pressed into the sheets.A second-type heat-bonding blade intended only for heat-bonding the sheets is provided with a contact surface on the edge thereof. The contact surface is embossed so as to have a multiplicity of emboss projections. This type of heat-bonding blade may be formed by removing the pressing members from the blade of the first type and providing an embossed contact surface on the edge of the same.
    Type: Grant
    Filed: November 22, 1989
    Date of Patent: May 5, 1992
    Assignee: Mitsui Petrochemical Industries, Ltd.
    Inventors: Yoshinori Yoshida, Makoto Hagihara
  • Patent number: 5078935
    Abstract: The polyolefin spunbonded nonwoven fabric is defined as (A) being formed of continuous polyolefin fibers having a fineness of 0.5 to 3 denier, (B) having basic weight between 30 g/m.sup.2 and 15 g/m.sup.2, and (C) having .sqroot.S.sub.MD .times.S.sub.TD of 2.5 g or below, wherein S.sub.MD and S.sub.TD are respectively the softnesses in the machine and transverse directions as measured by a handle-O-meter. The method of producing a strip of very soft polyolefin nonwoven fabric by directing polyolefin continuous fibers in a fixed direction, comprises the steps of: orienting the axes of the continuous fibers in the direction in which the continuous fibers are fed so as to form a web having a warp orientation factor (the maximum tensile strength in the direction in which the continuous fibers are fed, i.e., in a machine direction/the maximum tensile strength in a transverse direction) of 3.0 or above; and then applying wave-like crepes propagated in the machine direction to the web by creping the web.
    Type: Grant
    Filed: August 9, 1990
    Date of Patent: January 7, 1992
    Assignee: Mitsui Petrochemical Industries, Ltd.
    Inventors: Yoshinori Kobayashi, Naoyuki Tamura, Takanobu Sakai, Yoshinori Yoshida