Abstract: According to the present invention, the rotary axis O--O of a grindstone 22 is inclined to the rotary axis P--P of a semiconductor wafer 20 through an angle .theta. in a direction of the tangent line of the semiconductor wafer. Accordingly, a moving direction of abrasive grains of the grindstone 22 is divided into two including a component force A.sub.1 in the grinding direction and a component force A.sub.2 in the perpendicular direction, and these component forces increase the number of acting abrasive grains, so that the accuracy of the chamfering shape and the surface roughness can be improved. According to the present invention, the peripheral edge of the rotating semiconductor wafer is chamfered while the rotating grindstone 22 is reciprocatingly moved along the inclined grinding surface 24, whereby the number of the acting abrasive grains are increased, so that the accuracy of the chamfering shape and the surface roughness can be improved.

Abstract: A slicing machine for slicing an ingot using a rotary blade that maintains the inner peripheral cutting edge of the blade in a highly rigid state. The slicing machine slices the ingot into thin pieces by use of an inner peripheral cutting edge of a doughnut-shaped rotary blade in which an axial force is applied to the blade prior to slicing in order to displace the blade in an axial direction. The inner peripheral cutting edge of the blade is kept rigid and the ingot is sliced accurately. The displacement of the blade is stored and controlled by a control unit.

Abstract: A slicing method includes slicing an ingot by a rotary blade while the inner peripheral cutting edge of the blade is kept in a highly rigid state. A slicing machine slices the ingot into thin pieces by use of an inner peripheral cutting edge of a doughnut-shaped rotary blade, where an axial force is applied to the blade prior to slicing in order to displace the blade in an axial direction. The inner peripheral cutting edge of the blade is kept rigid and the ingot is sliced accurately. The displacement of the blade is stored and controlled by a control unit.