Abstract: A hard disk drive flexure assembly includes a metal substrate having a gap between a root side and a slider side, a base layer and a first conductive layer that each bridges the gap, and a plurality of electrical pads where the pads extend to the slider side of the flexure so as to positionally overlap with a slider end edge and corresponding slider electrical pads. Pre-solder bumps are formed on each pad. This configuration facilitates formation of a functional solder bridge between the flexure and the slider because the melted solder can readily spread on the extended flexure pad surface and reach the slider pad when the pre-solder bump is heated, as the pad material has higher solder wettability than that of a cover layer material. These techniques are especially relevant with narrow, high-density, small pitch electrical pads.

Abstract: Approaches to a flexure gimbal assembly for a hard-disk drive (HDD), having a feature for reducing the risk of electrical shorts, include a flexure having an electrically conductive layer and an insulating layer having a flexure tongue with which one or more microactuator piezo actuating device is coupled, where the flexure tongue comprises a gap positioned to inhibit contact between the conductive adhesive and the conductive layer of the flexure which may otherwise cause an electrical short.

Abstract: Approaches to a flexure gimbal assembly for a hard-disk drive (HDD), having a feature for reducing the risk of electrical shorts, include a flexure having an electrically conductive layer and an insulating layer having a flexure tongue with which one or more microactuator piezo actuating device is coupled, where the flexure tongue comprises a gap positioned to inhibit contact between the conductive adhesive and the conductive layer of the flexure which may otherwise cause an electrical short.

Abstract: A head gimbal assembly having a stage fixed to a head-slider. A piezoelectric element which comprises; an upper surface, a first side surface, a second side surface, a lower surface, a first electrode, a second electrode, and a gap between the first and second electrodes on the lower surface, the piezoelectric element moving the stage by extension or contraction thereof according to a voltage applied to the first and second electrodes. A transmission wiring part which has a connection pad for the piezoelectric element. A cross-connector for physically and electrically cross-connecting the first electrode and the connection pad. An adhesive fixing part which is formed from an insulating adhesive and adhesively fixes the lower surface of the piezoelectric element to the transmission wiring part, between an end of the second electrode at the gap and the cross-connector.

Abstract: An apparatus for detaching a head slider bonded onto a mounting plate of a suspension includes a platform on which a head gimbal assembly is mounted; a heating device for heating a joint section between the head slider and the suspension to decrease the bonding force; a latching part for latching the mounting plate at a position on a center line of the mounting plate in the lengthwise direction and/or at positions symmetric about the center line; and a clamp device for moving the head slider in a direction along the center line with the heating to detach the head slider from the mounting plate.

Abstract: Embodiments of the present invention provide a highly reliable hard disk drive (HDD). In an HDD according to an embodiment of the present invention, solder at a solder joint for joining a pad of a head slider and a pad of a transmission wiring comprises the main component of Sn and atomic percent to atomic percent of indium. The solder exhibits the ? phase within the range of ?150° C. to 120° C. Accordingly, even if the HDD is left at a low temperature for a long time, the solder joint is not broken.

Abstract: A head gimbal assembly having a stage fixed to a head-slider. A piezoelectric element which comprises; an upper surface, a first side surface, a second side surface, a lower surface, a first electrode, a second electrode, and a gap between the first and second electrodes on the lower surface, the piezoelectric element moving the stage by extension or contraction thereof according to a voltage applied to the first and second electrodes. A transmission wiring part which has a connection pad for the piezoelectric element. A cross-connector for physically and electrically cross-connecting the first electrode and the connection pad. An adhesive fixing part which is formed from an insulating adhesive and adhesively fixes the lower surface of the piezoelectric element to the transmission wiring part, between an end of the second electrode at the gap and the cross-connector.

