Patents by Inventor Yoshio Furukawa
Yoshio Furukawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20250092169Abstract: A methacrylic resin includes a structural unit derived from methyl methacrylate in a proportion of 98% by mass or more. The methacrylic resin has a weight average molecular weight (Mw) as measured by gel permeation chromatography (GPC) of 400,000 or more, a triad syndiotacticity of 55% to 70% inclusive, a 5% weight loss temperature of 300° C. or higher, and a proportion of terminal double bonds to a structural unit derived from methyl methacrylate of less than 0.015 mol %. A method for producing the methacrylic resin is provided. A resin composition and a dope including the methacrylic resin, a resin film including the methacrylic resin, and a polarizing plate and a display device in which the resin film is used, are provided.Type: ApplicationFiled: December 4, 2024Publication date: March 20, 2025Applicant: KANEKA CORPORATIONInventors: Takefumi Furuta, Yoshio Furukawa
-
Publication number: 20250092172Abstract: A methacrylic resin includes structural units derived from methyl methacrylate at a ratio of 98% by mass or more, has a triad syndiotacticity of 55% or more, and contains a terminal structure that is derived from a polymerization initiator and is represented by formula (1). The ratio of terminal double bonds to the structural units derived from methyl methacrylate is less than 0.020 mol %. A method for producing the methacrylic resin is provided. In formula (1), each of R1, R2 and R3 independently represents an alkyl group, a substituted alkyl group, an ester group or an amide group, provided that at least one of R1, R2 and R3 represents an ester group or an amide group.Type: ApplicationFiled: December 3, 2024Publication date: March 20, 2025Applicant: KANEKA CORPORATIONInventors: Takefumi Furuta, Yoshio Furukawa
-
Publication number: 20240384031Abstract: An object of the present invention is to provide a benzoxazine composition the cured product of which has excellent self-repairability. A benzoxazine composition in accordance with an embodiment of the present invention includes: a product of reaction between a benzoxazine compound and a compound (ii) which contains at least two phenolic hydroxyl groups, and/or a mixture of the compounds (i) and (ii); and a specific crosslinking agent, so that the above problem is solved.Type: ApplicationFiled: September 7, 2022Publication date: November 21, 2024Applicant: KANEKA CORPORATIONInventors: Takefumi Furuta, Mari Yoshitake, Yoshio Furukawa
-
Patent number: 12049545Abstract: A layered body which allows a reduction in residual volatile component and a method for producing the layered body. A reinforcing fiber composite material which has high heat resistance and superior mechanical strength and a method for producing the reinforcing fiber composite material. A method includes fusing together a plurality of layers each of which contains: a powder of an imide oligomer represented by a specific general formula; and reinforcement fibers.Type: GrantFiled: April 2, 2021Date of Patent: July 30, 2024Assignee: KANEKA CORPORATIONInventors: Yoshio Furukawa, Yutaka Kaneda
-
Publication number: 20230193075Abstract: The present invention provides an amide acid oligomer which has specific composition and which is capable of providing a cured product having excellent physical properties, in particular, an excellent glass transition temperature, etc.Type: ApplicationFiled: March 5, 2021Publication date: June 22, 2023Applicants: KANEKA CORPORATION, JAPAN AEROSPACE EXPLORATION AGENCYInventors: Takefumi Furuta, Yoshio Furukawa, Rikio Yokota, Yuichi Ishida
-
Publication number: 20230042415Abstract: The present invention provides an amide acid oligomer which has specific composition and which is capable of providing a cured product having excellent physical properties, in particular, an excellent glass transition temperature, etc.Type: ApplicationFiled: September 29, 2022Publication date: February 9, 2023Applicants: KANEKA CORPORATION, JAPAN AEROSPACE EXPLORATION AGENCYInventors: Takefumi Furuta, Yoshio Furukawa, Rikio Yokota, Yuichi Ishida
-
Patent number: 11492446Abstract: An object of the present invention is to reduce or eliminate a defect (e.g., a void) by achieving (i) a semipreg and a prepreg each of which allows a reduction in residual volatile component and (ii) methods for producing the semipreg and the prepreg, respectively, and consequently to achieve (iii) a fiber-reinforced composite material which has high heat resistance and superior mechanical strength and a (iv) a method for producing the fiber-reinforced composite material. The present invention attains the above object by providing, for example, a semipreg containing: powders of an imide oligomer; and reinforcement fibers, the imide oligomer being represented by a specific general formula (1).Type: GrantFiled: March 22, 2018Date of Patent: November 8, 2022Assignees: KANEKA CORPORATION, JAPAN AEROSPACE EXPLORATION AGENCYInventors: Yoshio Furukawa, Takefumi Furuta, Takeshi Chiba, Rikio Yokota, Yuichi Ishida
-
Publication number: 20210340327Abstract: In order to provide an imide oligomer or the like which can give a cured product exhibiting excellent thermal oxidative stability, an imide oligomer is obtained by reacting together an aromatic tetracarboxylic acid component, an aromatic diamine component, and a terminal capping agent. The imide oligomer contains, in a specified proportion: a compound containing a phenylethynyl group; and a compound containing no carbon-carbon unsaturated bond capable of an addition reaction. One or each of the aromatic tetracarboxylic acid component and the aromatic diamine component contains a component having an asymmetrical and non-planar structure.Type: ApplicationFiled: July 14, 2021Publication date: November 4, 2021Applicant: KANEKA CORPORATIONInventors: Takefumi Furuta, Yoshio Furukawa, Rikio Yokota, Yuki Kubota, Yuichi Ishida
-
Publication number: 20210221113Abstract: A layered body which allows a reduction in residual volatile component and a method for producing the layered body. A reinforcing fiber composite material which has high heat resistance and superior mechanical strength and a method for producing the reinforcing fiber composite material. A method includes fusing together a plurality of layers each of which contains: a powder of an imide oligomer represented by a specific general formula; and reinforcement fibers.Type: ApplicationFiled: April 2, 2021Publication date: July 22, 2021Applicant: KANEKA CORPORATIONInventors: Yoshio Furukawa, Yutaka Kaneda
-
Publication number: 20200148846Abstract: An object of the present invention is to reduce or eliminate a defect (e.g., a void) by achieving (i) a semipreg and a prepreg each of which allows a reduction in residual volatile component and (ii) methods for producing the semipreg and the prepreg, respectively, and consequently to achieve (iii) a fiber-reinforced composite material which has high heat resistance and superior mechanical strength and a (iv) a method for producing the fiber-reinforced composite material. The present invention attains the above object by providing, for example, a semipreg containing: powders of an imide oligomer; and reinforcement fibers, the imide oligomer being represented by a specific general formula (1).Type: ApplicationFiled: March 22, 2018Publication date: May 14, 2020Applicants: KANEKA CORPORATION, JAPAN AEROSPACE EXPLORATION AGENCYInventors: Yoshio FURUKAWA, Takefumi FURUTA, Takeshi CHIBA, Rikio YOKOTA, Yuichi ISHIDA
-
Publication number: 20200001546Abstract: A composite including: (I) a fiber-reinforced composite material; and (II) a metal member joined and fixed to the fiber-reinforced composite material by welding. The fiber-reinforced composite material is composed of reinforcing fibers and a resin composition. The resin composition contains (A) a polypropylene-based resin and (B) a modified polyolefin-based resin. The polypropylene-based resin has a tensile modulus of not less than 1 GPa. The modified polyolefin-based resin is a modified polyolefin resin modified with at least one kind of monomer which is selected from carboxylic acid group-containing vinyl monomers and epoxy group-containing vinyl monomers. A weight ratio between (A) and (B) in the resin composition is 90:10 to 40:60.Type: ApplicationFiled: March 5, 2018Publication date: January 2, 2020Applicant: KANEKA CORPORATIONInventors: Yoshio FURUKAWA, Takahisa IWAHARA, Yasushi NODA, Masanobu URAKAMI