Abstract: A magnetic head assembly in which a slider can be removed with deformation of a suspension suppressed and the posture angle of a magnetic head can be maintained stably and a magnetic disk drive mounted with the magnetic head assembly. A head gimbal assembly (HGA) according to an embodiment includes a suspension, a magnetic head slider provided with a magnetic head element section, and a gimbal retaining the slider and connected to the suspension. The gimbal includes a spacer formed around a conductive adhesive application area. A nonconductive adhesive application area having a planar dimension not larger than that of the conductive adhesive application area is formed outside the spacer. The gimbal and the slider are brought into conduction through a conductive adhesive applied to the conductive adhesive application area and are adhered to each other with a nonconductive adhesive applied to the nonconductive adhesive application area.

Abstract: Embodiments of the present invention provide a head gimbal assembly manufacturing method which can attach another magnetic head slider to a suspension to be reused without addition of solder. According to one embodiment of the present invention, a head gimbal assembly (HGA) is attached to a jig. Both sides of a portion close to the rear end of a magnetic head slider are gripped with hot tweezers heated at about 200° C. They are heated for about four seconds while applying force in a direction of peeling off the magnetic head slider from gimbals, thus removing the magnetic head slider from the gimbals. When another magnetic head slider is attached to the suspension, an adhesive adhered to the gimbals is removed and another adhesive is applied to the gimbals. The back of another magnetic head slider is pressed to the adhesive, whereby the magnetic head slider is fixed to the gimbals. Next, the solder fillet left on the gimbals is irradiated with laser beams to be melted and joined to an electric terminal.

Abstract: Embodiments of the invention provide techniques to prevent, when a bonding pad and a lead wiring pad are to be connected using a solder ball, the solder ball from deviating from a centerline and a soldering problem from occurring. In one embodiment, a head suspension assembly includes a solder ball disposed between a lead wiring pad provided for a flexure and a bonding pad provided for a slider. The solder ball is then melted for making a soldered joint between the lead wiring pad and the bonding pad. A through slot is provided at a position near a centerline on a front surface of the lead wiring pad. The solder ball is dropped into the through slot by gravity from the front surface of the lead wiring pad. A contact area in contact with the solder ball is thereby secured on a side of the slider.

Abstract: Embodiments of the present invention provide a highly reliable hard disk drive (HDD). In an HDD according to an embodiment of the present invention, solder at a solder joint for joining a pad of a head slider and a pad of a transmission wiring comprises the main component of Sn and atomic percent to atomic percent of indium. The solder exhibits they phase within the range of ?150° C. to 120° C. Accordingly, even if the HDD is left at a low temperature for a long time, the solder joint is not broken.

Abstract: Embodiments of the invention correct the static attitude of a head gimbal assembly (HGA) with high accuracy. In one embodiment, a vector group that constitutes the shortest path from the initial attitude of the HGA to the final anticipatory attitude is formed. The vector group is formed of the plural displacement vectors that give a variety of variations in static attitude when unit shots of laser light are performed on the HGA. Displacement vectors are synthesized while the displacement vectors each giving the anticipatory attitude closest to a target attitude are being selected in order from the initial attitude, toward the target attitude. Unit shots equivalent to the number of displacement vectors are performed on irradiating positions related to the displacement vectors included in the vector group. The static attitude existing after the unit shots is measured, then the displacement vectors are corrected, and a vector group constituting the new shortest path is formed.

Abstract: Embodiments of the present invention help to prevent deformation of a gimbal in detaching a head slider from a suspension. In an embodiment of the present invention, after a head slider has been mounted on a suspension, a test on the assembly is conducted. If a defect head slider is found in the test, the head slider is detached from the suspension. The head slider is discarded but the suspension is reused and a new head slider is mounted on the suspension. In detaching the head slider, a pin inserted in a through-hole on the center line of a gimbal tongue latches the gimbal tongue.

Abstract: Embodiments of the invention relate to making reconnection when a soldered connection fails in a head/slider used in a magnetic disk drive. In one embodiment, a solder mass deposited on a slider pad of a head/slider is separated from a lead pad and a solder ball connection is yet to be made between the slider pad and the lead pad. A shaping tip is heated to a temperature near a melting point of a solder. The shaping tip is moved in parallel with a surface of the slider pad toward the side of the lead pad to soften the solder mass. The solder mass is thereafter irradiated with a laser beam so as to form a solder fillet, thereby making a soldered connection between the lead pad and the slider pad.