-
Patent number: 10370531Abstract: The present invention relates to a core-shell polymer-containing epoxy resin composition, wherein the composition contains 100 parts by weight of the epoxy resin (A) and 1 to 100 parts by weight of the core-shell polymer (B), the core-shell polymer has the volume average particle diameter of 0.01 to 1 ?m, the core part of the core-shell polymer (B) has the glass transition temperature of less than 0° C., the shell part of the core-shell polymer (B) has the glass transition temperature of less than 25° C., and the shell part of the core-shell polymer (B) is polymerized with at least a monomer having an epoxy group.Type: GrantFiled: October 7, 2014Date of Patent: August 6, 2019Assignee: KANEKA CORPORATIONInventors: Yoshio Furukawa, Shohei Nishimori
-
Patent number: 9765207Abstract: The present invention provides a means for improving the elastic modulus (rigidity), heat resistance, toughness, and impact resistance of a resin to provide these properties in a good balance. The present invention provides a polymer microparticle-dispersed resin composition containing 100 parts by weight of a resin and 0.1 to 150 parts by weight of polymer microparticles each containing at least two layers: a crosslinked polymer layer and a coating polymer layer, the resin composition having a particle dispersity of the polymer microparticles in the resin of not lower than 50%, the crosslinked polymer layer including 50% by weight to 99% by weight of at least one monomer having a Tg, as determined as a homopolymer, of not lower than 0° C., and 50% by weight to 1% by weight of at least one monomer having a Tg, as determined as a homopolymer, of lower than 0° C.Type: GrantFiled: December 28, 2011Date of Patent: September 19, 2017Assignee: KANEKA CORPORATIONInventor: Yoshio Furukawa
-
Patent number: 9701822Abstract: Provided are a toughness modifier for a curable resin which has good dispersibility in a curable resin containing a thermoplastic resin as well as in a cured product formed from a curable resin composition, and also has an excellent toughness-improving effect; and a curable resin composition containing the toughness modifier. The toughness modifier for a curable resin (D) is obtained by emulsion-polymerizing 5 to 50% by mass of a vinyl monomer (B) in the presence of 50 to 95% by mass of a rubber polymer (A) latex (calculated as the rubber polymer component) using 0.5 to 15 parts by mass of a nonionic reactive surfactant (C) (relative to 100 parts by mass of a total of (A) and (B)).Type: GrantFiled: February 5, 2013Date of Patent: July 11, 2017Assignee: KANEKA CORPORATIONInventors: Shuji Taketani, Yoshio Furukawa
-
Publication number: 20160251510Abstract: The present invention relates to a core-shell polymer-containing epoxy resin composition, wherein the composition contains 100 parts by weight of the epoxy resin (A) and 1 to 100 parts by weight of the core-shell polymer (B), the core-shell polymer has the volume average particle diameter of 0.01 to 1 ?m, the core part of the core-shell polymer (B) has the glass transition temperature of less than 0° C., the shell part of the core-shell polymer (B) has the glass transition temperature of less than 25° C., and the shell part of the core-shell polymer (B) is polymerized with at least a monomer having an epoxy group.Type: ApplicationFiled: October 7, 2014Publication date: September 1, 2016Applicant: KANEKA CORPORATIONInventors: Yoshio FURUKAWA, Shohei NISHIMORI
-
Publication number: 20140371350Abstract: Provided are a toughness modifier for a curable resin which has good dispersibility in a curable resin containing a thermoplastic resin as well as in a cured product formed from a curable resin composition, and also has an excellent toughness-improving effect; and a curable resin composition containing the toughness modifier. The toughness modifier for a curable resin (D) is obtained by emulsion-polymerizing 5 to 50% by mass of a vinyl monomer (B) in the presence of 50 to 95% by mass of a rubber polymer (A) latex (calculated as the rubber polymer component) using 0.5 to 15 parts by mass of a nonionic reactive surfactant (C) (relative to 100 parts by mass of a total of (A) and (B)).Type: ApplicationFiled: February 5, 2013Publication date: December 18, 2014Applicant: KANEKA CORPORATIONInventors: Shuji Taketani, Yoshio Furukawa
-
Publication number: 20130310484Abstract: The present invention provides a means for improving the elastic modulus (rigidity), heat resistance, toughness, and impact resistance of a resin to provide these properties in a good balance. The present invention provides a polymer microparticle-dispersed resin composition containing 100 parts by weight of a resin and 0.1 to 150 parts by weight of polymer microparticles each containing at least two layers: a crosslinked polymer layer and a coating polymer layer, the resin composition having a particle dispersity of the polymer microparticles in the resin of not lower than 50%, the crosslinked polymer layer including 50% by weight to 99% by weight of at least one monomer having a Tg, as determined as a homopolymer, of not lower than 0° C., and 50% by weight to 1% by weight of at least one monomer having a Tg, as determined as a homopolymer, of lower than 0° C.Type: ApplicationFiled: December 28, 2011Publication date: November 21, 2013Applicant: KANEKA CORPORATIONInventor: Yoshio Furukawa
-
Publication number: 20070251419Abstract: An epoxy resin composition and an epoxy resin molding material for sealing semiconductor are provided, the epoxy resin molding material containing the epoxy resin composition, the epoxy resin composition and the epoxy resin molding material achieving a good balance among heat resistance, peeling resistance, thermal shock resistance, moisture resistance reliability, and internal-stress relaxation. The present invention relates to an epoxy resin composition (C) for sealing semiconductor includes an epoxy resin (A) and a core-shell polymer (B) containing at least one rubber layer, at least 70% of the core-shell polymer (B) being dispersed in the form of primary particles in a resin phase containing the epoxy resin, and the content of alkali metal ions in the epoxy resin composition (C) being 30 ppm or less. An epoxy resin molding material containing the epoxy resin composition (C) is also provided.Type: ApplicationFiled: August 11, 2005Publication date: November 1, 2007Applicant: Kaneka CorporationInventors: Katsumi Yamaguchi, Nobumasa Nakajima, Yoshio Furukawa
-
Patent number: 7225628Abstract: An ice making machine composed of a water tank for storing an amount of ice making water, an upright ice making plate arranged above the water tank, and a water sprinkler located immediately above the ice making plate to spray ice making water supplied from the water tank to the ice making plate so that the ice making water falls along the ice making plate, in which the ice making water sprayed to the ice making plate during operation at an ice making mode is frozen and formed into ice cubes in the course of falling along the ice making plate.Type: GrantFiled: December 22, 2004Date of Patent: June 5, 2007Assignee: Hoshizaki Denki Kabushiki KaishaInventors: Yoshio Furukawa, Nobuhiko Katou, Tomoyuki Nishio, Yoshikazu Banno, Tomohiro Takagi, Ryoji Morimoto
-
Publication number: 20060283200Abstract: An ice making machine composed of a water tank for storing an amount of ice making water, an upright ice making plate arranged above the water tank, and a water sprinkler located immediately above the ice making plate to spray ice making water supplied from the water tank to the ice making plate so that the ice making water falls along the ice making plate, in which the ice making water sprayed to the ice making plate during operation at an ice making mode is frozen and formed into ice cubes in the course of falling along the ice making plate.Type: ApplicationFiled: December 22, 2004Publication date: December 21, 2006Inventors: Yoshio Furukawa, Nobuhiko Katou, Tomoyuki Nishio, Yoshikazu Banno, Tomohiro Takagi, Ryoji Morimoto