Abstract: Embodiments of the invention provide a head/slider supporting structure which has connection properties excellent in solder ball connections of a slider pad and a lead pad. According to one embodiment, in a head/slider supporting structure for connecting a slider and a lead wire by re-flowing a solder ball, a connection distance between a slider pad and an extreme end portion of the lead wire is reduced to enhance the performance of solder connection. The lead wire is inclined forwardly of the slider pad.

Abstract: Embodiments of the invention provide a head gimbal assembly (HGA) capable of effecting solder ball connection with use of low energy. In one embodiment, the HGA includes a head/slider. In the head/slider, slider pads and lead wire pads are connected to each other by reflow of solder balls under the radiation of a laser beam. Lead layers are connected to a magnetic head and electrode studs are connected to the lead layers, respectively, and are also connected to the slider pads. The diameter R (m) of a solder ball and a sectional area S (m2) of an electrode stud are in a relation of R2?4S.

Abstract: A method of assembling a head gimbal assembly. The method comprises a series of steps which include: stacking a base plate, a load beam, and a flexure to form a three-layered stacked series with at least a bottom layer being a base plate series; joining portions of the load beam to the base plate, and the flexure to the load beam in the three-layered stacked series to make a suspension section; attaching a slider to the flexure in the suspension section to make a head gimbal assembly; load-bending a hinge portion formed in the head gimbal assembly; and heating the hinge portion in order to adjust a bending load on the hinge portion at a predetermined bending angle to a predetermined value.

Abstract: Embodiments of the present invention provide a head gimbal assembly manufacturing method which can attach another magnetic head slider to a suspension to be reused without addition of solder. According to one embodiment of the present invention, a head gimbal assembly (HGA) is attached to a jig. Both sides of a portion close to the rear end of a magnetic head slider are gripped with hot tweezers heated at about 200° C. They are heated for about four seconds while applying force in a direction of peeling off the magnetic head slider from gimbals, thus removing the magnetic head slider from the gimbals. When another magnetic head slider is attached to the suspension, an adhesive adhered to the gimbals is removed and another adhesive is applied to the gimbals. The back of another magnetic head slider is pressed to the adhesive, whereby the magnetic head slider is fixed to the gimbals. Next, the solder fillet left on the gimbals is irradiated with laser beams to be melted and joined to an electric terminal.

Abstract: Embodiments in accordance with the present invention provide a magnetic head assembly in which a slider can be removed with deformation of a suspension suppressed and the posture angle of a magnetic head can be maintained stably, and a magnetic disk drive mounted with the magnetic head assembly. A head gimbal assembly (HGA) according to an embodiment includes a suspension, a magnetic head slider provided with a magnetic head element section, and gimbal retaining the slider and connected to the suspension. The gimbal includes a spacer formed around a conductive adhesive application area. A nonconductive adhesive application area having a planar dimension not larger than that of the conductive adhesive application area is formed outside the slider. The gimbal and the slider are brought into conduction through a conductive adhesive applied to the conductive adhesive application area and are adhered to each other with a nonconductive adhesive applied to the nonconductive adhesive application area.

Abstract: A base plate and load beam for an HG assembly are formed in series, stacked, and transferred by a transfer system in the form of the stacked-layer series to undergo the necessary assembly processes such as layer joining, slider attachment, and electrical connections between the terminals thereon. When uncompleted HG assemblies are transferred for each of the manufacturing processes, the uncompleted HG assembly is mounted on the assembly jig such as a tray or a block for transference. For this reason, assembling jigs, the number of which is at least equal to the number of the uncompleted HG assemblies remaining at the respective assembly processes would be needed. Accordingly, the efficiency of work space is reduced, and a rise in manufacturing cost is brought about by the need for the assembling jigs.